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files
说明： 二分法算法文件，龙格库塔法，高斯法，数值计算二分法求解，适用于初学数值计算人群(Dichotomy algorithm file)
- 2020-04-20 20:10:55下载
- 积分：1
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EXERCISE_3_2
比较JPLDE405的切比雪夫系数导出的位置与低精度月球坐标分析。(Comparative Analysis of JPL DE405 cut Chebyshev coefficients derived position with low accuracy lunar coordinates.)
- 2020-11-11 13:29:46下载
- 积分：1
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CCmethod2
说明： 应用改进的CC法求取时间延迟和嵌入维数，效果不错(The modified CC method to strike a time delay and embedding dimension, good results)
- 2009-08-27 12:29:13下载
- 积分：1
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fmincon
求解非线性方程。调用格式x=fmincon（fun，x0,A,b,Aeq,beq,VLB,VUB)(For solving nonlinear equations. Call the format x = fmincon (fun, x0, A, b, Aeq, beq, VLB, VUB))
- 2009-09-06 13:18:25下载
- 积分：1
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Prj1_exp2
计算等径双圆筒透镜的场分布，并画出等位线分布图(Calculation of Electron Physics )
- 2020-10-14 19:27:30下载
- 积分：1
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zuiyouhua
此源码包是我本学期最优化理论课程的大作业，其中包括了我自己写的以下常用最优化算法的实现代码：最速下降法，牛顿法，非线性最小二乘法，DFP法。fun1，fun2是两个测试函数。谢谢！(This is my source packages optimization theory this semester courses in large operations, including my own to write the following commonly used optimization algorithm code: steepest descent method, Newton method, nonlinear least squares method, DFP method. fun1, fun2 are two test function. Thanks!)
- 2009-01-31 13:36:29下载
- 积分：1
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isaacsrc.4_2.tar
ISAAC采用多块网格技术求解二维或三维的Euler或者NS方程，并且提供了大量的湍流模型供使用，为相关研究人员提供了很好的参考。(ISAAC solves 2D or 3D Euler or NS equatioon based on a multiblock grid technique, also lots of turbulence models is included in the code. ISAAC provides a good reference for relative researches.)
- 2009-11-17 10:05:26下载
- 积分：1
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1bjdj
mumford source code........
- 2009-09-26 17:59:21下载
- 积分：1
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jokdr
由散点插值生成等值线,并且提供颜色选择工具,共有三种插值方法(Generating isolines from scattered interpolation and providing a color selection tool, there are three interpolation methods)
- 2018-11-21 16:03:28下载
- 积分：1
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zhaomingdagonglvfaguanerjiguan
根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电
银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) .
采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选
择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)
- 2012-10-25 13:22:30下载
- 积分：1
