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支持向量机 邓乃扬

于 2021-05-06 发布
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这本书是中科院的邓乃扬、田英杰老师所写,想要深入学习SVM相关理论和算法的同学可以看看这本书,我个人这本书非常好。数据挖掘源于数据库技术引发的海量数据和人们利用这些数据的愿望.用数据管理系统存储数据,用机器学习约方法分析数据、挖掘海量数据背片的知识,便促成了数据挖掘( data mining的产生.慨括地讲,数据挖掘的任务是从大型数据库或数据仓库中提取人们感兴趣的、事先知的、有用的或潜在有用的信息支持向量机( suppoort vector machine.SVM是数据挖握中的项新技术,是借助于最优化方法解决机器学习问题的新工具它最初于20世纪90年代由 Vapnik提出,近年来在其理论研究和算法实方宙都取得∫突破性进,开始成为克服维数灾难”和“过学习”等传统困难的有力手段虽然它还处于飞速发展的阶段,但是它的理论基础和实现途径的基本框架已经形成。白200年开始,国外已续有几本专蓍出版.据我们所知,本是国内第一本专门对它进行全面完整介绍和论述的书籍本书王要以分类问题(模式识别,判别分析)和回归问题为背景,系统阐述支持量机和相应的最优化方法.各章的主要内容如下:第1章介纲最优化问题及其基本理论.第2章对分类闻题和回归问题直观地导出最基本的支持向量机.第3章介绍核的理论,这是推广基本的支持向量机的关键,也是通过线性问题求解非线性问题的基础.第4章介绍统计学习理论,讨论支浡向量机的统计学理论基狲第5章和第6章分别详细研究支持向量分类机和支持向量回U机.第7章介绍实现支持向量机的最优化算法.第8章讨论支持向量机的应用,包括解决实际问题时的一些处理方法和一些应用实例本书包括了我们自己的研究工作例如,在做为支持向量机基础的原始问题和对偶间题解的关系上,我们发现,当前文献的论述存在着逻辑上的缺陷本书第次在完严密的逻辑基础上完善了各种支持向量机中的最优化问题的理论体系此外,作为求解支持向量机中优化问题的方法,本书介绍了我们自已的研究成果如处理大型问题的 Newton-PCG型算法.另外还立说明,本书还包含了我们讨论班成员的若干研究工作本书所设定的读者包括关心理论与应用两方面的人土,对于支持向量机的理论,4有系统而严谨的论述;作为使用支持向量机的入「,有直观的谎明.实际上我们特别强调该书的叮读性,强调崑观对理解问题实质的重要作用.我们通常总是首先用图像等直观手段引进各种概含、方法和结论,并特别注意对它们的本质给予形象的解释和说明,最后给出其严格证明.仅仅关心实际应用的读者,略去这些证明以及若于理论结论,仍可以对所介绍的方法的本质有一个概括的理解本书对有关领域具有高等数学知识的实际下作者是一本实用读物.我们希望本书的出版,能普及和推广支持向量机在多种宴际领域中的应用,也能促进我对支捋向量机的深入研究,特别是促进优化界朋友们的关心与参与本书得以出版,我们要感谢中国科学院科学出版基金和华夏英才基金的资助,冋时乜要感谢十国农业大学各级領导的支持利重点课程建设的资助.本书已被选为中国衣业大学研究生系列教材,我们还要感谢国家自然科学甚金多年来对我们研究工作的资助.本书作者曾致力于最优化方法的饼究多年,儿年前片始组线和领导讨沦班,学与研究数据挖掘利支持向螳柷.除本书位作耆外,讨论班的成以还有上来生教投、薛毅教授、钟萍剴教授、经玲舭教授、张春华、杨志民、刘广利、苏时光等多入,狂这里我们要将别感谢钏萍副教授和张春华.比外,我们还要媵谢刘宝光和张建中两位教授以及梁玉梅、张梅梅两位同学,他们都对本书提供了帮助臼于作者水平所限,书中难免有不要之处,欢迎读者批评指正符号表R实数集合R绁欧氏字间LEi, g洲冻点T={(x1,w)…,(x,y)}训练集洲练点个数输入空间输出空阊x洲练点所仁空间(X×y)练集所在竿间输入向量(输人广模式问量x的第个分量Hilbert空间中的向量x向量x的第个分量输出指标(输出)与的内积?内积空间, Hilbert空间={:1,…,xt输入空间中的个点组成的集合2={xHilber空间中的l个点组成的集合d输人空间到 Silbert空间的映射权向量权向量u的第分量Hi]bert空间中的权向量权向量w的第个分量b网值Co凸壳sang符号函效k(I核函数核矩阵〔Gram矩阵Fp-范数2-范数hv维惩罚参数收缩壳的参数白蚣对数pe底为2的对数将号表松弛变量松弛变量的第x个分量间隔对偶变量, Lagrange乘子寸偶变量的第i个分量通常获示概率分布概率百录序言符号表第1章最优化问题及其基本理论…l■1口■■會■■■■血PPP中11最优化问题1,1,1最优化问题实例1.12最优化问题1.1.3凸最优化12最优生条件1512上无约束问题的最优性条件122约束问题的最优性彖件181.3对偶理论∴131最大最小对偶132 Lagrange对偶■■q381,4注记参考文献…4了第2章求解分类问题和回归问题的宜观途径21分类问题的提出19211例子(心脏病诊断〕4921.2分类问题和分类学习机22线性分类学习机53221线性可分问题的线性分划222近似线性可分闻题的线性分划2.3支持向量分类机…231从性分划到二次分划23.2二次分划算法的简化74233非缓性分划的基本途径24线性回归学习机n+“dk+■啬啬■■■■■F番24.1回归问题242线性回归问题与硬E-带超平面243硬E-芾超平面的构造244硬s-#超平面的推36245线性支持向量回止机25支持向量归机26注记9参考文献第3章核31带述相似性的工具—内积963⊥.1直观的相似程度与内积312支持向量分类机中的相似与内积,983.1.核函数的选取9832考项式空间和多听式核32.1有序单项式空间32.2元序单项式空间1323 FIlbert空间与多项式核函教10433 Mercer核·…··105331半正定矩阵的特征展开15332 Mercer定理与 Mercer核10g34正定核1123.41正定核的必要条件·…·113342正定核的充分条件113343正定核的特征344再生核lber空间11634.5正定核与 MMercer核的关系…73.5核的构造…··11了3.51核的构造原则,·117352落用的几种核函数j2036注记…··:122参考文献123第4章推广能力的理论估计41失函数和期望风险1254.11概率分布125412损失函數413期胡凤险……13242求解分类问题的一种途径和-个算法模型136421分类问题的一个自然的数学提法1:f422求解分类问题的途径141423-个学习算法4.3VC雏44学」算法在概率意义下的近似正确性14G45一致性概念和关键定理日录16结构风险最小化,,,,1524了甚于问隔的推广估计15448注记∵■■■参考文献(2第5章分类问题…51最大间隔原则51.1绒性叮分问题的最大河隔原则52扰动意义下的几何解释■■152找性可分支持向量分类机6i6521线性可分问题的规范超平面522原始最优化问题…523对偶问题及其与原始问题的关系69524线性可分支持向量分类机及其理论基础I7353线性支持向量分类机l7生531原始问题17生532对偶问题及其与原始问题的关系179533线性支持向量分关机及其理论基础l83534支持向量1854支持向量分类机186541可分支持向量分类机…16542支持向量分米机55-支持向量分类机(-SVC)5【-线性支持向量分类机的原始最优化间题552v线性支持向量分类机的对偶问题及其与原始向题的关系553-支持向量分类机然挖554-支持向量分类机的性质指56-支持向量分类机(v-sV)和-支持向量分类机(C-SVC)的关系206561主要结论2郑6562丰要结论的证明57多类分类问题21457.1类对余类215572成对分类2]7573纠错输出编码方法2]8574确定名类目标函数方法218个何子59注记221目录参考文献P「q「第6章回归佔计61回归问题■■■224611可归叵题的难点61.2回归间题的数学提法■1L■…….2266上3不敏感掘失函数22562E-支持向量回归机…….…::,·226.2硬∈带支持向量回机228622从线性6-支持向最回归机到E·支持向量回归机2:363·支持向量回归机··24563L原始最优化问题……·245632对個问题及其与原始问题的关系…,·2486.33-支持向量国归机252634-支持向量回归机的性质25生64E-支持向量回归机(esVR)与p支持向量回妇机{u-SvR的关系641主要结论啁E562主要结论的证明…,2565其他形式的支持向量回归机259G1支持向最回归机的线性规划形式65.2E-带为任意形状的支持向量回归机26266其他形式的损失函数26467一些例子26867l维回归问趣672二维回归间题27068注记■■■司司■卩4■272参考文献血·“·第7章算法71元约束问题解法…2747⊥1无约束问鹎提法记74712基本无约束问题算法…·277713牛顿条件颓优共把梯度法( Newton-PCG算法)29472内点算法21线性规划的原仿射尺度法722线性规划的原-对偶算法723凸二次规划的仿射灵度法724凸二次规划的原-对偶算法P

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You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
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