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基于51单片机和Proteus仿真的波形发生器设计
一个能产生正弦波、方波、三角波、梯形波、锯齿波的波形发生器。用数码管显示每次输出波的类型，输出正弦波时数码管显示1；输出方波时数码管显示2；输出锯齿波时数码管显示3；输出三角波时数码管显示4；输出梯形波波时数码管显示5。方波的占空比可调。五种波的频率可调。五种波的幅度可调。电源指示灯。
- 2020-12-01下载
- 积分：1
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MPLAB的XC8编译器
MPLAB的XC8编译器，在网上不好找，之前的比较老的PIC单片机的单片机系列，PIC12、PIC16、PIC18、PIC24系列8位机
- 2021-05-07下载
- 积分：1
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压缩感知做信道估计
用压缩感知技术来做信道估计，并与传统信道估计方法，LS,MMSE做比较。
- 2020-11-28下载
- 积分：1
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基于深度学习的人脸表情识别（Tensorflow的模型和权重）
TensorFlow|基于深度学习的人脸表情识别系统模型权重和模型结构，因GItHub不支持25MB以上的文件，因此上传在此处，如果急用可以在此下载，作为对我工作的一些支持如果不急用可以在下方留下邮箱，我在看博客的时候会回复，但会有一段时间的延迟
- 2020-06-21下载
- 积分：1
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Delphi7.chm（带译文）
Delphi7.chm（带译文）
- 2020-04-08下载
- 积分：1
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使用CC2591作为CC2530的功放
使用CC2591作为CC2530的功放, CC2591 PAThe absolute maximum ratings and operating conditions listed in the CC2530 datasheet [1]and the CC2591 datasheet [4] must be followed at all times. Stress exceeding one or more ofthese limiting values may cause permanent damage to any of the devicesNote that these characteristics are only valid when using the recommended register settingspresented in Section 4.6 and in Chapter 8, and the CC2530 - EM reference designOperating Frequency240524835MHzOperating Supply Voltage2036VOperating Temperature-40CTC=25C, VDD=3.0V, f=2440 MHz if nothing else is stated. All parameters are measuredon the CC2530-Cc2591EM reference design [11] with a 50 Q2 loadReceive CurrentWait for sync, -90 dBm input levelWait for sync, -50 dBm input level24mATXPOWER OXE5166mATXPOWER OXD5149mATXPOWER OXC5138mATXPOWER OXB5127mATransmit currentTXPOWER OXA5115ATXPOWER = 0X95100mATXPOWER = 0X8594ATXPOWE=0×75mATXPOWE=0×6579APower Down Current PM2UAISTRUMENTSPage 3 of 19SWRA308ATC=25C, Vdd=3.0V, f= 2440 MHz if nothing else is stated. All parameters are measuredon the CC2530-CC2591 EM reference design with a 50 Q2 loadReceive Sensitivity HGM 1 %PER, IEEE 802. 15.4[6] requires -85 dBm-988dBmReceive Sensitivity LGM1 PER, IEEE 802. 15.4 [6] requires -85 dBm-90.4dBmSaturationlEEE 802.15. 4 [6] requires-20 dBm10dBmWanted signal 3 db above the sensitivity levelIEEE 802.15.4 modulated interferer at ieee 802.15.4 channelsInterferer Rejection+5 MHz from wanted signal, IEEE 802. 15. 4 [6] requires 0 dBdB+10 MHz from wanted signal, IEEE 802. 15. 4 [6] requires 30 dB49dB+20 MHz from wanted signal wanted signal at- 82d BmdBdue to in the external lna and the offset in cc2530 the rssi readouts from cc2530CC2591 is different from rssi offset values for a standalone cc2530 design the offsetvalues are shown in table 4.4High Gain Mode79LoW Gain mode67Real rssi Register value-Rssl offsetISTRUMENTSPage 4 of 19SWRA308ATc=25C, Vdd=3.0V, f=2440 MHz if nothing else is stated All parameters are measuredon the CC2530-CC2591 EM reference design with a 50 Q2 load Radiated measurements aredone with the kit antennaRadiated Emissionwith TXPOWer Oxe5Conducted 2. RF (FCC restricted band)-462|dBmConducted 3. RF(FCC restricted band46.5 dBmComplies withFCC 15.247. SeeChapter 7 for moredetails about regulatoryRadiated 2.RF(FCC restricted band)42.2dBmrequirements andcomplianceIEEE 802.15.4[6]requires max.35%%Measured as defined by IEEE 802.15. 4 6TXPOWER OxE5. f= EEE 802.15. 4 channels13TXPOWER= OXD5. f= EEE 802.15.4 channelsTXPOWER= OXC5 f= EEE 802.15.4 channelsMax error∨ ectorTXPOWER OxB5 f= IEEE 802.15. 4 channelsMagnitude(EVM)TXPOWER OxA5. f= IEEE 802.15.4 channelsTXPOWER 0X95. f= IEEE 802. 15.4 channels643333%%%%%%%TXPOWER= 0x85. f= iEEE 802. 15.4 channelsTXPOWER =0x75 f= IEEE 802. 15.4 channels%TXPOWER= 065. f= iEEE 802. 15.4 channelsThe RF output power of the CC2530- CC2591 EM is controlled by the 7-bit value in theCC2530 TXPOWER register. Table 4.6 shows the typical output power and currentconsumption for the recommended power settings The results are given for Tc= 25 C, Vdd3.0V and f= 2440 MHz, and are measured on the cC2530-CC2591 EM reference designwith a 50 Q2 load. For recommendations for the remaining CC2530 registers, see Chapter 8 oruse the settings given by SmartRF StudioOXE520166OxD519149OxC18138OxB517127OxA5161150x95141000x8513940X75860x651079Note that the recommended power settings given in Table 4.6 are a subset of all the possibleTXPOWER register settings. However, using other settings than those recommended mightINSTRUMENTSPage 5 of 19SWRA308Aresult in suboptimal performance in areas like current consumption, EVM, and spuriousemissionTc=25C, Vdd=3.0V, f=2440 MHz if nothing else is stated All parameters are measuredon the CC2530-CC2591EM reference design with a 50 32 load2221-2V201918171611121314151617181920212223242526251510OxE5OxC5OxA50X850x65540-30-20-1001020304050607080ISTRUMENTSPage 6 of 19SWRA308A98Avg 3.6VAva 3vAvg 2V110111213141516171819202122232425261023.6V-1062V-110-40-30-20-100102030405060708070604020-Wanted signal at:-82 dBm10ISTRUMENTSPage 7 of 19SWRA308ACC2530-CC2591EM High Gain ModeC C2530-CC2591EM Low Gain Mode- CC2530EM40000-100110100908070-60-50-40-30-20-100The IEEE standard 802.15. 4 [8] requires the transmitted spectral power to be less than thelimits specified in table 4.7If-fc>3.5 MHz-20 dB-30 dBmThe results below are given for Tc=25 C, Vdd=3.0V and f= 2440 MHz, and are measuredon the CC2530-CC259 1EM reference design with a 50 Q loadIEEE absoluteChannel 182432.52435243752442524452447.5ISTRUMENTSPage 8 of 19SWRA308AOnly a few external components are required for the CC2530-CC2591 reference design. Atypical application circuit is shown below in Figure 5.1. Note that the application circuit figuredoes not show how the board layout should be done. The board layout will greatly influencethe RF performance of the CC2530-CC2591EM. TI provides a compact CC2530CC2591 EM reference design that it is highly recommended to follow. The layout, stack-upand schematic for the CC2591 need to be copied exactly to obtain good performance. Notethat the reference design also includes bill of materials with manufacturers and part numbersL102 L10=TI INF inductorVDD13cc2530LA 1RF PANTCC2591 RF NFNPA EN(P1 1)i工工I NA FNP:1HGM ENPO 7)T:1Proper power supply decoupling must be used for optimum performance. In Figure 5.1, onlythe decoupling components for the CC2591 are shown. This is because, in addition todecoupling, the parallel capacitors C11, C101, and C131 together with, L101, L102, TL11TL101 and TL131 also work as RF loads. These therefore ensure the optimal performancefrom the CC2591. C161 decouples the AvDD blAs power.The placement and size of the decoupling components, the power supply filtering and thePCB transmission lines are very important to achieve the best performance Details about theimportance of copying the CC2530-CC2591EM reference design exactly and potentialconsequences of changes are explained in chapter 6The RF input/output of CC2530 is high impedance and differential. The CC2591 includes abalun and a matching network in addition to the PA, LNa and RF switches which makes theinterface to the CC2530 seamless. Only a few components between the CC2530 andCC2591 necessary for RF matching For situation with extreme mismatch(VSWR 6: 1 till 12: 1out-of-band as shown in Figure 6.2) it is recommended to include all the components asshown in Figure 5.1ISTRUMENTSPage 9 of 19SWRA308ANote that the PCB transmission lines that connect the two devices also are part of the RFmatching. It is therefore important to copy the distance between the devices, the transmissionlines and the stack-up of the PCB according to the reference design to ensure optimumperformanceThe network between the CC2591 and the antenna(L111, C112, C111 C113 and L112matches the CC2591 to a 50 2 load and provides filtering to pass regulatory demands. C111also works as a dc-blockR151 is a bias resistor the bias resistor is used to set an accurate bias current for internaluse in the cc2591The TI reference design contains two antenna options. As default, the Sma connector isconnected to the output of CC2591 through a 0 Q2 resistor. This resistor can be soldered offand rotated 90 clockwise in order to connect to the PCB antenna, which is a planar invertedF antenna(PIFA). Note that all testing and characterization has been done using the SMAconnector. The PCB antenna has only been functionally tested by establishing a link betweentwo EMs. Please refer to the antenna selection guide [6] and the Inverted F antenna designnote [7 for further details on the antenna solutionsISTRUMENTSPage 10 of 19SWRA308A
- 2020-11-30下载
- 积分：1
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Oxford flowers17数据集，已打乱并划分 训练集、验证集、测试集
文章《Keras 入门课6 -- 使用Inception V3模型进行迁移学习》https://blog.csdn.net/tsyccnh/article/details/78889838 使用的数据集
- 2020-11-28下载
- 积分：1
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核偏最小二乘KPLSR
文件内包含KRR、KPCA、KPCR以及KPLS的相关程序，其中KPLS相关程序又包括KerSIMPLS以及KerNIPALS可供选择，他们是用不同方法计算的PLS。同时文件中还有一个例子，分别应用这些程序实现sin函数的拟合，清晰易懂。
- 2020-12-02下载
- 积分：1
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IDL遥感图象处理系统
本系统主要由文件模块、灰度变换模块、信号处理模块、图像增强模块和边缘检测模块五大部分构成，且能显示鼠标在原图像中所处的位置坐标及图像灰度值。运行结果表明，系统运算速度较快，运行效果良好，有较好的参考价值。
- 2020-12-08下载
- 积分：1
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专利撰写样例
专利撰写参考样例，可以参考写。机械相关领域的专利，都可以参考。CN201482299U说明书1/2页多功能组合式带式压滤机技术领域[0001]本实用新型涉及一种环保领域水处理系统中,适用于污泥处理的多功能组合式带式压滤机。背景技术[000]环保领域水处聞系统中的污泥处理设备中,带式压滤机是)泛采用的设备。目前带式脱水设备形式很多,但是由于各种使用原因,都存在有污泥分离过程中,混合、絮凝不充分,影响了带式压滤机使用效果,无形中增加了污泥处理的费川实用新型内容[0003]本实用新型要解决的技术问题是提供一种集絮凝、浓缩、布料及脱水于一体的多功能组合式带式压滤机,解决混合、絮凝不充分,滤液中仍含有大量污泥,布料不均匀等缺陷。[000为了解决上述问题,本实用新型提供了一种由絮凝装置、浓缩装置、宽带布料装置、脱水装置组成的多功能组合式带式压滤机。泥浆浓度小于1%时采用絮凝装置、浓缩装置、脱水装冒组合,浓度大于1%时采用絮凝装置、宽带布料装置、脱水装詈组合,絮凝装置安装在脱水装置上部左端;浓缩装置安装在脱水装置上部中间;宽带布料装置安装在脱水装置上部中间。[0005絮凝装置是絮凝筒和裝仼絮凝筒上部的搅拌机组成的装置;所述絮凝装置的搅拌机为螺旋提升式搅拌机。[000]浓缩装置是浓缩装置驱动电机减速机安装在浓缩装置的左端,其右侧安装1~3只浓缩网筒,浓缩装置的右下端安装1~3只小布料器组成的装置。[000宽带布料裝置是分配槽和安装在分配槽上部的布料筒组成的装置[0008脱水装置是重力脱水区位于脱水装置的上端左侧,重力脱水区右侧依次安装上滤带清洗装冒、上调偏装置、脱水裝置驱动电机减速机:主动辊安装在脱水装置的右端,主动辊之间右侧形成剥离区,剥离区左侧的S形区域是S挤压脱水区,S挤压脱水区左侧是上滤带和下滮带形成的楔形脱水区,转向辊安装在脱水设备的左端,下调偏裝置安装在脱水裝置的下部右侧,下滤带清洗装置安装在下调偏装置左侧组成的装置。附图说明[0009下面结合附图和具体实施方式对本实用新型作进一步详细的说明[0010]图1是本实用新型多功能组合式带式压滤机的第一种实施方式的示意图。[0011图2是木实用新型多功能组合式带式压滤机的第二种实施方式的示意图具体实施方式[0012]本实用新型工作情况是这样的:CN201482299U说明书2/2页[0013]如图1所示,经过加药后的原低浓度泥浆由泥浆口20进入絮凝装置23,泥浆在絮凝筒2屮絮凝,通过螺旋提升式的搅拌机1搅拌加速泥浆与药剂的反应,形成较大的絮凝团,然后自流到浓缩装置4中。由浓缩装置驱动电杋减速杋3带动不锈钢浓缩网筒5旋转,泥浆在浓缩网筒5中进行浓缩,浓缩后的泥浆通过配套的小布料器7均匀分布在上滤带19上。脱水装置驱动电机减速机10带动主动辊11转动,主动辊11带动上滤带19和下滤带16移动。泥浆在上滤带19带动通过重力脱水区6,稳压阀提供恒定压力的转向辊18,转向落到下滤带l6上,然后在楔形脱水区17预挤,最后在S挤压脱水区13挤压脱水,并形成泥饼,泥饼最终在剥离区12分离出脱水装置25。上滤带19通过射沇阀控制的上调偏装置⑨调整滤带的位置。上滤带凊洗装置8对上滤带19进行凊洗。下滤带16通过射流阀控制的下调偏装置14调整滤带的位置。下滤带清洗装置15对下滤带16进行清洗.[0014]如图2示的经过加药后的原低浓度泥浆由泥浆∏20进入絮凝裝置23,泥浆在絮凝筒2中絮凝,通过螺旋提升式的搅拌机1搅拌加速泥浆与药剂的反应,形成较大的絮凝团,然后自流到宽带布料装置24,在布料筒21中混凝,用由分配槽22均匀分布到上滤带19。脱水装置驱动电机减速机10带动主动辊11转动,主动辊11带动上滤带19和下滤带16移动泥浆在上滤带19带动通过重力脱水区6,稳压阀提供恒定压力的转向辊18,转向落到下滤带16上,然后在楔形脱水区17预挤压,最后在S挤压脱水区13挤压脱水,并形成泥饼,泥饼最终在剥离区12分离岀脱水装置25。上滤带19通过射沇阀控制的上调偏装9调整滤带的位萓。上滤带清洗装萓8对上滤带19进行凊洗。下滤带16通过射流阀控制的下调偏装置14调整滤带的位置。下滤带淸洗装置15对下滤带16进行清洗CN201482299U说明书附图1/2页89252310182N相12171613图15CN201482299U说明书附图2/2页252019TIINT18a尺G)12161415EADZARSEADE图6
- 2021-05-06下载
- 积分：1
