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多波束测深和图像数据处理

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本书详细讲解了多波束测深的原理、侧扫声呐在海底地形绘制、水下目标识别的应用、可以供水声等相关专业科研人员参考国家“十一五”重点图书地球空间信息学丛书/李德仁主编多波束测深及图像数据处理■赵建虎刘经南著WUHAN UN∨ ERSITY PRESS武汉大学出版社图书在版编目(CIP)数据多波束测深及图像数据处理/赵建虎,刘经南著.一武汉:武汉大学出版社,2008.9国家“十一五”重点图书地球空间信息学丛书/李德仁主编ISBN978-7-307065000Ⅰ.多…Ⅱ.①赵…②刘…Ⅲ.海洋测量一测深一卫星图像一图像处理Ⅳ.P229-39中国版本图书馆CP数据核字(2008)第129252号责任编辑:任翔责任校对:黄添生版式设计:马佳出版发行:武汉大学出版社(430072武昌珞珈山)(电子邮件:wdp4@whu.edu.cn网址:ww.wdp.com.cn)印刷:武汉中远印务有限公司开本:720×10001/16印张:24.25字数:446千字插页:1版次:2008年9月第1版208年9月第1次印刷ISBN978-7-30706500-0/P·138定价:45.00元版权所有,不得翻印;凡购我社的图书,如有缺页、倒页、脱页等质量问题,请与当地图书销售部门联系调换。前言随着陆地资源的还渐匮乏,人类已将资源开发和利用的重点转向了占整个地球面积71%、蕴藏着丰富自然资源的海洋。我国已于20世纪末制定了21世纪海洋强国战略,其宗旨是将我国建设成为世界级的海洋强国。在这一世纪性战略中,海洋测量作为人类一切海洋活动的基础,必将扮演着十分重要的作用。随着电子、计算机、信息等相关技术的迅速发展,当今的海洋测量正呈现蓬勃的立体发展态势。在这一大背景下,基于船载测量设备的海洋调查和勘测技术、手段及方法在我国也取得了日新月异的成就,尤其是自20世纪90年代引进的多波束系统,无论是测点的精度、密度和代表性,均是以往传统水下地形测量方法所不能比拟的,真正地实现了从“点”、“线”水下地形测量到条带式、全覆盖、“面”测量的变革,给我们真实、详细地呈现出了海底的精细地形和地貌,使人类能够首次全面地认识“漆黑”的海底世界。然而,由于多波束系统引进的时间较短,我国对该系统的认知还基本处于初始阶段,许多拥有多波束系统的测量单位到目前为止还停留在依照系统参考手册和操作规范实施作业的初始应用阶段,远没有最大限度地发挥该系统的应用潜力。另外,由于对相关知识的了解和认识不足,系统的应用远没有达到预期的精度。为了改善多波束系统在我国当前的应用状况,提高系统的应用和开发潜力,本书围绕多波束系统具有测深和获取声呐图像两大功能,在论述多波束系统的发展历史和工作原理的基础上,对多波束测量中涉及的平面基准及其相互转换、潮汐调和分析及海洋垂直基准面、声速及声线跟踪、辅助参数的测定、滤波及补偿、多波束测深数据滤波、基于已有软件的多波束数据处理过程及分析、声强数据的处理及声呐图像的形成、声呐图像的处理、多波束声呐图像的应用、多波束测量信息和侧扫声呐测量信息的融合等主题展开了深人的研究,详细地介绍了这些研究目前取得的最新进展研究所采用的理论和方法,同时还给出了这些理论和方法的实际应用效果。这些研究成果对从事多波束研究和实际工程应用具有一定的借鉴作用。本书共分12章,第1至2章主要由刘经南院士赵建虎完成,着重介绍了船多波東测深及图像数据处理载测深系统的发展历史以及多波束数据处理技术的现状和发展趋势,第3至8章着重介绍了测深数据的处理方法、理论及实际应用。在这部分中,从第3章到第7章由赵建虎和刘经南院士完成,第8章由陈义兰、杨琨、吴永亭、周丰年完成;第9至11章着重介绍了基于多波束回波强度信息所生成的声呐图像的形成、处理及应用,由赵建虎和刘经南院士完成。第12章在系统分析了多波束和侧扫声呐测量内容特点的基础上,提出了综合二者测量信息,通过信息的有机融合处理获取海底高精度声呐图像和高分辨率地形的思想和方法,对二者的信息融合方法、理论进行了探讨,并对其应用前景进行了展望。由于本书涉及的内容比较多,许多领域是目前国内外研究的热点问题,加之作者水平有限,书中有不妥之处,敬请各位专家与读者批评指正。编者2007年8月目录第1章绪论…1.1引言甲鲁···船载测深系统的发展历史1.2.1原始测深方法看·曲单非·鲁非看P即·鲁。看4451.2.2常规测深系统……1.2.3多波束测深系统1.2.4多波束测深系统的最新进展1.2.5我国的多波束测深系统………………101.3多波束数据处理技术的现状和发展趋势……1.3.1声速及其声线跟踪1.3.2多波束辅助参数的测定和滤波1.3.3深度数据滤波…131.3.4图像处理……………………………131.3.5多波束数字信息与侧扫声呐图像信息的融合……………141.4本书的结构体系141.5本章小结15参考文献16第2章多波束系统的工作原理··········………………182.1多波束系统的组成182.2多波束系统的声学原理…202.2.1相长干涉和相消干涉以及换能器的指向性202.2.2换能器基阵的束控…b·●量垂看·杳·有242.2.3波束的形成………252.3波束的发射、接收流程及其工作模式鲁自·t··。命272.4波束的能量衰减及其时间增益补偿……302.5底部检测及系统探测能力的估算……30多波束测深及图像数据处理2.6波束脚印的归位问题…312.7本章小结34参考文献中自●非·幽35第3章平面基准及其相互转换3.1地心坐标系…373.1.1地心坐标系的定义……………………373.1.2地心坐标系的建立383.1.3已有的地心坐标系统及其参数423.2参心坐标系433.2.1参心坐标系的定义433.2.2参心坐标系的建立4432.3我国常用的参心坐标系及其参数……453.3坐标系间的相互转换……………………………………473.3.1大地坐标系与空间大地直角坐标系转换的数学模型473.3.2不同的三维空间直角坐标系转换的数学模型483.3.3不同大地坐标系转换的数学模型…493.4高斯投影·鲁·513.4.1高斯投影概述3.4.2椭球面元素到高斯投影面的转换曾·q。鲁普鲁看曹鲁·鲁543.4.3高斯投影的邻带坐标换算553.5UTM(通用横轴墨卡托)投影…鲁由申鲁由563.6独立坐标系583.6.1独立坐标系概述583.6.2独立坐标系的建立583.6.3独立坐标系与其他几种典型坐标系的转换613.7本章小节…63参考文献…………63第4章潮汐调和分析及海洋垂直基准面∴644.1平衡潮理论……644.1.1引潮力(势)644.1.2引潮力势的调和展开………鲁·664.1.3平衡潮及其主要结论68日录4.1.4实际潮汐的潮高……84.2潮汐、潮流分析704.2.1潮汐分析……………………………704.2.2潮流分析…………724.2.3溯汐动力学理论734.3垂直基准764.3.1平均海平面……………………………………………774.3.2国家高程基准794.3.3海图深度基准面…804.4基准传递与推估……854.4.1短期验潮站平均海平面的确定854.4.2深度基准面传递与推估874.4.3平均海平面和深度基准面的综合传递884.5海洋垂直基准统一框架894.5.1平均海平面作为海洋统一垂直参考基准…894.5.2以椭球面作为海洋统一垂直参考基准…894.6本章小结……………………………………………………92参考文献………………………………………92第5章声速及声线跟踪945.1海洋声学…·日945.1.1海洋声速…965.1.2声波在海水中的传播特性………………………………975.1.3声道…1005.1.4海洋噪声…………1015.2海水中声速的确定…………1015.2.1声速剖面的直接测量申鲁·杳·………10252.2声速的间接确定1045.3基于自组织神经网络的声速剖面分类方法1125.3.1SOFM神经网络1125.3.2声速剖面的描述1135.3.3用于划分声速剖面类别的S0FM神经网络的构造和训练…1145.3.4实验和分析1155.4局域空间声速模型的建立120多波東测深及图像数据处理5.4.1局域空间声速模型的建立∴…………………1205.4.2实践及分析…………………………1215.5声线跟踪法1245.5.1 Harmonic平均声速1255.5.2基于层内常声速假设下的声线跟踪算法…1265.5.3基于层内常梯度假设下的声线跟踪算法1275.6等效声速剖面法1285.6.1一个重要事实的证明1285.6.2误差修正法12956.3等效声速剖面法1305.7声线跟踪过程及各方法的比较鲁鲁·着·。鲁非·。…1325.7.1声线跟踪法的计算过程1325.7.2误差修正法和等效声速剖面法的计算过程1335.7.3各种方法的比较13458实践及分析……………1355.9声速对多波束测量成果的影响……4··1375.9.1声速剖面测量误差的产生…………………………1375.9.2声速误差的影响1385.10本章小结……………………141参考文献141第6章辅助参数的测定、滤波及补偿…………1436.1多波束测量中的定位技术●寺章萨。1436.2局部无缝垂直参考基准面的建立1466.2.1精密局域大地水准面的确定1476.2.2局域海图基准高程模型的建立p●曹D●14862.3建立 Saint John河无缝垂直参考基准的实践和过程分析……1486.3GPS船姿测量…····“··1566.3.1坐标系统的定义及其相互关系1566.3.2船体姿态测量原理…1576.3.3实验及分析1586.4船姿分析及其补偿…l616.4.1船姿受动因素分析1616.4.2船姿对多波束测量的影响……………………162

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    PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft 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