microTCA规范
PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification
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刘宝碇--随机规划与模糊规划（1998）
随机规划与模糊规划全本，是一本很好的参考用书序言在现实世界上,人们制定决策时经常会磁到两类不确定性现象:一是随机现象,一类是模糊现象。揹述、刻匦随机现象的量称为随机变量,而描述、刻画模糊现象的量称为模糊集。为了方便,我们不妨把二者分别称为随机参数和模糊参数。含有随机和模糊参数的数学规划分别称为随机规划和模糊规划。既然随机性和模糊性都是用来处理不确定性的,我们将随机规划和模糊规划统称为不确定规划。本书将为随机规划和模糊规划提供统一的原理,并为一般不确定环境下的优化理论打下基础在很多实际问题中,如管理、工程、经济、工业以及生态等领域,系统是一个广泛使用的概念,而一个复杂的决策系统通常具有多维性、多样性、多功能性和多准则性,并带有随机或模糊参数。对于随机规划间题中所出现的随机变量,出于不同的管理目的和技术要求,采用的方法自然也不同。第一类处理随机规划中随机变量的方法是所谓的期望值模型,即一种在期望值约束下使目标函数的概率期望达到最优的模型.第二类方法是 Charnes和 Cooper提出的机会约束规划,主要针对约束条件中含有随机变量,目必须在观测到随机变量的实现之前作出决策的情况。考虑到所作决策在不利情况发生时可能不满足约束条件,而采用一种原则:即允许所作决策在一定程度上不满足约束条件,但该决策应使约束条件成立的概率不小于某一置信术平α。第三类隨杋规划是相关机会规划,是使事件的机会函数在不确定环境下达到最优的方法,在确定性规划以及期望值模型和机会约束规划中随机规划与模糊规攴当对实际问题建模以后,可行集本质上是确定的,这就可能导致所给出的最优解在实际中无法执,而相关机会规划并不假定可行集是确定的。实际上相关机会规划的可行集被描述为所谓的不确定环境。虽然相关机会规划也给出一个确定的解,但这个解只是要求在安际问题中尽可能地执行。显然,相关机会规划的这特点与确定性规划、期苤值棋型和机会约束规划是截然不同的沿用随机环境中枕会约東规划的思想,在模榈环境中,假定模糊约東成立的可能性不小于置信水平α,这样就可以建立模糊机会约束规划、机会约束多目标规划和机会约束目标规划.类似地,沿用随机环境下相关机会规划的思想,亦有模糊相关机会规划、相关机会多目标规划和相关机会目标规划理论随着计算机的飞速发展和革新算法的不断涌现,许多复杂的优化问题已可以通过计算机求解。虽然目前计算机的能力还只能处理小规模的不确定规划模型,但是,我们坚信计算机的能力将会大幅度提高。这就为求解更加复杂的优化问题提供了一个契机它不仅表现在已有的复杂模型可以通过计算机求解,而且表现在我们可以提出更丰富的建模恿想。基于这一事实,本书采用全新的观点处理随机娜划和模糊规划,并且允许不确定规划中的目标函数和约束函数是非线性的,随机参数的密度函数或模糊参数的隶属函数可以有更灬般的形式,模型的结构可以更加复杂等等夲书为求解传统方法所不能解决的随机规划和模糊规划模型,设计了一系列基于随杌模拟或模糊模拟的遗传算法、虽然遗传算法有耗时多、速度慢等缺点,但对传统方法无法处理的问题,遗传算法是一种非常有效的方法,而且随着计算机速度的提高,实际间题将可以在合理的计算时间内得到解决本书共分12章。第1章主要介绍数学规划的基本概念,如线性规划、非线性规划、多目标规划、目标规划以及整数规划,同时也勾画出了随机规划私模糊规划的理论框架.第2章为求解优序言化问题,如单目标规划、多目标规划和目标规划,提供了一个遗传算法,并通过一些数值例子解释了遗传算法的有效性。第3章列举了生成随杌数的方法,并介绍模糊集合的一些基础理论,以及随机模拟和模粉模拟的技术。第4章给出了期望值模型的一些基本性质。第5章讨论了带有随机参数的机会约束规划。第召章给出一些机会约束规划模型的应用。第7章讨论了随机环境下的相关机会规划模型。第8章通过相关机会规划模型对随机决策系统进行了建模。第9章把随机机会约束规划推广到模糊机会约東规划。而第10章把随机相关机会规划推广到模糊相关机会约束规划.传统的数学规划模型提供的是使一些目标函数达到最优的清晰决策,然而,对实际问题,有讨应该提供的是模糊决策而不是清晰决策,所以第11章建立了带有模糊决策的模糊规划的理论构架。在第9章和第11章所讨论的模糊系统中的机会约束规划模型夲质上是一种 Maximax模型(乐观模型),即极大化可能达到的最大收益.与 Maximax模型的思想不同,第12章介绍了Mamx机会约束规划模型,其思想是极大化可能达到的最小收益本书可作为高等院校有关专业的高年级大学生和研充生的教材,也可作为运筹学、管理科学、计算机科学、系统科学、信息科学与工程等方面的学者和技术人员的参考书目录序第1章数学规划筒介11线性规划1.2非线性规划1.3多目标规划614目标规划81.5整数规划16不确定规划12第2章遮传算法优化间题22表示结构1823处理约束条件824初始化过程2评价函数202选择过程2227交叉操作2328变异操作429遗传算法程序242I0遍传算法与上升法25211数值例子26随机规划与模糊规划第3章随机棋拟和棋糊棋拟a了31随机数的产生3832随机模拟4733模糊集合理论5034模糊模拟57第4章期望值樸型644.1期望值算子652期望值模型6643凸性684.4补偿模型..、7(45基于随机模我的遗传算法46注73第5章机会约束划7生51机会约束规划模型5.2确定生等价类53—些性质8354随机模拟885.5基于随机模拟的遗传算法56注94第6章机会约束规划的应用0561生产过程0562饲料混合问题6.3随机资源分配986开放存储网络0165资金预算112月录11第7章相关机会规划L1771背景;供给-分配系统177.2随机集合1217.3不确定坏璄12474事件和机会函数1257.5相关机会规划..,,]2876相关机会多目称规划,,1307.7相关机会目标规划1337.8执行墩优解3679机会函数的随机模拟1377.10基于随机模拟的遗传算法138711注143第8章随机决簟系統媓模1448.1水资源供给一分配问题14482生产过程l5283开放存储网络15484资金预算15g第9章模糊机会约束规划16491机会约束规划模型1659.2清晰等价类.1689.3模糊模拟17394基于模糊模拟的遗传算法17595资金预算1796注183第10章模糊环境下的相关机会规划18410.1相关机会规划184随机规划与糢糊规划102相关机会多目标规划18610.3相关机会目标规划18810.4杌会函教的模糊模拟19110.5基于模糊模拟的遗传算法92106注197第11章带有模糊决策的模糊规划181.1模糊决策198112机会约束规划模型20(113相关机会规划模型20214模糊模拟1.5基于模糊模拟的遗传算法21211.6数值例于21617注222第12章 Minimax机会约束规划模型223121 Marina模型223122 Minimax模型227123 Minimax与Ma2x1卫ha22912.4模糊模拟232125数值例于23生126注238参考文献240些常用的符号251索引252第1章数学规划简介数学规划是运筹学的一个重要分支,并已被广泛地应用到很多领域数学规划可以描述为在一些数学关系诸奶等式或不等式表示的约束条件下,求一个(或一组)数的极值问题的方法.常見的数学规划有线性规划、非线性规划、多目标规划、目标规划整数规划、多层规划、动态规划以及本书重点讨论的随机规划和模糊规划等等本章里,介绍一些数学规划的基本概念和处理技术,为引入殖机规划和模糊规划打下基硼1.1线性规划作为优化领域最重要的工具之一,线性规划是用来处理在线性等式及不等式组的约束条件下求线性函数的极值问题的方法线性规划的标准形式可以写为maKC11千C22+…十Cun12:+媛122+…+a1nxn=竹1a211千22+…axn=b4m121+(m232+…+ammn=bm3≥D3=1,2
- 2020-12-07下载
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