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Cp
说明： 1.5MW风力机叶片功率系数Cp计算程序示例，采用梯形法数值积分计算(1.5MW wind turbine blade power coefficient the Cp calculation program examples, numerical integration using the trapezoidal method)
- 2012-10-22 20:36:32下载
- 积分：1
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Bayesian.Classifier
贝叶斯分类实验 模式识别课程实验所用的源程序(Bayesian classifier experimental pattern recognition programs used in the experimental program)
- 2007-05-26 16:05:05下载
- 积分：1
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Dchaos-predica
基于混沌理论进行数据预测的程序，欢欢迎需要的朋友参考下载，并提出修改意见
(, Please feel welcome the reference to a friend download data to predict the process based on chaos theory, and suggest modifications)
- 2012-07-27 12:40:49下载
- 积分：1
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d9000mpi3
对互谱法被动测距的原理及算法各个环节进行仿真验证：加权最小二乘估计中权系数的选取；相关窗长度的选取；各频段综合方法等等。最后实现了对9000m—15000m距离的测距(Cross-spectral method for passive ranging all aspects of theory and algorithms for simulation: weighted least squares estimation of the right of the selection coefficient related to the length of the selection window an integrated approach to the various bands and so on. Finally realize the right of ranging from 9000m-15000m)
- 2009-10-06 17:04:05下载
- 积分：1
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EKF
基于AOA的室外雷达定位算法仿真，基于TDOA的室外雷达定位算法仿真，基于AOA doa的室外雷达定位算法仿真，三维(Simulation of outdoor radar location algorithm based on AOA, simulation of outdoor radar location algorithm based on TDOA, simulation of outdoor radar location algorithm based on AOA TDOA, 3d)
- 2019-05-16 09:50:00下载
- 积分：1
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maze
关于走迷宫算法的实现程序，完全采用C++语言实现，可以运行(Maze algorithm program, fully C++ language, you can run)
- 2012-07-31 22:21:04下载
- 积分：1
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mul
实现有限域中乘法，输入二个普通二级制数，输出在本原多项式的乘法结果(Achieve limited multiplication field, enter the number of two-tier system of two ordinary output in primitive polynomial multiplication results)
- 2014-01-12 22:52:38下载
- 积分：1
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VLM
涡格法进行无人机的设计，升力系数，阻力系数，力矩系数等等，美过圣母大学的设计辅助软件(VLM)
- 2010-11-26 21:10:51下载
- 积分：1
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Sola
Fortran编写的VOF经典算法，SOLA-VOF(VOF classical algorithms written in Fortran, SOLA-VOF)
- 2021-01-17 23:38:48下载
- 积分：1
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zhaomingdagonglvfaguanerjiguan
根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电
银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) .
采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选
择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)
- 2012-10-25 13:22:30下载
- 积分：1
