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- 2020-12-10下载
- 积分：1
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自动驾驶系列报告一---综合篇
自动驾驶产业格局、自动驾驶解决方案、自动驾驶芯片、传感器、车联网国金证券SINOLINKSECURITIES行业深度研究图表年加州报告披露路测成绩图表:与克莱斯勒合作车辆及其硬件系统图表发展历程图表:百度平台技术框架图表:百度计划成员单位图表:百度划成员单位图表:百度十划成员单位(按产业链分部分)图表:特斯拉功能图表:奧迪自动驾驶传感器系统图表:特斯拉奥迪图表:自动驾驶芯片主要产品性能图表:未来专用计算平台将成为主流图表系列图表计算平台图表:地平线“征程”自动驾驶芯片图表:各类传感器特点图表:激光雷达原理图表:激光雷达效果图表:激光雷达优缺点图表产品信息图表:新128线激光雷达图表激光雷达芯片图表激光雷达生产线图表:国内主要激光雷达产品信息图表调制亳米波雷达原理图表:毫米波需达类别图表:毫米波雷达优缺点图表:行易道毫米波雷达参数图表:承泰科技毫米波雷达应用图表:苏州豪米波产品基本信息图表:纳雷科技产品基本信息图表:摄像头优缺点图表:车载摄像头产业链图表年全球市场占比图表:舜宇光学车载镜头出货量图表:舜宇光学车载镜头出货量增长率图表:舜宇光学年出货量图表:欧菲科技智能汽车业务收入图表:车联网的应用敬请参阅最后一页特别声明国金证券SINOLINKSECURITIES行业深度研究图表:车联网供应链架构图表:车联网发展趋势图表:我国车联网市场规模(亿美元)图表:三旗通信车联网产品图表:三旗通信合作伙伴图表:英卡科技服务结构图图表系列无线数据记录仪图表卫星定位汽车行驶记录仪图表系统图表系统图表:四维图新“趣驾”系统图表在车联网构架上是核心环节图表:奔驰年新一代车载信息终端系统图表系统的盈利模式图表系统总附加值拆解图表:全球从事系统主要企业图表:国外主要汽车企业所用的系统图表:国内从事系统主要企业图表:国内主要汽车企业所用的系统图表前装和后装市场规模测算(亿元)图表:公司系统分类及主营产品图表:驾驶员控制系统图表:智能车联电子系统图表:华阳集团产品图表:车载信息娱乐系统图表:显示模组与系统图表:高精地图与普通导航电子地图的区别图表:高精地图与普通导航电子地图的区别图表:高精地图头部厂商情况敬请参阅最后一页特别声明国金证券SINOLINKSECURITIES行业深度研究、总论:自动驾驶与电动化、共享化改变汽车产业格局和出行方式意义:与汽车电动化、共享化的趋势结合自动驾驶与汽车电动化、共享化的趋势结合。相比与传统的汽车行业,电动车在系统控制与执行层面更适合自动驾驶,而自动驾驶与车联网的结合、汽车共享化的趋势,能够有效的预防交通事故、同时减少拥堵、提高道路的通行效率,使其容纳不断上升的通流量。未来的出行方式以及汽车本身都将会有很大的变化,由此带来巨大的新兴市场。美国年轻人首次申领驾照人数比例持续下降,自年起,美国肯年群体(岁)驾照持有人数几乎以每年递减;岁各年龄层的驾照持有率均出现了下降,以岁为例,年持有驾照的人数比例下降近;反怏出了即使是美囯这样车轮子上的国家,年轻人不再那么迫切的去考鸳照,共享出行已经可以满足出行需求。图表:美国年轻人首次中领驾照人数比例持续下摩岁有驾照人数来源:匡金证券研究所年美国市场售出万辆二手车(历史最大值),其中即近万人将成为“无车一族”,不再选择买新车而是选择使用以及公共交通解决通勤,也反映出美国市场对于共享出行方式的认可。图表:美国二手车卖家卖车后的选择选择UberLyftt等叫车软件9%其他或不确定,14%买了另辆车或还有一辆车77%来源:路透社,囯金证券研究所敬请参阅最后一页特别声明国金证券SINOLINKSECURITIES行业深度研究我国市场接受度更高。我国市场对于汽车电动化、共享化以及自动化的接受度更高,产业投入更大,预计年自动驾驶的汽车会占据整体出行里程的以上,由此带来的千亿美元规模的新兴市场有待开发。图表:我因出行方式里程比100%90%80%70%60%50%40%30%20%10%0%20172018201920202021202220232024202520262027202820292030自驾私家车自动私家车自驾共享车辆自动共享车辆来源:因会证券研究所分级:人类驾驶逐级步入车辆自动驾驶自动驾驶定义ε即让汽车自己拥有环境感知、路径规划并自主实现车辆控制的技术,也就是用电子技术控制汽车进行的仿人驾驶或是自动驾驶。根据人与车辆控制的程度不同,美国汽车工程师协会界定了五级自动驾驶方業,目前在基础上,到级刑的自动驾驶将迳渐成为新车型的标配产生大量新增需求,这是目前主要的投资机会到的完全自动驾驶也在逐渐成熟中,一旦商业化将影响产业的未来。敬请参阅最后一页特别声明国金证券SINOLINKSECURITIES行业深度研究图表;美国汽车工程师加会自动驾分级Execution ofFallbackManitoringSystemSAElevelNameNarrative DefinitionAcceleration/ of Driving, of Dynamic(DrivingDecelerationEnvironment Driving Task Modes)Human driver monitors the driving environmentNothe full-time per formance by the human driver of allAutomation aspects of the dynamic driving task, even when enhanced Human driver Human driver Human driverthe driving mode-specific execution by a driver assistancestem of either steering or acceleration/deceleration using Human drver Human driver Human driver some drivingAssistance information about the driving environment and with theand systemmodesaspects of the dynamic ariving taskthe driving mode-specific execution by one or more driverassistance systems of both steering and acceleration/Partial decelerat on using information about the drivingAutomation environment and with the expectation that the humanSystem Human driver Human driverSome drivingmodesdriver perform all remaining aspects of the dynamic arivingtaskAutomated driving system("system")monitors the driving environmentthe driving mode-specific performance by an automated3Conditional driving system of all aspects of the dynamic driving tasksystemHuman driver Some drivingAutomation with the expectation that the human driver will respondmodesappropr iately to a request to intervenethe driving mode-specific performance by an automa: edHigh driving system of all aspects of the dynamic driving task,SystemSystemSystemSome drivingAutomation even if a human driver does not respond appropriately to amodesequest to intervenethe full-time performance by an automated driving system5Fullof all aspects of the dynamic driving task under all roadwaySystemAll drivingAutomation and environmental conditions that can be managed by amodeshuman drver国金证券研究所代表没有自动驾驶介入的传统人类驾驶。级能够对方向盘和加减速中的单项操作给与支持。比如已经广泛应用的自适应巡航()功能,即能够通过雷达探测与前车的实时距离自动控制加减速,从而保持与前车的安全距离。级能够同时对方向盘和加减速中的多项操作给与支持。如果汽车除了具备上面级描述中的自造应巡航外,同时还具备车道保持()功能,或者自动变道功能,那则属于级自动驾驶级之前环境的观察者都是人,进入则意味着道路环境的观察和驾驶操作都由系统来完成,人只需要对所有的系统请求进行应答。系统已经完全能够识別出直线、弯道、红绿灯、限速路牌,路上行走奔跑的人猫狗等等各种环境变量。环境观察和驾駛操作都由系统来完成,人只需要对所有的系统请求进行应答。比如突然下雨了,检测到地面湿滑是否需要减速;比如裣测到前方车辆行驶过慢是否需要超车;检测到前方有人在车道较近处走动是否需要呜笛提醒等等,这些请求系统会反馈给驾驶员,由人来做决定。级驾驶操作和环境观察仍然都由系统完成,人只需要在某些复杂情况进行应答。比如只需要在某些复杂地形或者天气恶劣的情况时,才需要人对系统请求做出决策,而其他情况下系统能独自应付自动驾驶。级就是完全的自动驾驶状态,车上没有方向盘,没有刹车,没有油门,完全不需要人的介入。敬请参阅最后一页特别声明国金证券SINOLINKSECURITIES行业深度研究图表;人类驾欤逐级步入车辆自动驾驶HumanMachineLEVEL OLEVELTLEVEL 2VEL4LEVEL 5No driverAwarenessInterventionLongitudinal orTrafficfor Take OverNo ActiveTransverseControlAssistanceulaeNo DriverNo Take OverystemLongitudinalTake OverRequestLongitudinal orRequestTransverseand TransverseGuideGuideHands onHands onHands Temp offHands offHands offHands offEyes onEyes Onyes Temp ofEyes offMind offDriver C仟fIiWAutobahn(SA)City(Ride Sharing)来源国金诬券研究所实现:通过决策层、感知层、执行层■自动驾驶系统通常可分为决策层、感知层、执行层,以及高精地图和车联网的支持图表:自动驾狄实现层级自动车联网驾驶云端地图中控制器车端C|D感知层执行层摄像头转向制动动力雷达芯片模块来源:国金证桊研究所感知层:环境信息和车内信息的采集与处理。这方面涉及到道路边界检测、车辆检测、行人检测等技术,即传感器技术,所用到的传感器一般都会有敬请参阅最后一页特别声明国金证券SINOLINKSECURITIES行业深度研究激光雷达、摄像头、毫米波雷达、超声波雪达、速度和加速庋传感器等等由于各个传感器在设计的时候有各自的局限性,总个传感器满足不了各种工况下的精确感知,想要车辆在各砷环境下平稳运行,就需要运用到多传感器融合技术,该技术也是环境感知这一大类技术的关键技术所在,目前国内这方面和国外的主要差距也集中在多传感器融合方面。决策层:依据获取的信息来进行决策判断,确定适当工作模型制定相应控制策略,替代人类做出驾驶决策。这部分的功能类似于给车辆下达相应的任务,例如在车道保持、车道偏高预警、车距保持,障碍物警告等系统中需要预测本车与其他车辆、车道、行人等在未来一段时间内的状态,先进的决策理论包括模糊推理、强化学习、神经网络和贝叶斯网络技术等。由于人类驾驶过程中所面临的路况与场景多种多样,且不同人对不同情况所做出的驾驶策略应对乜有所不同。因此驾驶决策算法的优化需要非常完善高效的人工智能模型以及大量的有效数据。这些数据需要尽可能的覆盖到各种罕见的路况,而这也是驾驶决策发展的最大瓶颈所在执行层:指系统在做出决策后,替代人类对车辆进行控制,反馈到底层模块执行任务。车辆的各个操控系统都需要能够通过总线与决策系统相链接并能够按照决策系统发岀的总线指令精确地控制加速程度,制动程度以及转向幅度等驾驶动作。高精地图以及车联网的支持,系统能够确定位置并规划一条可通行的路径实现智能车辆的自主导航;更进一步,车联网的应用一方面能够是出行更加方便智能,另一方面又能够护展汽车交通工具的属性,成为未来个人的移动平台。相关公司图表:自动驾驶相关公司公司名称代码收盘价业务索菱股份自动驾驶系统兴民智通、自动驾驶系统德赛西威、人机交互均胜电子人机交互系统华阳集团数字仪表东软集闭自动驾驶系统路畅科技自动驾驶系统巨星科技激光雷达中海达激光雷达华域汽车毫米波雷达舜宇光学车载摄像头欧菲科技车载摄像头四维图新高精度地图亚太股份自动驾驶制动系统耐世特自动驾驶转向系统金龙汽车整车来源:国佥证券研究所敬请参阅最后一页特别声明国金证券SINOLINKSECURITIES行业深度研究二、自动驾驶解决方案:整车厂和科技巨头蓄势待发厂商:投入巨大、成果显著传统整车厂如奧迪、特斯拉、通用、丰田、福特等公司均有自己的自动驾驶研发团队,在自动驾驶领域投入巨大,成果显著,如奧迪级自动驾駛系统已经量产上市。图表:厂商进展情况系统路径进展测试车队奥迪和并行级量产上市禾取摄像头毫米波雷达方案,目前年型具备能力,有万辆特斯拉白至能够传回驾驶数据,有大量驾驶里栏。马斯克最近宣布,覆盖各类驾驶场景的完全自动驾驶将在年年末到来通用和并行将生产数千辆自动驾驶汽车,用于出租车服务:亿美辆雪佛兰元收购亿美元入股直接年首先将自动驾驶车投入招车服务,亿美金收购辆沃尔沃丰田和并行己实现,车型正在测试,年实现完全无人驾驶能力亿关金收购,战略投资,拥有庞大福特直接自动驾驶测试车队,年自动驾驶汽年上路,用于共享出行,年辆年销售私人客户来源:公开資料、国金证桊研究所系统厂商:小联盟百度大联盟能够提供自动驾驶解决方案的系统厂商,目前以谷歌的和百度的为代表,图表:系统厂商进展情况系统路径进展测试车队年即起步,年组建年与克菜斯勒合作的放(谷歌直接无人驾驶车上市,预计年投入运营。已积累英里,每英里需人工干预次,遥遥领先竞争对手克菜斯勒,辆年成立自动驾驶事业部,年自动驾驶事业群组,李彦宏(百度)为主,支持宣布年小规模生产自动驾驶小巴车年大规模量产自动驾欤汽车测试年月进行深圳实地路测;此前进行了硅谷雨夜的路测。结果显示均较好。来源:公开资料、国金证券研究所■谷歌母公司旗下独立的专注自动驾驶系统开发的子公司。谷歌自年起启动自动驾驶项日,年成立独立实体图表发展历程时间开发进展年启动自动驾驶汽车项日,成立自动驾驶汽车团队,大范围采集街景数据,构建地图数据库年经由《纽约时报》,正式对外公布正在研发全自动驾驶汽车及以上年获得加州机动车管理局〈)颁布的自动驾驶汽车路测许可年正弌开始复杂情况下的城市道路实测年。设计(萤火虫)原型车并进行系列改装年公司重组为,开始和汽车制造商合作,不再亲自制造汽车本身年成立专注研究并商业化自动骂驶技术的独立实体公司年拿到美国高速公路安全管逗局(〕的认定文件,开启真人乘车试验年在亚利桑那州拿到美国首个商业自动驾驶打车服务执照来源:公司官网,国金证券研究所敬请参阅最后一页特别声明
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PCI Specification 3.0_PCI 3.0 规范
PCI 3.0 规范,英文原版。PCI Local Bus Specification Revision 3.0PCI LOCAL BUS SPECIFICATION, REV.3.0ContentsPREFACESPECIFICATION.……13INCORPORATION OF ENGINEERING CHANGE NOTICES (ECNS)1查音音鲁垂音音13DOCUMENT CONVENTIONS.………14l. INTRODUCTION…151.1. SPECIFICATION CONTENTS······151.2. MOTIVATION……151.3. PCI LOCAL BUS APPLICATIONS1. 4. PCI LOCAL BUS OVERVIEW171.5. PCI LOCAL BUS FEATURES AND BENEFITS……181. 6. ADMINISTRATION…………………202. SIGNAL DEFINITION m...mn.. 212.1 SIGNAL TYPE DEFINITION222.2. PIN FUNCTIONAL GROUPS..…………222.2.1. System Pins……,…,…,,…,…232.2.2. Address and data pins242.2.3. Interface Control Pins........................252.2.4. Arbitration Pins(Bus Masters Only)272.2.5. Error Reporting Pins....垂看d。普音看鲁D指音着音,。音音自。音音音。音自垂272.2.6. Interrupt Pins( Optional)……282.2.7. Additional signals312.2.8.64- Bit bus extension pins( Optiona)…,,……………………………332.2.9. TAG/Boundary scan Pins(Optional).......342. 10. System Management Bus Interface Pins(Optional)352. 3. SIDEBAND SIGNALS362. 4. CENTRAL RESOURCE FUNCTIONS.····:·····.·············363. BUS OPERATION373.1 BUS COMMANDS373.1. Command definition373. 1.2. Command Usage rules393.2. PCI PROTOCOL FUNDAMENTALS423.2.1. Basic Transfer Control····:············.················433.2.2. Addressing.............143.2.3. Byle lane and Byte enable usage……563.2.4. Bus Driving and Turnaround非音垂垂·非573.2.5. Transaction Ordering and posting….583. 2.6. Combining Merging, and Collapsing。。音垂。音62PCI LOCAL BUS SPECIFICATION, REV.3.03.3. BUS TRANSACTIONS……643.3.1. Read transaction……………653.3.2. Write transaction3.3.3. Transaction termination.………….673.4. ARBItRAtION音垂3.4.1. Arbitration Signaling protoco1..…………………893.4.2. Fast Back-to-Back Transactions. .........................................................93.4.3. Arbitration Parking………………………………………93.5 LATENCY953.5.1. Target Latency…….953.5.2. Master Data latency……….….…….,….….…..……..….,983.5.3. Memory Write Maximum Completion Time limit3.5.4. Arbitration Latency3.6. OTHER BUS OPERATIONS……·。垂,音着垂。着音D。。着。D音着音垂。音着D音非非音垂音非·非1103.6.1. Device selection…....…,103.6.2. Special cycle...........3.6.3. IDSEL Stepping…………,,…,…,,…,,…,,,,,………,…1133.6.4. Interrupt acknowledg3.7. ERROR FUNCTIONS春音·。音垂1153.7.. Parity ger1153.7.2. Parity Checking...........………,163.7.3. Address parity errors…...…,…163.7.4.Error Reporting…17173.7.5. Delayed Transactions and Data Parity Errors.......... 203.7.6. Error Recovery.............,213. 8. 64-BIT BUS EXTENSION1233.8.1. Determining bus Width during System initialization.…….…,1263.9.64- BIT ADDRESSING…..…………………………………………1273.10SPECIAL DESIGN CONSIDERATIONS.1304. ELECTRICAL SPECIFICATION.. m.m.9.1374.1. OVERVIEW…1374.1.1. Transition Road Map……1374.1.2. Dynamic vs Static Drive specificalion…1384.2. COMPONENT SPECIFICATION.……,………………,1…………………1394.2.1. 5V Signaling environment1404.2.2. 33V Signaling environment鲁鲁·垂垂1464.2.3. Timing specification1504.2.4.1determinate Inputs and metastable作,…………1554.2.5. Vendor provided specification..,..…,.…………….………17564.2.6. Pinout recommendation157PCI LOCAL BUS SPECIFICATION. REV.3.04.3. SYSTEM BOARD SPECIFICATION.………1584.3.1. Clock skew,…………………1584.3.2.R··1584.3.3. Pull-ups:····.················:·····…1614.3.4Power1634.3.5. System Timing Budget. ...........1644.3.6. Physical requirements............………674.3.7. Connector Pin assignments……/6844. ADD-IN CARD SPECIFICATION1714.4.1.Add- in Card Pin Assignment..,.,.,………………,1714.4.2. Power Requirements….,.,.,.,.,.,.,,.….,764.4.3. Physical requirements.........1785. MECHANICAL SPECIFICATION1815.1. OVERVIEW1812. ADD-IN CARD PHYSICAL DIMENSIONS AND TOLERANCES...........1825.3. CONNECTOR PHYSICAL DESCRIPTION…………………1954. CONNECTOR PHYSICAL REQUIREMENTS. ...............................2055. CONNECTOR PERFORMANCE SPECIFICATION……………,…2066. SYSTEM BOARD IMPLEMENTATION……………2076. CONFIGURATION SPACEb●看●鲁D鲁0e●2136. 1. CONFIGURATION SPACE ORGANIZATION音垂垂D·垂看垂…2136.2. CONFIGURATION SPACE FUNCTIONS .......................2166.2.1. Device ldentification鲁垂垂2166.2.2. Device Control鲁着鲁D垂2176.2.3. Device status2196. 2.4. Miscellaneous registers·······:········:···:·:··:·:······:··············4······:····2216.2.5. Base addresses……………………….22463. PCI EXPANSION ROMS2286.4. VITAL PRODUCT DATA.2296.5. DEVICE DRIVERS2296.6. SYSTEM RESET.…………………………2306.7. CAPABILITIES LIST2308. MESSAGE SIGNALED INTERRUPTS ...................................................................2316.8.1. MSI Capability Structure..............2326.8.2. MSl-X Capability and Table structures……………….……..2386.8.3. MSI and Msi-X Operation2467. 66 MHZ PCI SPECIFICATION2557. 1. INTRODUCTION2557.2. SCOPE7. 3. DEVICE IMPI TION CONSIDERATIONS7.3.1. Configuration space.......2557. 4. AGENT ARCHITECTURE256PCI LOCAL BUS SPECIFICATION, REV.3.07.5. PROTOCOL.……2567.5.1.66 MHZ ENABLE(M66EN) Pin definition.…………,………,,2567.52Latency..-..-.-2577.6. ELECTRICAL SPECIFICATION……………2577.6.. Overview·.·······.··2577.6.2. Transition roadmap to 66 MHz PCI··········.2577.6.3. Signaling Environment.......... 2587.6.4. Timing specification.……2597.6.5. Vendor provided specification. 26.57.6.6. Recommendations·.·························:············:······:········.:··········2657.7. SYSTEM BOARD SPECIFICATION.………,…,……………2667.7.1. Clock Uncertainty ......2667.7.2. Reset2677.7.3. Pullups..2677.7.4. Power..······.·.·::·····布鲁····音D鲁番。是。音垂看····非D∴2677.7.5. System Timing Budget7.7.6. Physical requirements2687.7.7. Connector Pin assi! nments…..,.,.,..,.,.,..,.,.,2697.8. ADD-IN CARD SPECIFICATIONS春音·。音垂2698. SYSTEM SUPPORT FOR SMBUSn2718. 1. SMBUS SYSTEM REQUIREMENTS2718.1.1. Power………278. 2. Physical and Logical sMBi27l8.1.3. Bus connectivit2728.1.4. Master and slave support....….….…..…..…..,2738.1.5. Addressing and Configuration2738.1.6.Ele2748.1.7. SMBus behavior on Pcl reset.........................2748.2.ADD- IN CARD SMBUS REQUIREMENTS…………2758.2.7Connection2758.2.2. Master and Slave Support...,.…..…….…,...….,2758.2.3. Addressing and Configuration……,…,…,……,…,…,…,….….…..….,2758. 2. 4. Power2758. 2.5. Electrical.········.····························275A. SPECIAL CYCLE MESSAGES●鲁●e鲁277A 1. MESSAGE ENCODINGS277A,2. USE OF SPECIFIC ENCODINGS ................................................277B. STATE MACHINES279B. 1. TARGET LOCK MACHINE·;.···.:..···:...···:··.·:····281B.2. MASTER SEQUENCER MACHINE283B 3. MASTER6PCI LOCAL BUS SPECIFICATION. REV.3.0C. OPERATING RULES289C 1. WHEN SIGNALS ARE STABLE..·····.:·.·.::···:·;289C.2. MASTER SIGNALS…音·。·看290C.3. TARGET SIGNALS…291C.4. DATA PHASES…292C.5. ARBITRATION.……………………………………292C.6. LATeNCY······:“·······293C.7. DEVICE SELECTION……………,……………………………293C 8. PARITY垂垂垂D·垂294D. CLASS CODESD 1. BASE CLASS OOH...w.w...296D 2. BASE CLASS OlH296D. 3. BASE CLASS O2H··297D 4. BASE CLASS O3H297D.5. BASE CLASS04H.………………………298D. 6. BASE CLASS OSH298D.7. BASE CLASS06H...………….…………………299D 8. BASE CLASS OZH,300D 9. BASE CLASS OSH.301D.10. BASE CLASS C9H.……………………………………………….301D.11. BASE CLASS OAH.…………………302D 12. BASE CLASS OBH302D. 13. BASE CLASS OCH303D.14. BASE CLASS ODH….…304D. 15. BASE CLASS OEH304D. 16. BASE CLASS OFH·····.····;····:·;:·······304D.17. BASE CLASS JOH.……………………………………………1305D, 18. BASE CLASS 11H305E. SYSTEM TRANSACTION ORDERINGE.I. PRODUCER- CONSUMER ORDERING MODEL308E. 2. SUMMARY OF PCI ORDERING REQUIREMENTS310E.3. ORDERING OF REQUESTS........................................311E.4. ORDERING OF DELAYED TRANSACTIONS…………312E.5. DELAYED TRANSACTIONS AND LOCK#.317E.6. ERROR CONDⅠ TIONS……318. EXCLUSIVE ACCESSES..m.msn0..319F.1. EXCLUSIVE ACCESSES ON PCIF 2. STARTING AN EXCLUSIVE ACCESS321F.3. CONTINUING AN EXCLUSIVE ACCESS323F 4. ACCESSING A LOCKED AGENT324F 5. COMPLETING AN EXCLUSIVE ACCESS325F. 6. COMPLETE BUS LOCK ......................................................................325IO SPACE ADDRESS DECODING FOR LEGACY DEVICES..9.... 327PCI LOCAL BUS SPECIFICATION, REV.3.0CAPABILITY IDS。,0329I. VITAL PRODUCT DATA331VPD FORMAT3I.2COMPATIBILITY……………………………334L.3. VPD DEFINITIONS3341.3.1. VPD Large and small resource Data Tags......·D垂看3341.3.2. VPD Example…3378PCI LOCAL BUS SPECIFICATION. REV.3.0FiquresFIGURE -I: PCI LOCAL BUS APPLICATIONS春DFIGURE 1-2: PCI SYSTEM BLOCK DIAGRAM17FIGURE2-1: PCI PIN LIST.…………..…………21figure 3-1: ADDRESS PHASE FORMATS OF CONFIGURATION TRANSACTIONS...... 48Figure 3-2: LAYOUT OF CONFIG ADDRESS REGISTER, ..............................................50Figure 3-3: HOST BRIDGE TRANSLATION FOR TYPE O CONFIGURATION TRANSACTIONSADDRESS PHASE51FIGURE3-4: CONFIGURATION READ…………156FIGURE3-5: BASIC READ OPERATION………………………65FIGURE 3-6: BASIC WRITE OPERATION66FIGure 3-7: MASTER INITIATED TERMINATION........................ 68FIGURE3-8: MASTER- ABORT TERMINATION…………69Figure 3-9: RETRY. ..........................................................................................................73FiGure 3-10: DISCONNECT WITH DATA. ........................74FiGure 3-11: MASTER COMPLETION TERMINATION:·:····:··.·4····.···…75FiGURE 3-12: DISCONNECT-1 WITHOUT DATA TERMINATION·····76Figure 3-13: DISCONNECT-2 WITHOUT DATA TERMINATION76FiGure 3-14: TARGET-ABORT…177figure 3-15: BASIC ARBITRATIONFIGuRE 3-16: ARBITRATION FOR BACK-TO-BACK ACCESS…94FiGurE 3-17: DEVSEL# AsSERTION·····:···.·:··110Figure 3-1 8: IDSEL STEPPING114FiGure 3-19: INTERRUPT ACKNOWLEDGE CYCLE. ...................................................114FIGURE3-20: PARITY OPERATION………116FIGuRE 3-21: 64-BIT READ REQUEST WITH 64-BIT TRANSFER125FIGURE 3-22: 64-BIT WRITE REQUEST WITH 32-BIT TRANSFER..........126FIGURE 3-23 64-BIT DUAL ADDRESS READ CYCLE129FIGURE 4-1: ADD-IN CARD CONNECTORS...........................138FIGURE4-2:V/ICURⅤ ES FOR5 V SIGNALING.…………………143FIGURE 4-3: MAXIMUM AC WAVEFORMS FOR 5V SiGnaling145FIGURE 4-4: V/I CURVES FOR 3.3V SIGNALING148FIGURE4-5:MAⅹ IMUM AC WAⅤ EFORMS FOR3.3ⅴ SIGNALING………150FIGURE 4-6: CLOCK WAVEFORMS151FIGURE 4-7: OUTPUT TIMING MEASUREMENT CONDITIONS.··4·:······.·154FIGURE4-8: INPUT TIMING MEASUREMENT CONDITIONS…………154FIGURE 4-9: SUGGESTED PINOUT FOR POFP PCI COMPONENT···“···:.···.····:·········157FIGURE4-10: CLOCK SKEW DIAGRAM………158FIGURE 4-1: RESET TIMING16lFIGURE4-12: MEASUREMENT OF TPROP,3.3 VOLT SIGNALING……………166FIGURE 5-1: PCI RAW ADD-IN CARD(3.3V, 32-BIT).183FIGURE 5-2: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 32-BIT)..........184FIGURE 5-3: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 64-BIT)....185FIGURE 5-4: PCI RAW LOW PROFILE ADD-IN CARD(3.3V, 32-BIT)..........186PCI LOCAL BUS SPECIFICATION, REV.3.0FIGURE5-5: PCI ADD-Ⅰ N CARD EDGE CONNECTOR BEⅤEL……187FIGURE56: PCI ADD-IN CARD ASSEMBLY(3.3V)……………………………88FIGURE 5-7: LOW PROFILE PCI ADD-IN CARD ASSEMBLY 3.3V)189FIGURE 5-8: PCI STANDARD BRACKET………190FIGuRE 5-9: PCI LOW PROFILE BRACKET191FIGURE 5-10: PCI STANDARD RETAINER···192FIGURE5-11: IO WINDOW HEIGHT∴………………193FIGURE 5-12: ADD-IN CARD INSTALLATION WITH LARGE IO CONNECTOR.......194FIGURE 5-13: 32-BIT CONNECTOR196FIGURE 5-14: 3.3V/32-BIT CONNECTOR LAYOUT RECOMMENDATION. ........................197FIGURE5-15:3.3V/64-BIT CONNECTOR198FIGURE 5-16: 3.3V/64-BIT CONNECTOR LAYOUT RECOMMENDATION 199FIGURE 5-17: 3.3V/32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES2(垂D·。垂,音着垂。着音D。。着。D音着音垂。音着音FIGURE 5-18: 3.3V/64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES….201FIGURE5-19: UNIVERSAL 32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES………………………………202FIGURE 5-20: UNIVERSAL 64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES203FIGURE5-21:PCⅠADD- IN CARD EDGE CONNECTOR CONTACTS……204FIGURE5-22: CONNECTOR CONTACT DETAIL………………205FIGURE 5-23: PCI CONNECTOR LOCATION ON SYSTEM BOARD208FIGURE5-24:32- BIT PCI RISER CONNECTOR……209FIGURE 5-25: 32-BIT/3.3V PCI RISER CONNECTOR FOOTPRINT210FIGURE 5-26: 64-BIT/3.3V PCI RISER CONNECTOR211FIGuRE5-27:64-BI/3.3ⅴ PCI RISER CONNECTOR FOOTPRINT∴………212FIGURE 6-1: TYPE OOH CONFIGURATION SPACE HEADER215FIGURE 6-2: COMMAND REGISTER LAYOUT217FIGURE6-3: STATUS REGISTER LAYOUT……………………………219FIGURE 6-4: BIST REGISTER LAYOUT222FIGURE 6-5: BASE ADDRESS REGISTER FOR MEMORY........... 225FIGURE 6-6: BASE ADDRESS REGISTER FOR L/O225鲁着D音看FIGURE 6-7: EXPANSION ROM BASE ADDRESS REGISTER LAYOUT.....,..... 228FIGURE6-8: EXAMPLE CAPABILITIES LIST…….231FIGURE6-9: MSI CAPABILITY STRUCTURES…..……233FIGURE 6-10: MSI-X CAPABILITY STRUCTURE238FIGurE 6-11: MSI-X TABLE STRUCTURE翻音。音239FIGurE 6-12: MSI-X PBA STRUCTURE…239FIGURE 7-1: 33 MHZ PCI VS 66 MHZ PCI TIMING······:··················257FIGURE7-2:3.3 V CLOCK WAVEFORM.…………259FIGURE 7-3: OUTPUT TIMING MEASUREMENT CONDITIONS263FIGURE -4: INPUT TIMING MEASUREMENT CONDITIONS263FIGURE75:TvAL(MAX) RISING EDGE…………264FIGURE 7-6: TVAL(MAX) FALLING EDGE·265FIGURE77:TVAL(MIN) AND SLEW RATE……26510
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