高频电路设计与制作 市川裕一.pdf
高频电路设计与制作 市川裕一.pdf 高频电路设计与制作 市川裕一.pdf图字:01-2005-1166号内容简介本书是“图解实用电子技术丛书”之一。全书共分9章。本书首先对高频的基本知识加以介绍,然后在后续的篇章里,对开关、低噪声放大器、混频器、滤波器、检波电路、振荡电路、PLL的设计与制作等进行详细论述。本书全面地阐述了有关高频电路设计的基础理论及其实际制作,且配有大量的印制电路板图、仿真电路等,图文并茂,大大地提高了本书的参考阅读价值本书适合电子通信及其相关领域的工程技术人员参考阅读,也可作为大专院校电子、通信专业学生的课外阅读资料。图书在版编目(CIP)数据高频电路设计与制作/(日)市川裕一,青木胜著;卓圣鹏译;何希才校北京:科学出版社,2006(图解实用电子技术丛书)ISBN7-03-017369-4I.高…Ⅱ.①市…②青…③卓…④何…Ⅲ.高频电路-设计Ⅳ.TN710.2中国版本图书馆CIP数据核字(2006)第058116号责任编辑:赵方青崔炳哲/责任制作:魏谨责任印制:刘士平/封面制作:李力北京东方科龙囹文有限公司制作http://www.okbook.com.cn学寓版出版比京东黄城根北街16号邮政码:100717http://www縹海印剁有限责任公司印刷科学出版社发行各地新华书店经销2006年8月第版开本:B5(720×1000)2007年2月第二次印刷印张:印数:4001-7000字数:271000定价:39.00元(如有印装质量问题,我社负责调换(新欣》)译者序对电路设计而言,高频电路是由具有丰富经验的技术人员进行设计的。所以,高频电路的设计工作重任往往肩负在前辈工程师的身上。因为高频电路涉及的参数很多,设计时受周边电路的影响很大,不仅要考虑电路本身的设计,也要顾及所使用印制基板的材质、厚度和印制布线等。只要设计不当,就会产生寄生电容形成谐振电路,造成信号被衰减或产生噪声,导致无法满足设计要求。因此,高频电路设计人员需要有经验,所谓经验,就是设计时能事先避免一些不合常理的设计以及解决电路设计时所遇到的问题般初学者可能不具备这些能力。但是,随着科技的进步,高频电路设计的门槛逐渐降低,高频电路/微波电路用的仿真软件也得到了快速的发展。不了解高频电路的人,只要使用髙性能仿真软件,就能得到所需要的性能。因此,设计人员只要依照仿真电路,稍具备一些基本设计概念,就能够设计出高频电路。一般说来,虽能靠仿真软件来设计出所期望的电路,但是,最后还是靠人工去完成。因此,设计人员必须不断学习新知识、积累实际操作经验才能顺利地完成设计任务,而本书就是充实自己的一本好书。本书是高频电路设计的入门书,其内容包括:高频的基础知识,开关、低噪声放大器、混频器、滤波器、检波电路、振荡电路以及PLL等的设计与制作。这些设计与制作都是最基本的概念,根据实际的图表加以说明,使初学者能很快进入高频电路设计领域,对一些有经验的设计者而言,本书也是一本不可或缺的参考书本书内容新颖,深入浅出地介绍了高频电路设计。由于时间仓促,立意虽宏,疏漏之处尚祈不吝指教GHz Jidai no Kousyuuha Kairo SekkeiBy yuichi Ichikawa, Masaru AokiCopyright c 2003 by Yuichi Ichikawa. Masaru AokiAll rights reservedOriginally published in Japan by CQ Publishing Co, Ltd, TokyoChinese (in simplified character only) translation rights arranged withCQ Publishing Co, Ltd, JapanGHz時代O高周波回路設計市川裕—青木胜cQ出版株式会社2004著者简介市川裕一1963年生于群马县1985年毕业于群马大学部电子工学科1985年进入日本光电工业(株)1985年进入日本电气电波机器 Engineering(株),从事微波电路设计1988年进人(株)横尾制作所,从事卫星通信用LNB的设计开发1992年进入太阳诱电(株),从事微弱无线组件设计1999年创办 I-Laboratory,从事高频/微波电路的开发、设计与试制,咨询现在出任1 Laboratory代表青木胜1955年生于埼玉县1979年进入八重州无线(株),从事无线通信设备开发1983年进入日本摩托罗拉(株),从事通信设备的信号处理,控制软件的开发现在出任(有)DST代表董事长图解实用电子技术丛书高频电路设计与制作开关/放大器/检波器/混频器/振荡器的技巧详解〔日]市川裕一青木胜著卓圣鹏译何希才校钭学出版北京前言直到最近,所谓“高频”是指在电气电路中一块特殊的领域。那里是“电子技术人员的世界”,尤其在微波电路的设计现场,反复使用小刀加工印制图案,完成焊接铜箔的作业。作者到现在仍然记得,在刚刚进入高频行业时,听公司的前辈说过,“成为一名合格的技术人员,需要花费10年的工夫”。由于在高频领域常采用试探法,因此,也许从事数字电路或低频电路的专业人员看来,高频电路世界是不易接近的领域。然而随着移动电话的迅速普及,蓝牙( Bluetooth)、无线LAN等无线数据通信设备的快速开发,高频电路技术越来越受到关注。直到今天,人们认为“高频、微波设备是面向防卫产业的特殊技术”,但随着时代的变迁成为最先进技术及通信革命中不可或缺的普遍技术。实际上,在以电气大厂家为中心的高频领域,各种行业不同厂家的加入,且此领域中高频电路技术人员难求的局面仍在延续与过去相比,现在高频电路设计门槛变低而容易进入。原因是根据用户的要求,高频电路/微波电路用的仿真软件在迅速发展。不了解高频电路的人,看看学学久而自通,对输入电路进行最佳化,就能简单设计出相应特性的电路。若使用最近高性能的仿真软件,如果是简单的无源电路,有时也能够实际得到趋近预测特性的性能。但是,仿真软件毕竟是工具,是否能有效利用这种工具全凭使用者所具备的经验与理论基础。在实际的高频电路中,由于有仿真软件不能表现的许多电路要素;因此,实际上,一定要考虑肉眼看不见的电路要素,进行元件的配置,绘制印制图案。使用仿真软件的人,由于积累经验、具备知识的不同,完成的性能有很大差异。常听说“在公司只能做确定工作,不能积累各种经验”。此时,最有效的工作方法是使用仿真软件。若使用仿真软件,就能验证工作中所处理电路的工作情况,并进行调整。若使用刊载于文献与书中的电路或仿真软件附属的样品电路,就能够简单处理各种电路。若由仿真得到虚拟经验,并同时进行日常实用电路的设计与调整,就能极大地提高设计能力。这里,作者最想说的是“要积累丰富的经验”,不仅要阅读文献、书籍,还要尽量多地接触电路,自己动手实际制作,并通过测试调整使电路稳定可靠地进行工作。若接触众多电路,即使要必须设计全新电路或无经验电路时,也会取得成功的。本书是以晶体管技术2000年11月~2001年12月的连载与2000年6月特刊内容作为蓝本,内容加以补充,而后编辑而成。第2章以必须理解的内容为最低限度,对设计高频电路时史密斯图的用法和匹配方法进行了说明。高频电路入门者阅读的图书定是以电磁场理论为中心进行讲解,因此,本书尽量删除了一些难以理解的说明。第3章~第9章,是实际设计、试作并评价2GHz频带的各种高频电路本书所试作的电路还不是十分成熟的电路,有许多改善之处。试作相同电路,无问题也正常动作,“成功啦!”由此感到很高兴,但这并不是结束,而是“经验”积累的开始,大家手脑并用,使这种电路具有更佳的特性。采用试探法过程中,或许大家有新的发现。这就是电路特性好过了头,反而会变坏,这也是“经验”。作为积累经验的题材若能利用本书,那是件高兴的事将自己的想法整理出来以文章的形式呈现给大家,这对于作者来说,也是一次很好的学习机会,并且也是积累经验的过程。本人能够承担本书编写工作,感到非常荣幸最后谨向在百忙之中很快完成了第8章和第9章的编写任务的DST公司的青木胜先生,以及为了使本书浅显易懂而做编辑工作的晶体管技术编辑部的寺前裕司先生致以深深的谢意。2002年冬市川裕目录第1章欢迎进入高频世界—一成为高频工程师为目标1.1频带和电路1.2高频电路设计环境的变化………11241.3现在高频电路设计中广泛存在的弊端……第2章高频的基础知识——为了更好地理解高频信号…2.1信号的波长…………2.2高频电路看作分布常数的电路………2.3高频中最重要的工作是传输线的设计…………112.3.1表示传输线电气特性的“特性阻抗”…………112.3.2高频使用的传输线……2.4用分布常数与集中常数制作的高频电路2.5高频中功率比电压与电流更容易处理…162.5.1S参数的概要…………………2.5.2实际高频元件数据表中记载的S参数…2.6用史密斯图求阻抗2.6.1史密斯图222.6.2在史密斯图上描绘阻抗………………………252.6.3元件与传输线路的增加以及史密斯图上的阻抗轨迹………………………262.7高效率地传输高频信号的技术—匹配………302.7.1禁止使用电阻取得匹配……,,,2.7.2阻抗匹配实例1………………322.7.3阻抗匹配实例2…2.7.4匹配电路构成的不同造成输入阻抗特性的差异……………………………3目录2.7.5使用实际元件的匹配电路………2.8实际无源元件的高频阻抗………2.9能发挥高频电路性能的印制基板的设计2.9.1高频电路用印制基板的基础知识2.9.2印制图案的精度与特性阻抗的偏差2.9.3印制图案“弯曲”对特性阻抗的影响……2.9.4邻近接地图案对信号图案的影响2.9.5邻近信号图案的耦合会彼此影响……………第3章开关的设计与制作—控制信号流的技术3.1高频开关的作用与性能……………3.1.1开关的作用……………………3.1.2开关要求的性能……………3.2开关的种类与选择……………3.3高频开关所使用的半导体元件3.3.1PIN二极管…………3.3.2 MESFET……………………………………633.4PIN二极管作为开关元件的特性实验……………63.5开关基本型—SPST开关的种类与特性…3.5.1两种SPST开关…………………………3.5.2SPST开关的接入损耗与隔离特性3.6SPDT开关的种类与动作3.6.1串联型与并联型的组合开关………………753.6.2两种串联型的组合开关……3.7试作的SPDT开关特性的仿真分析3.7.1SPDT开关的规格…………………………793.7.2试作SPDT开关的高频特性+,隔离特性的改善、,单3.8SPDT开关的试作873.9试作SPDT开关基板的初始特性与调整3.10试作前仿真预测与评价结果不同的原因…………95
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cpci express的标准
目前能找到的cpci express总线的标准ContentsIntroduction1.1 Statement of Compliance131.2 Terminology131.3 Applicable Documents181.4 Objectives…191.5 Name and Logo Usage....翻1E,B面201.5.1 Logo Use201.5.2 Trademark polic201.6 Intellectual Property211.7 Special Word Usage221.8 Connectors1.8.1 Legacy CompactPCI Connectors221.8.2 High -Speed Advanced differential Fabric Connectors1.83 UPM Power Connectors∴…251.8.3.1 System Slot/Board and Type 1 Peripheral Slot/Board.251.8.3.2 Switch Slot/ Board261.8.4 eHM C271.8.5 CompactPCI Pluggable Power Supply Connector271.9 Slot and board descriptions281.9.1 Connector Reference Designators...............311.9.2 System Slot and Board1.9.3 Type 1 Peripheral Slot and Board321.9.4 Type 2 Peripheral Slot and Board331.9.5 Hybrid Peripheral slot351.9.6 Legacy Slot1.9.7 Switch Slot and board.36197.13uSwitchSlotandboard.wwwwwww.361.9.7.2 6U Switch Slot and board371.10 EXample Configurations402 Mechanical Requirements452.1 Mechanical Overview452.2 DrayStandard452.3 Units452.4 Keepout Zones452.5 Connector Requirements.452.5.1 ADF Connectors452.5.1.1 Board connectors452.5.1.3 Backplane Connectors with Hot-Plug Suppor o2.5.1.2 Backplane Connectors without Hot-Plug Support46462.5.2 eHM Connectors462.5.2.1 Board Connector Type Designation.462.5.2.2 Backplane Connectors without Hot-Plug Support .........462.5.2.3 Backplane Connectors with Hot-Plug Support..... 462.5.3 UPM Connectors462.5.3.1 Backplane Connectors…………462.5.3.2 Board Connectors without Hot-Plug Support47PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification2.5.3.3 Board Connectors with Hot-Plug Support2.5.4 HM Connectors472.5.5 47-Position Pluggable Power Supply Connector472.6 Chassis Subrack Requirements472.7 Backplane Requirements472.7.1 3U Backplane Dimensions and Connector Locations....... 472.7.2 6U Backplane Dimensions and Connector Locations2.8 Slot Numbering and Glyphs512.9 Board Requirements2.9.1 3U System/Type 1/Type 2 Board Dimensions and ConnectorLocations512.9.2 6U System/Type 1/Type 2 Board Dimensions and ConnectorLocations2.9.3 3U Switch board dimensions and connector locations wwm. 5429.4 6U Switch board dimensions and connector locations.552.9.5 Board pcb thickness562.9.6 ESD Discharge Strip562.9.7 ESD Clip562.9.8 Front Panels562.9.9 CompactPcI Express logo572.9.10 PMC/XMC Support….5729.11 Cross sectional vi582.9.12 Component Outline and Warpage582.9.13 Solder Side Cover(Optional)582. 9.14 Component Heights2.9. 15 System Slot Identification592.10 Rear-Panel 1/0 Board Requirements592.10.1 3U Rear-Panel l/o board dimensions592.10.2 6U Rear-Panel l/o board dimensions3 Electrical Requirements623. 1 Signal Definitions623.1.1 PCI Express Signals.623.1.1.1 PCI EXpress Transmit SigInaIs3.1.1.2 PCI Express Receive Signals623.1.1.3 Interconnect Definition633.1.1.3.1 Link definit633.1.1.3.2 Link Grouping.633.1.1.4 Electrical B643. 1.1.4.1 AC Coupling653.1.1.4.2 Insertion loss653.1.1.4.3 Crosstab‖k3.1.1.4,4 Lane-to-Lane skew3.1.1. 4.5 Equalization673.1.1.4.6 Skew within the Differential Pair(Intra-PairSkew)3.1.1.5 Jitter Budget Allocation683.1.1.5.1 Random Jitter(Rj)683.1.1.5.2 System Level Jitter Distribution693.1.1.5.3 Interconnect Jitter Budget693.1.1.5.4 Eye Patterns703. 1.1.5.5 Type 2 Peripheral Transmitter Eye4PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specification3.1.1.5.6 Controller Transmitter Eye3.1.1.5.7 Type 2 Peripheral Receiver Eye3.1.1.5. 8 Controller Receiver eye743.1.1.5. 9 Backplane Compliance Testing3.1.1.5. 10 Alternative Controller tX measurement.wm.773.1.1.6 Reference Clock783.1.1.6.1Hot-Pug…...….783.1.1.6.2 Clock Fan-Out..793. 1.1.6.3 Clocking dependencies3. 1.1.6.4 AC-Coupling and Biasing793.1.1.6.5 Routing length803. 1.1.6.6 Reference Clock Specification813.1.1.6.7 REFCLK Phase Jitter Specification3.1.2ESD853.1.35VauX.853.1.4 SMBI3.1.4.1 SMBus " Back Powering Considerations883.1.4.2 Backplane Identification and Capability Using SMBus. 883.1.5 PWRBTN# Signal943.1.6 PS ON# Signal.943.1.7 PWR OK Signal.......953.1.8 WAKE# Signal3.1.8. 1 Implementation Note983.1. 9 PERST# Signal993.1.9.1 nitial Power-Up(G3toL0)……………………1003.1.9.2 Power Management States(so to S3/S4 to so)1013.1.9.3 Power down1023.1.10 SYSEN# Signal…1033.1.11 Geographical Addressing1033. 1. 12 LINKCAP Signal1043.1.13/OPin1043.1.14 Reserved pins1043.2 Hot-Plug Support.1043.2.1 Hot-Plug sub-System Architecture1043.2.2 Power enable1073.2.3 Wake#1083.2.4 Module Power good1083.2.5 Present detection1083.2.6 System Management Bus1083.2.7 System Management Bus alert1083.2.8 Attention LED1093.2.9 Attention Switch1093.2.10 DC Specifications1093.3 Backplane Connector Pin Assignments1093.3.1 System SI3.3.1.1 4-Link Configuration1103.3.1.2 2-Link Combination Configuration3.3.2 Peripheral Slot I ype 11133.3. 3 Peripheral Slot Type 2.1153.3.4 Hybrid Peripheral slot.1153.3.5 Legacy slot117PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification3.3.6 Switch Slot1173.3.6.1 3U Switch Slot3.3.6.2 6U Switch Slot x4 Link width1183.3.6.3 6U Switch Slot--X8 Link Width.1213.4 Power Supply Requirements…1233.4.1 Current Available1233.4.2 Regulation and Ripple and noise1243.4.3 Backplane Power Decoupling1243. 4.4 Power Supply Timing1243.4.5 Additional Power Requirements for Boards SupportingHot-Ppluc1254 Keying Requirements4Legacy Slots and Legacy boards12642 eHM Ke126A CompactPCI Express Advanced Differential Fabric Connector......129A 1 General data129A 1.1 Objective of this document.129A.1.2Scope129A.1.3 Intended Method of mounting129A 1. 4 Ratings and characteristics130A.1.5 Normative references130A.1.6 Markings……131A 1.7 Type Designation国131A.1.8 Ordering Information132A 1. 9 Special Connector LoadingsA2 Technical InformationA.2.1 Contacts and terminations133A 3 Dimensional Information134A.3.1 Isometric view and common features.134A 3.2 Engagement Information134A.3. 2.1 Electrical Engagement Length134A.3.2.2 First Contact point135A 3.2.3 Perpendicular to Engagement direction135A.3.2.4 Inclination135A 3.3 Backplane Connectors136A 3.3.1 Dimensions1136A.3.3.2 Contacts136A.3.3.3 Contact Tip Geometry…………137A.3.3,4 Terminations137A. 3. 4 Front board connectors wwwwwwwwwww138A,3. 4. Dimensions.138A 3.4.2 Terminations138A 3.5 Mounting Information for Backplane Connectors138A. 3.5. 1 Hole Pattern on Backplanes139A 3.5.2 Backplane Contact Positional Requirements139A.3.5.3 True position of male contacts.139A.3.6 Mounting Information for Front Board Connectors.140A 3.6.1 Hole Pattern on Printed boards140A 4 Characteristics1416PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specificationA.4.1 Climatic Category141A 4.1.1 Climatic Category Test batch P: Initial EXamination .....141A 4.1.2 Climatic Category Test Batch A: Mechanical Tests.. 141A 4.1.3 Climatic Category Test Batch B: Harsh Environments. 144A.4.1.4 Climatic Category Test Batch C: Damp Heat146A 4.1.5 Climatic Category Test Batch D: ExtendedEnvironmental Tests147A 4.1.6 Climatic Categary Test Batch E: ExtendedEnvironmental Tests148A.4.2 Electrical characteristics148A.4.2.1 Impedance148A 4.2.2 Crosstalk149A.4.2.3 Propagation Delay149A42.4 Differential skew..149A 4.25 Insertion Loss149BEnriched hard-Metric ConnectorB. 1 General data国面国B150B. 1. 1 Objective of this document150B.1.2 Description of the Connector,s Approach150B.1.3 Descriptive Partitions Found Further This document150B 1.4 Normative References15B 1.4.1 Primary references describing the generic Part ofthe co151B.1.42Additionalreferenceswwwwwww.15B.1.5 Intended Method of Mounting151B 1.6 Markings.152B.1.7 Type Designation(General)152B2 Technical Information∴152B 2.1 Definitions152B 2.2 Contacts152B 2.3 Contact Performance Level154B 2.4 Keying154B.2.4.1 Mating rules155B.2.4.2 Examples for mating and nonmating configurations . 156B.2.5 Type Designation156B 2.6 Applicational Information157B 2.6.1 Alignment and Gathering157B26.2 Polarization翻面面∴158B3 Dimensional InformationQB.3.1 General158B.3.2 View and common features158B3.3 Remarks on Mating Properties of eHM Connector…………159B 3. 4 Fixed Board connector160B 3.4.1 Dimensions160B 3.4.2 TerminationsB.3.4.3 Mounting Information for Fixed Board Connectors..161B 3. 4.4 Hole pattern on fixed board161B.3.4 5 Position of connectors on fixed board∴161B 3.5 Free board connectors162B 3.5.1 Dimensions162B 3.5.2 Termination163PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not Design TO/Do Not Claim Compliance To/Do Not Distribute This specificationB.3.5.3 Mounting Information for Free Board Connectors. .......163B 3.5.4 Hole pattern on free board163B 3.5.5 Position of connectors on front board163B4 Characteristics81.163B.4.1 Climatic Category∴163B 4.2 Electrical Characteristics163B.4.2. 1 Creepage and clearance Distances163B 4.2.2 Voltage Proof164B.4.2. 3 Current-Carrying Capacity.164B.4.2.4 Contact resistance.……164B 4.2.5 Insulation Resistance.164B 4.3 Mechanica164B.4.3.1 Mechanical Operation.164B.4.3.2 Engaging and Separating Forces164B 4.3.3 Contact retesert164B 4.3.4 Static Load. Transverse.164B 4.3.5 Gauge Retention Force.164B 4.3.6 Vibration(Sinusoidal.164B 4.3.7 Shock164B 4.3.8 Polarization method165B.4.3.9 Robustness and effectiveness of coding device .........165B.4.3.9.1 Conditions According to IEC60512-7,Test 13e....B165B 5 Test schedule165B.6 Quality Assessment Procedures…………….…..….…......…...165c Universal Power Connector(UPM)166C 1 General data.I....8.4.4面面面..166C.1.1 Objective of this document166C2 Dimensions167C 3 Perpendicular to Engagement Direction169C4 Inclination169C 5 Mounting Information169C 6 Climatic Category.171Figuresg1-1 HM Connectors231-2 Advanced Differential Fabric(ADF) Connector241-3 UPM Power Connector for System and Type 1 Peripheral Slots/Boards..251-4PowerConnectorforswitchslots/boardswwwwww.26-5 eHM Connector1-647- Position CompactS| Pluggable Power Supply Connector……….281-7 CompactPCI Express 3U Slot Examples29-8 Compact PCI Express 6u Slot Examples301-9 System Board311-10 System Slot321-11 Type 1 Peripheral Board321-12 Type 1 Peripheral Slot.331-13 Type 2 Peripheral Board-14 Type 2 Peripheral Slot34PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specification1-15 Hybrid Peripheral slot351-16 Boards Supported By Hybrid Peripheral Slots361-17 3 Switch Board371-18 3 Switch Slot371-19 6U Switch board38-20 6U Switch Slot391-21 Backplane with Hybrid Peripheral Slots and Legacy Slots401-22 Backplane with all Hybrid Peripheral Slots411-23 Backplane with Type 2 and Hybrid Peripheral Slots421-24 3U Backplane with Switch, System, Type 1, and Type 2 Slots1-256 U Backplane with Switch, System,Type1, and type2S∴………43442-1 Backplane Overall Dimensions482-2 30 Backplane connector Locations492-3 6U Backplane Connector Locations502-4 board compatibility glyphs2-5 Glyph for Boards that Operate in Either System or Peripheral Slots512-6 Slot Compatibility Glyphs……512-7 3U System, Type 1, and Type 2 Board Dimensions and ConnectorLocations522-8 6U System/Type 1/Type 2 Board Dimensions and Connector Locations...532-9 3 Switch board Dimensions and connector locations542-106uswItchboarddimensionsandconnectorlocations..w.wwwwww.552-11 Modification to PCB to Support Thicker Boards562-12 CompactPCI Express Logo572-13 Alternate CompactPC| Express Logo....….….…572-14 Approximate Clearance Between the PMC/XMC PCB and the aDFConnector………………..572-15 Board cross-Sectional view82-16 3U Rear-Panel l/o board dimensions,602-17 6U Rear-Panel l/o Board Dimensions613-1 2-Link and Loss definition643-2 Backplane Connector Footprint683-3 Interconnect jitter allocation703-4 Peripheral TX Eye Mask723-5 Controller TX eye Mask733-6 Peripheral RX Eye Mask743-7 Controller RX Eye Mask753-8 Backplane TX Compliance signal763-9 Backplane RX Eye…763-10 Alternative Controller measurement783-11 Biasing for HCSL Clock Input3-12 Biasing Simulation Results.803-13 Single-Ended Measurement for swing.833-14 Single-Ended Measurement Points for delta cross point833-15 Single-Ended Measurement Points for Rise and Fall Time Matching ..........833-16 Differential Measurement Points for Duty Cycle and Period833-17 Differential measurement points for rise and fall time843-18 Differential Measurement Points for Ringback843-19 Eight-Slot Backplane Example913-20 Power Supply Timing95PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification3-21 WAKE Rise and fall time measurement points983-22 WAKE# Circuit Example93-23 Power Up…1013-24 Power Management states1023-25 Power down1033-26 Typical Hot-Plug Interface Implementation1063-27 4-Link Configuration Backplane Example1103-28 2-Link Combination Configuration backplane example112A-1 Sample Part Number with Explanation132A-2 Special Connector Loading 01001面着国面国B面面国33A-3 View of connectors with common features134A-4 Connector Mating Sequence35A-5 Dimensional Drawing of Backplane Connector.136A-6 Contact Geometry for Zone 2 Backplane Connector137A-7 Dimensional Drawing of Front Board Connectors138A-8 Hole Requirements for backplane Connector139A-9 Backplane Pin Contact Positional Tolerance ................................................140A-10 Hole Requirements for the Front Board Connector140B-1 View of Fixed and Free Board Keying Design(Left Perspective, RightDetailed).……155B-2 View of a Mating and a Non-Mating Keying Combination156B-3 View of fixed and free Board connectors..158B-4 View of Fixed Board connector Including polarization Feature.......159B-5 Dimensional drawing of Fixed board eHM connector160B-6 Hole Requirements for eHM on Fixed Board161B-7 Dimensional drawing of eHM Free Board connector…162B-8 Hole Requirements for eHM Free Board Connector............163C-1 UPM-F-7 Female 7-Position power connector dimensional information 167C-2 UPM-F-5 Female 5-Position Power Connector Dimensional Information ....168C-3 Male 7-Position power connector dimensional information168C-4 UPM-M-5 Male 5-Position Power connector dimensional Information169C-5 Hole pattern for 7-Row male uPm Power connector169C-6 Hole pattern for 5-Row male UPM Power connector170C-7 Hole pattern for female 7-Row uPm Power connector..170C-8Holepatternforfemale5-rowuPmpowerconnectorwwww.171Tables3-1 Interconnect Loss Budget Type 1 Peripheral3-2 Interconnect Loss Budget Type 2 Peripheral653-3 Allowable Interconnect Lane-to-Lane skew673-5 Interconnect Jitter buaget on3-4 Total System Jitter Distribution......69703-6 Type 2 Peripheral Transmitter Eye............713-7 Controller TX Compliance Eye Requirements723-8 Type 2 Peripheral RX Compliance Eye Requirements..733-9 Controller RX compliance Eye Requirements743-10 Backplane TX Compliance Signal (Signal Generator)753-11 Backplane RX compliance eye7610PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specification
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