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1dCNN 用于分类 cnn_gear_raw
说明： 1dCNN 用于分类，使用一维的CNN，和相应的一维数据输入和卷积核，对一维信号数据进行处理(use 1dCNN for fault classification)
- 2021-01-13 19:58:49下载
- 积分：1
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IEEECForm121302pdf_1
Describe: Then a voice feature extraction procedures source, in addition to containing matrix and vector operations, it also includes many voice feature extraction algorithm, including : Formant (formant) extraction
- 2010-12-07 08:49:26下载
- 积分：1
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just-for-fun_en
说明： Deep understanding of C + + memory management mechanism, recommended by old programmers
- 2019-10-30 19:23:53下载
- 积分：1
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全国所有地图.part3
全国各省各县区域shp文件，含有中国所有省，所有地区，非常全(Shp files in all provinces and counties across the country, including all provinces in China, all regions, very full)
- 2020-06-30 10:40:02下载
- 积分：1
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辛普森正交复数的常用算法是一种常见的集成我…
复化Simpson求积分，常用算法中很常用的一种积分方法-Complex of Simpson quadrature commonly used algorithm is a common integration method
- 2022-05-25 01:44:50下载
- 积分：1
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SOM算法写的java
用Java写的SOM,采用eclipse开发环境-SOM algorithm writing in Java
- 2023-04-27 10:40:03下载
- 积分：1
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09DesingPattern
基于图像处理的QR码解码技术，并对QR码解码算法进行详细设计与改进(QR decoding technology based on image processing and detailed design and improvement of QR decoding algorithm)
- 2019-05-16 20:39:37下载
- 积分：1
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suduGame
求解数独，根据递归唯一余数法和摒除法求解，如果无法解决在递归假设法求解。(Solving Sudoku is based on recursive unique residue method and elimination method, if it can not be solved by recursive hypothesis method.)
- 2019-01-24 15:14:50下载
- 积分：1
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工厂方法-计算器
说明： prototype design pattern implmentation
- 2020-06-24 19:40:01下载
- 积分：1
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we
说明： 】《微电子制造科学原理与工程技术》（第二版），作者：（美）Stephen A.Campbell。本书系统地介绍了微电子制造科学原理与工程技术，覆盖了集成电路制造所涉及的所有基本单项工艺，包括光刻、等离子体和反应离子刻蚀、离子注入、扩散、氧化、蒸发、气相外延生长、溅射和化学气相淀积等。对每一种单项工艺，不仅介绍了它的物理和化学原理，还描述了用于集成电路制造的工艺设备(】 " Microelectronics manufacturing science and engineering principles" (second edition), on: (United States) Stephen A. Campbell. This book introduces the principles of microelectronics manufacturing science and engineering technology, IC manufacturing involves covering all the basic individual techniques, including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, gas epitaxial growth, sputtering and chemical vapor deposition, etc.. For each individual process, not only describes its physical and chemical principles, but also describes the process used in integrated circuit manufacturing equipment)
- 2010-04-06 19:42:44下载
- 积分：1
