Matlab优化工具在通用风力机翼型型线设计中的应用
本文重点介绍了，Matlab优化工具在通用风力机翼型型线设计中的应用情况。并进行了设计实例分析第28卷第4期机械设计Vol 28 No 42011年4月JOURNAL OF MACHINE DESIGNApr.2011种有效的动压气体径向轴承承载力数值解法张海军,沈剑英,杨琴(嘉兴学院机电工程学院,浙江嘉兴314001)摘要:考虑动压气体径向轴承中气膜压力变化小的特点,对润滑 Reynolds方程的非线性项进行适当近似,得到线性Reymolds方程。利用有限差分法求解该近似 Reynolds方程,得到动压气体径向轴承的压力分布,分析气体径向轴承性能,计算得出轴承承栽力的大小,并与文献中的实验数据进行比较。与直接数值解相比,该数值解计算结果与实验数据吻合较好。关键词:动压气体径向轴承; Reynolds方程;非线性;有服差分法;中图分类号:TH17.2文獻标识码:A文章编号:1001-2354(2011)04-002-04气体轴承利用润滑膜中的气体压力来实现承载作为两类3:解析数值解和直接数值解。解析数值解方用的。由于所用润滑介质一般为空气,因此气体轴承法,即对非线性 Reynolds方程进行一些近似,求得近似具有摩擦损耗少、速度高、精度高和污染少等特点1。解析解表达式,然后用数值方法求解;直接数值解方法20世纪60~70年代国内外进行气体轴承研究较多,则是对非线性 Reynolds方程直接进行数值近似求解。近年来随着MEMS微动力涡轮研究的兴起,气体轴承 Raimondi利用有限差分法分析了有限长动压气体径的研究又开始受到重视2]。向轴承性能。Peks和 Breuer5采用伪谱法来求解Reynolds方程是分析动压气体径向轴承性能的基 Reynolds方程。戚社苗。等通过数学变换,将动压气本方程,由于气体的可压缩性使 Reynolds方程呈现非体润滑 Reynolds方程变换成标准的椭圆型偏微分方程线性,一般难以求得解析解,因此采用数值方法研究气形式,以 Matlab pde( partial differential equation)工具体径向轴承性能是一种有效途径。数值解方法可以分箱为求解器,实现 Reynolds方程的计算。如·.·············分··心···分·····如·心如·鲁心·心心普·心···心·必·心·心·心·心·心·心鲁●[2 Fuglsang P, Bak C, Gaunaa M, et al. Design and verificaApplication Matlab optimization tool in general profilestion of the Risg- Bl airfoil family for wind turbine[ J]. Jour- design for wind turbine airfoilsnal of Solar Energy Engineering, 2004, 126: 1002-1010WANG Xu-dong WANG Li-cun[3] Timmer W A, Van Rooi A. Summary of the delft universiEngineering Research Centre for Waste Oil Recovery Tech-ty wind turbine dedicated airfoils[ J]. Jourmal of Solar En- nology and equipment, Ministry of Education, Chongqing Technolergy Engineering, 2003, 125: 488-496ogy and Business University, Chongqing 400067, China[4] Bjork A. Coordinates and calculations for the FFA-Wl-xxxAbstract: Based on the optimization algorithm and optimizaFFA-W2-xox and FFA-w3-xxx series of airfoils for horizon- tion tool in Matlab, the optimization mathematical model for the In-tal axis wind turbines[ R ] FFA TN, Stockholm, tegrated expression of general profile for wind turbine airfoils wasSweden, 1990established. By taking the optimization design of the lift and drag[5]苏金明,张莲花,刘波等.MA们AB工具箱应用M]. ratio of wind turbine airfoils as the objective function, taking the co-北京:电子工业出版社,2004.eficients of the general profile control equation as design variables6]钱翼稷.空气动力学[M].北京:北京航空航天大学出 and taking the thickness and curve shape of the wind turbines air-版社,2005foils as the constraints, one airfoil with relative thickness of 18%is[7]王旭东,陈进, Wenzhong Shen,等.风力机叶片翼型型线 designed and the its performances are analyzed. The result has集成设计理论研究[门].中国机械工程,2009,20(2): broadened the design way and method for wind turbine airfoils211-213Key words Matlab; wind turbine airfoil; general profile; op-[8] Drela M. XFOIL 6.8 User Primer[M]. MIT Aero astro, timization algorithmFig 3 Tab0 Ref 8Jixie Sheji"0298咖收稿日期:2010-01-11;修订日期:2010-10-25甚金项目:嘉兴市科技计划资助项目(2008AY2021)作者简介:张海军(1976—),男,山东鱼台人,讲师,硕士,研究方向:气体轴承-转子动力学等。Mat1ab优化工具在通用风力机翼型型线设计中的应用旧WANFANG DATA文献链接作者:王旭东,王立存, WANG Xu-dong, WANG LI-cun作者单位:重庆工商大学,废油资源化技术与装备教育部工程研究中心,重庆,400067刊名:机械设计 ISTIC PKU英文刊名:JOURNAL OF MACHINE DESIGN年,卷(期)本文链接http://d.g.wanfangdata.comcn/periodiCaljxsj201104005.aspx
- 2020-12-09下载
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Lumped Elements for RF and Microwave Circuits (Bahl 2003)
Lumped Elements for RF and Microwave Circuits英文版，射频微波电路入门Lumped Elements for RFand microwave circuitsFor a listing of recent titles in the Artech House Microwave library,turn to the back of this bookLumped Elements for RFand microwave circuitsInder bahlArtech houseBoston londonwww.artechhouse.comLibrary of Congress Cataloging-in-Publication DataBahl, I.J.Lumped elements for RF and microwave circuits /Inder Bahlp cm.--(Artech House microwave libraryncludes bibliographical references and indexISBN 1-58053-309-4(alk. paper1. Lumped elements(Electronics) 2. Microwave integrated circuits. 3. Radiofrequency integrated circuits. 4. Passive components. I. Title. II. SeriesTK7874.54B342003621.38132-dc212003048102British Library Cataloguing in Publication DataBahl, I. J. Inder jit)Lumped elements for RF and microwave circuits.-(Artech House microwave library1. Radio circuits 2. Microwave circuits I. Title621.38412ISBN1-58053-3094Cover design by Igor Valdmar2003 ARTECH HOUSE, INC.685 Canton StreetNorwood Ma 02062All rights reserved Printed and bound in the United States of America. no part of this bookmay be reproduced or utilized in any form or by any means, electronic or mechanical, includingphotocopying, recording, or by any information storage and retrieval system, without permissionn writing from the publisherall terms mentioned in this book that are known to be trademarks or service marks have beenappropriately capitalized. Artech House cannot attest to the accuracy of this information. Useof a term in this book should not be regarded as affecting the validity of any trademark or servicemarkInternational Standard Book Number: 1-58053-309-4Library of Congress Catalog Card Number: 200304810210987654321To my adorable grandsons, Karan and Rohan Kaushal, with whom I play, cry,and laugh, and who have provided me with the idea and inspiration towrite this bookContentsPrefaceXVAcknowledgmentsXXIntroduction1.1 History of Lumped Elcements)Why Use Lumped Elements for rF andMicrowave circuits1.3 L, C, R Circuit Elements1.4 Basic Design of Lumped Elements4.1 Capacitor1.4.2 Inductor4.3 Resistorumped-Element Modelin1. 6 Fabrication1.7 ApplicationsReferencesInductors2.1 IntroductionLumped Elements for RF and Microwave Circuits2.2 Basic Definitions2.2.1 Inductance2.2.2 Magnetic Energy182.2.3 Mutual Inductance202. 2. 4 Effective Inductance202.2.5Imedang2.2.6 Time Constant2.2.7 Quality Factor222.2.8 Self-Resonant Frequency232.2.9aximum Current Ratin2.2.10 Maximum Power Rating2.2.11 Other Parameters232.3 Inductor Configurations242.4 Inductor models2. 4. 1 Analytical Models252.4.2 Coupled-Line Appiroach282.4.3 Mutual Induse arppi342.4.4 Numerical Approach362.4.5 Measurement-Based model382.5 Coupling Between Inductors452.5. 1 Low-Resistivity Substrates2.5.2 High-Resistivity Substrates462.6 Electrical Representations2.6. 1 Series and Parallel representations2.6.2 Network Representations51References52Printed Inductors573.1 Inductors on Si Substrate583.1.1 Conductor Loss3.1.2 Substrate Loss3. 1.3 Layout Considerations3.1.4 Inductor Model3. 1.5 Q-Enhancement Techniques3.1.6 Stacked-Coil Inductor803.1.7 Temperature Dependence84
- 2021-05-07下载
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