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基于springboot+oauth2.0+jwtToken鉴权认证开发的后台接口,整套架构采用restful风格,车牌识别,阿里云消息推送,短信接口等

于 2021-05-06 发布
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内容只为接口开发,配合前端和移动app调用使用,不包含html页面,基于springboot+oauth2.0+jwttoken鉴权(内有怎么使用redistoken和数据库token注释)+restful风格+阿里短信+阿里消息推送+车牌识别等。该项目为工作实际使用完整项目

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Units452.4 Keepout Zones452.5 Connector Requirements.452.5.1 ADF Connectors452.5.1.1 Board connectors452.5.1.3 Backplane Connectors with Hot-Plug Suppor o2.5.1.2 Backplane Connectors without Hot-Plug Support46462.5.2 eHM Connectors462.5.2.1 Board Connector Type Designation.462.5.2.2 Backplane Connectors without Hot-Plug Support .........462.5.2.3 Backplane Connectors with Hot-Plug Support..... 462.5.3 UPM Connectors462.5.3.1 Backplane Connectors…………462.5.3.2 Board Connectors without Hot-Plug Support47PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification2.5.3.3 Board Connectors with Hot-Plug Support2.5.4 HM Connectors472.5.5 47-Position Pluggable Power Supply Connector472.6 Chassis Subrack Requirements472.7 Backplane Requirements472.7.1 3U Backplane Dimensions and Connector Locations....... 472.7.2 6U Backplane Dimensions and Connector Locations2.8 Slot Numbering and Glyphs512.9 Board Requirements2.9.1 3U System/Type 1/Type 2 Board Dimensions and ConnectorLocations512.9.2 6U System/Type 1/Type 2 Board Dimensions and ConnectorLocations2.9.3 3U Switch board dimensions and connector locations wwm. 5429.4 6U Switch board dimensions and connector locations.552.9.5 Board pcb thickness562.9.6 ESD Discharge Strip562.9.7 ESD Clip562.9.8 Front Panels562.9.9 CompactPcI Express logo572.9.10 PMC/XMC Support….5729.11 Cross sectional vi582.9.12 Component Outline and Warpage582.9.13 Solder Side Cover(Optional)582. 9.14 Component Heights2.9. 15 System Slot Identification592.10 Rear-Panel 1/0 Board Requirements592.10.1 3U Rear-Panel l/o board dimensions592.10.2 6U Rear-Panel l/o board dimensions3 Electrical Requirements623. 1 Signal Definitions623.1.1 PCI Express Signals.623.1.1.1 PCI EXpress Transmit SigInaIs3.1.1.2 PCI Express Receive Signals623.1.1.3 Interconnect Definition633.1.1.3.1 Link definit633.1.1.3.2 Link Grouping.633.1.1.4 Electrical B643. 1.1.4.1 AC Coupling653.1.1.4.2 Insertion loss653.1.1.4.3 Crosstab‖k3.1.1.4,4 Lane-to-Lane skew3.1.1. 4.5 Equalization673.1.1.4.6 Skew within the Differential Pair(Intra-PairSkew)3.1.1.5 Jitter Budget Allocation683.1.1.5.1 Random Jitter(Rj)683.1.1.5.2 System Level Jitter Distribution693.1.1.5.3 Interconnect Jitter Budget693.1.1.5.4 Eye Patterns703. 1.1.5.5 Type 2 Peripheral Transmitter Eye4PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specification3.1.1.5.6 Controller Transmitter Eye3.1.1.5.7 Type 2 Peripheral Receiver Eye3.1.1.5. 8 Controller Receiver eye743.1.1.5. 9 Backplane Compliance Testing3.1.1.5. 10 Alternative Controller tX measurement.wm.773.1.1.6 Reference Clock783.1.1.6.1Hot-Pug…...….783.1.1.6.2 Clock Fan-Out..793. 1.1.6.3 Clocking dependencies3. 1.1.6.4 AC-Coupling and Biasing793.1.1.6.5 Routing length803. 1.1.6.6 Reference Clock Specification813.1.1.6.7 REFCLK Phase Jitter Specification3.1.2ESD853.1.35VauX.853.1.4 SMBI3.1.4.1 SMBus " Back Powering Considerations883.1.4.2 Backplane Identification and Capability Using SMBus. 883.1.5 PWRBTN# Signal943.1.6 PS ON# Signal.943.1.7 PWR OK Signal.......953.1.8 WAKE# Signal3.1.8. 1 Implementation Note983.1. 9 PERST# Signal993.1.9.1 nitial Power-Up(G3toL0)……………………1003.1.9.2 Power Management States(so to S3/S4 to so)1013.1.9.3 Power down1023.1.10 SYSEN# Signal…1033.1.11 Geographical Addressing1033. 1. 12 LINKCAP Signal1043.1.13/OPin1043.1.14 Reserved pins1043.2 Hot-Plug Support.1043.2.1 Hot-Plug sub-System Architecture1043.2.2 Power enable1073.2.3 Wake#1083.2.4 Module Power good1083.2.5 Present detection1083.2.6 System Management Bus1083.2.7 System Management Bus alert1083.2.8 Attention LED1093.2.9 Attention Switch1093.2.10 DC Specifications1093.3 Backplane Connector Pin Assignments1093.3.1 System SI3.3.1.1 4-Link Configuration1103.3.1.2 2-Link Combination Configuration3.3.2 Peripheral Slot I ype 11133.3. 3 Peripheral Slot Type 2.1153.3.4 Hybrid Peripheral slot.1153.3.5 Legacy slot117PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification3.3.6 Switch Slot1173.3.6.1 3U Switch Slot3.3.6.2 6U Switch Slot x4 Link width1183.3.6.3 6U Switch Slot--X8 Link Width.1213.4 Power Supply Requirements…1233.4.1 Current Available1233.4.2 Regulation and Ripple and noise1243.4.3 Backplane Power Decoupling1243. 4.4 Power Supply Timing1243.4.5 Additional Power Requirements for Boards SupportingHot-Ppluc1254 Keying Requirements4Legacy Slots and Legacy boards12642 eHM Ke126A CompactPCI Express Advanced Differential Fabric Connector......129A 1 General data129A 1.1 Objective of this document.129A.1.2Scope129A.1.3 Intended Method of mounting129A 1. 4 Ratings and characteristics130A.1.5 Normative references130A.1.6 Markings……131A 1.7 Type Designation国131A.1.8 Ordering Information132A 1. 9 Special Connector LoadingsA2 Technical InformationA.2.1 Contacts and terminations133A 3 Dimensional Information134A.3.1 Isometric view and common features.134A 3.2 Engagement Information134A.3. 2.1 Electrical Engagement Length134A.3.2.2 First Contact point135A 3.2.3 Perpendicular to Engagement direction135A.3.2.4 Inclination135A 3.3 Backplane Connectors136A 3.3.1 Dimensions1136A.3.3.2 Contacts136A.3.3.3 Contact Tip Geometry…………137A.3.3,4 Terminations137A. 3. 4 Front board connectors wwwwwwwwwww138A,3. 4. Dimensions.138A 3.4.2 Terminations138A 3.5 Mounting Information for Backplane Connectors138A. 3.5. 1 Hole Pattern on Backplanes139A 3.5.2 Backplane Contact Positional Requirements139A.3.5.3 True position of male contacts.139A.3.6 Mounting Information for Front Board Connectors.140A 3.6.1 Hole Pattern on Printed boards140A 4 Characteristics1416PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specificationA.4.1 Climatic Category141A 4.1.1 Climatic Category Test batch P: Initial EXamination .....141A 4.1.2 Climatic Category Test Batch A: Mechanical Tests.. 141A 4.1.3 Climatic Category Test Batch B: Harsh Environments. 144A.4.1.4 Climatic Category Test Batch C: Damp Heat146A 4.1.5 Climatic Category Test Batch D: ExtendedEnvironmental Tests147A 4.1.6 Climatic Categary Test Batch E: ExtendedEnvironmental Tests148A.4.2 Electrical characteristics148A.4.2.1 Impedance148A 4.2.2 Crosstalk149A.4.2.3 Propagation Delay149A42.4 Differential skew..149A 4.25 Insertion Loss149BEnriched hard-Metric ConnectorB. 1 General data国面国B150B. 1. 1 Objective of this document150B.1.2 Description of the Connector,s Approach150B.1.3 Descriptive Partitions Found Further This document150B 1.4 Normative References15B 1.4.1 Primary references describing the generic Part ofthe co151B.1.42Additionalreferenceswwwwwww.15B.1.5 Intended Method of Mounting151B 1.6 Markings.152B.1.7 Type Designation(General)152B2 Technical Information∴152B 2.1 Definitions152B 2.2 Contacts152B 2.3 Contact Performance Level154B 2.4 Keying154B.2.4.1 Mating rules155B.2.4.2 Examples for mating and nonmating configurations . 156B.2.5 Type Designation156B 2.6 Applicational Information157B 2.6.1 Alignment and Gathering157B26.2 Polarization翻面面∴158B3 Dimensional InformationQB.3.1 General158B.3.2 View and common features158B3.3 Remarks on Mating Properties of eHM Connector…………159B 3. 4 Fixed Board connector160B 3.4.1 Dimensions160B 3.4.2 TerminationsB.3.4.3 Mounting Information for Fixed Board Connectors..161B 3. 4.4 Hole pattern on fixed board161B.3.4 5 Position of connectors on fixed board∴161B 3.5 Free board connectors162B 3.5.1 Dimensions162B 3.5.2 Termination163PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not Design TO/Do Not Claim Compliance To/Do Not Distribute This specificationB.3.5.3 Mounting Information for Free Board Connectors. .......163B 3.5.4 Hole pattern on free board163B 3.5.5 Position of connectors on front board163B4 Characteristics81.163B.4.1 Climatic Category∴163B 4.2 Electrical Characteristics163B.4.2. 1 Creepage and clearance Distances163B 4.2.2 Voltage Proof164B.4.2. 3 Current-Carrying Capacity.164B.4.2.4 Contact resistance.……164B 4.2.5 Insulation Resistance.164B 4.3 Mechanica164B.4.3.1 Mechanical Operation.164B.4.3.2 Engaging and Separating Forces164B 4.3.3 Contact retesert164B 4.3.4 Static Load. Transverse.164B 4.3.5 Gauge Retention Force.164B 4.3.6 Vibration(Sinusoidal.164B 4.3.7 Shock164B 4.3.8 Polarization method165B.4.3.9 Robustness and effectiveness of coding device .........165B.4.3.9.1 Conditions According to IEC60512-7,Test 13e....B165B 5 Test schedule165B.6 Quality Assessment Procedures…………….…..….…......…...165c Universal Power Connector(UPM)166C 1 General data.I....8.4.4面面面..166C.1.1 Objective of this document166C2 Dimensions167C 3 Perpendicular to Engagement Direction169C4 Inclination169C 5 Mounting Information169C 6 Climatic Category.171Figuresg1-1 HM Connectors231-2 Advanced Differential Fabric(ADF) Connector241-3 UPM Power Connector for System and Type 1 Peripheral Slots/Boards..251-4PowerConnectorforswitchslots/boardswwwwww.26-5 eHM Connector1-647- Position CompactS| Pluggable Power Supply Connector……….281-7 CompactPCI Express 3U Slot Examples29-8 Compact PCI Express 6u Slot Examples301-9 System Board311-10 System Slot321-11 Type 1 Peripheral Board321-12 Type 1 Peripheral Slot.331-13 Type 2 Peripheral Board-14 Type 2 Peripheral Slot34PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specification1-15 Hybrid Peripheral slot351-16 Boards Supported By Hybrid Peripheral Slots361-17 3 Switch Board371-18 3 Switch Slot371-19 6U Switch board38-20 6U Switch Slot391-21 Backplane with Hybrid Peripheral Slots and Legacy Slots401-22 Backplane with all Hybrid Peripheral Slots411-23 Backplane with Type 2 and Hybrid Peripheral Slots421-24 3U Backplane with Switch, System, Type 1, and Type 2 Slots1-256 U Backplane with Switch, System,Type1, and type2S∴………43442-1 Backplane Overall Dimensions482-2 30 Backplane connector Locations492-3 6U Backplane Connector Locations502-4 board compatibility glyphs2-5 Glyph for Boards that Operate in Either System or Peripheral Slots512-6 Slot Compatibility Glyphs……512-7 3U System, Type 1, and Type 2 Board Dimensions and ConnectorLocations522-8 6U System/Type 1/Type 2 Board Dimensions and Connector Locations...532-9 3 Switch board Dimensions and connector locations542-106uswItchboarddimensionsandconnectorlocations..w.wwwwww.552-11 Modification to PCB to Support Thicker Boards562-12 CompactPCI Express Logo572-13 Alternate CompactPC| Express Logo....….….…572-14 Approximate Clearance Between the PMC/XMC PCB and the aDFConnector………………..572-15 Board cross-Sectional view82-16 3U Rear-Panel l/o board dimensions,602-17 6U Rear-Panel l/o Board Dimensions613-1 2-Link and Loss definition643-2 Backplane Connector Footprint683-3 Interconnect jitter allocation703-4 Peripheral TX Eye Mask723-5 Controller TX eye Mask733-6 Peripheral RX Eye Mask743-7 Controller RX Eye Mask753-8 Backplane TX Compliance signal763-9 Backplane RX Eye…763-10 Alternative Controller measurement783-11 Biasing for HCSL Clock Input3-12 Biasing Simulation Results.803-13 Single-Ended Measurement for swing.833-14 Single-Ended Measurement Points for delta cross point833-15 Single-Ended Measurement Points for Rise and Fall Time Matching ..........833-16 Differential Measurement Points for Duty Cycle and Period833-17 Differential measurement points for rise and fall time843-18 Differential Measurement Points for Ringback843-19 Eight-Slot Backplane Example913-20 Power Supply Timing95PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification3-21 WAKE Rise and fall time measurement points983-22 WAKE# Circuit Example93-23 Power Up…1013-24 Power Management states1023-25 Power down1033-26 Typical Hot-Plug Interface Implementation1063-27 4-Link Configuration Backplane Example1103-28 2-Link Combination Configuration backplane example112A-1 Sample Part Number with Explanation132A-2 Special Connector Loading 01001面着国面国B面面国33A-3 View of connectors with common features134A-4 Connector Mating Sequence35A-5 Dimensional Drawing of Backplane Connector.136A-6 Contact Geometry for Zone 2 Backplane Connector137A-7 Dimensional Drawing of Front Board Connectors138A-8 Hole Requirements for backplane Connector139A-9 Backplane Pin Contact Positional Tolerance ................................................140A-10 Hole Requirements for the Front Board Connector140B-1 View of Fixed and Free Board Keying Design(Left Perspective, RightDetailed).……155B-2 View of a Mating and a Non-Mating Keying Combination156B-3 View of fixed and free Board connectors..158B-4 View of Fixed Board connector Including polarization Feature.......159B-5 Dimensional drawing of Fixed board eHM connector160B-6 Hole Requirements for eHM on Fixed Board161B-7 Dimensional drawing of eHM Free Board connector…162B-8 Hole Requirements for eHM Free Board Connector............163C-1 UPM-F-7 Female 7-Position power connector dimensional information 167C-2 UPM-F-5 Female 5-Position Power Connector Dimensional Information ....168C-3 Male 7-Position power connector 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  • 基于ITK、VTK与MFC读取DICOM图像
    基于ITK,VTK以及MFC读取DICOM图像的文献@ErtoRwww.crter.org吕哧琪,等于1K、K和MC的DCOM图像读写及显示文章是在视类的构造函数及其析构函数中实现它们的初始化及善后工作的。其次,改写视图类的虚函数Ocrea(),以下为关键代码ren Win->AddRenderer(ren);renWin->Setwindowld(m hWnd)iren->SetRenderWindow(ren Win)最后,在视图类的 OnDraw函数中添加绘制代码Render()当然窗口的尺寸也可以在这里进行调整。Figure 5 Unintegrated display effect此,可以在MFc应用稈序视图区域中实现与VTK图5未集成显示效果渲染对象的父互和鼠标响应操作,并可以利用MFC界面控件来进行参数控制,本文程序中鼠标按下会弹出一个对于VTK与MFC的集成已有相关文献介绍,分为快显示图像上象素坐标及象素值的消息框(见图7,8)借以速集成和深度集成两种集成方式。图6是作者将图5对应说明鼠标响应交互操作的实现,至此完成了TK与MFC序做了怏速集成后 DICOMA像的显示。集成过程只需的深度集成。读者也可以参考ⅤTK工具包 Examples设置 vtk RenderWindow类中的 SetParent函数为当前 GUlIn32MFC下的例程,实现更丰富的集成。该视图或对话框句柄即可,关键代码如下所示和集环覓下的面显示将结合后续DCOM文件显示tkRenderwindow部分给出。FrenWin=vtkRenderWindow: NewovtkRenderWindowlnteractoriren=vtkRenderWindowInteractor Newothis->renWin->SetParentld(this->m hWnd);this->iren->SetRenderWindow(this->renIn);Figure 7 Display effect of vik depth integration图7深度集成环境下VTK显示效果Figure 6 Display effect of fast integration图6快速集成显示效果快速集成屏蔽」MFC的鼠标响应和消息传递,不便于后续编程实现更复杂的功能。VTK与MFC集成的请为:0007000根本目的是实现更实用、更灵活的交互界面,以弥补VTK自身在该方面的缺憾,那么就要求不仅要将TK的渲染窗口嵌入于MFC应用程序视图区域,而且还要Figure 8 Display effect after flipping图8翻转后VTK显小效果使其融为一体,即拥有一个统一的具有友好交互能力的界面。在此,重点介绍下作者尝试实现VTK与MFC深度集成的另一种方法,具体步骤如下:首先,在视类中增2D|cOM图像的读写与显示加可视化管道中会用到的类,用这些类实例化对象,文章用到的对象有:渲染对象ren)、渲梨窗口( renin)、2.1DCOM图像的读写文章中的数据对象是一维交互对象(ren)、演员( BrainActor)、映射( Brain Map)等, DICOM图像。读与DCOM文件的功能使用∏TK提供的范o1994-2011ChinaAcadcmicJournalElcctronicPublishingHousc.Allrightsroscrved.http://www.cnki.nctcn.zglckf.com2418P.O. Box 1200, Shenyang 110004吕烧琪,等干K、VTK和MFC的DCOM图像读写及显示CRTOR Ww. cRTER org函功能来实现,在∏K中,DCOM的范函性由GDCM厍写DcOM文件是一件非常精密的操作,因为所要处理的提供。这个开放的源码厍由INSA_Lyon的 creats团队发是大量重要的有关患者详细而精确的数据,并且涉及到展的。实验使用: GDCMImagelO类来建立与GDCM库患者的隐私问题。所以在写的过程中,一定要核实出你的连接,实现读取 DICOM图像的功能。|TK数据处理管的代码所生成的头文件信息不会给患者的治疗和诊断道中的三种处理对象具休为:Sσurce采用带来风险,要确休沿着数据处珄管道正桷地传递DC○Mik: itklmage SeriesReader类; Filter来用了ik∷文件的细节信息,从而才能保证正确地将原D|COM文件Curvature FlowImage Filter; Mapper采用了itk:的这些信息写入新的DcOM序列图像文件。以下便是实itkImageFileWriter类。现该部分内容的主要代码:单张二维DCOM图像的读写:本部分实现单张二维首先定义图像类型,并明确所选象素类型和维度,p|c○M图象以 DICOM格式读入与以DCOM格式写入从而定义序列图像读取类型。的工作。首先声明象素类型和图像的维数,以它们作为typedef signed short PixelType模板参数来实例化读入图像的类型,用该图像类型作为const unsigned int Dimension=3;模板参数再实例化读取器 Reader的类型并创建一个typedef itk: Image< PixelType, DimensionReader,将读入图像的文件路径和文件名作为参数传给 mage Type;Reader,并为 Reader关联 GDCMImagelO对象,调用typedef itk: Image SeriesReader< Image TypeUpdate(函数更新读取过程,DcOM图像就已读入内存 ReaderType中。用 Reader的 Getoutput()方法可以获得图像数据的接下来声明并实例化实际读写DCOM图像的指针。月前的焦点是如何再一次将图像在新文件中保存k: GD CMImagelC对象和为所有切片生成文件名并排成DCOM格式。具体的,先实例化一个 Image File Writer序的tk: GDCMSeries fileNames对象,并创建相应智能类型,并创建指针 Writer,将写入的图像的文件路径和指针 gdcmIO和 names Generator。文件名作为参数传给 Writer,并为其关联ImageloType: PointerGDCM| magelo对象,这个对象是知道DCOM格式的内 gdcmIo= magelOType:New()部结构的,最后用 Update()来触发写入程序。文章在读Names Generator Type: Pointer写过稈中对图像进行了保留边缘的平滑去噪处珥,以下 names Generator= Names GeneratorType:|New()为主要代码names Generator->SetInputDirectory(argvImageloType: Pointer生成读入文件的文件名gdcmImagelo=ImageloType: NeW(const ReaderType: FileNames Containerreader->Setlmagelo(gdcmImagelO)filenames=namesGenerator->GetInput FileNames():reader> SetFileName(argv):∥参数为文件路径实例化 Reader Type对象并创建智能指针 reader,读及文件名取DcOM格式序列图像。writer->Setlmagelo(gdcmImagelO)reader->Setlmagelo(gdcmlO)rwriter->SetFileName(argv2);∥将平滑后图像以reader->SetFileNames(filenames )D|COM格式写入到参数所指定的文件中。最后用 reader的 Update()触发读取程序,最好放在try/catch问询块中,在此不再赘述。CurvatureFlowImageFilterType: Pointer至此,可以开始写数据了。首先把确定存在的输出smoother= rvatureFlowlmageFilterType:|New();∥目录传给 outputDirectory指针。实例化一个平滑滤波器的对象const char outputDirectory=argv;smoother-> SetNumberoflterations(5):W平滑滤波然后,实例化 SeriesWritertype对象并创建智能指器的迭代次数设为5针 series writer,将 reader的输出写为D|COM格式序列smoother-> SetTime Step(0.125);∥平滑滤波器的像时间步长设为0125series Writer->SetInput(reader->Getoutput()smoother->SetInput(reader->Getoutputo)series Writer->Setlmagelo(gdcmIO)writer->Setlnput(smoother->GetOutputO)现在可以设置 G DCMSeriesFileNames在至此完成DCOM单张图像的读写。outputDirectory下产生新的文件名,然后将最新生成的序列二维DCOM图像的读写:这部分}要实现以文件文件传递给 seriesWriter集的方式读取一个DCOM序列图像,并在保持头文件信namesGenerator->SetoutputDirectoryoutputDire息不变的情况下保存为另一个DCOM序列图像的工作。 ctory);/S SN 1673-8225 CN 21-1539/R CODEN: ZLKHAH2419C1994-2011ChinaAcadcmicJOurnalElcctronicPublishingHousc.Allrightsrcscrved.http://www.cnki.nct@RterwWw.crtEr. org吕晓琪,等基于1K、VK和MFC的DCOM图像读写及显示seriesWriter->SetFileNames(names Generator->GetOutputFileNames();3结论最后一步也是最关键的一步,用 reader读取MetaDataDictionary并传递给 seriesWriter。之所以关键TK是算法设计者的一个有力助手,是医学图像处是因为 Meta Data Dictionary包含」所有输入的DcoM理工作者的案例研究算法仓厍,遺憾的是不提供Ul文件的头文件。VTK软件开发包强大的图形处理和可视化功能,却缺乏seriesWriter> SetMetaData Dictionary Array( reade实用、灵活的交互界面,而MFC具有强大的U开发能力。r->GetMetaData DictionaryArray ()结合三者的特点,作者通过对DCOM医学图像的读取与末了调用 seriesWriter的 Update)触发写程序,放在显小,将TK、VTK和MFC有机的结合起来,扬长避短,try/catch问洵块中,在此不再赘述。为三者集成环境下的软件开发做了一个初步的尝试,而22DCOM图像的显示本部分主要介绍在前述方法对于在此基础之上一者更强大功能的实现(诸如医学图实现的∨TK、ITK和MFC集成环境卜DCoM图像的显示像的分割与准、三维可视化、虚拟手术导航等)有待方法。在此,将利用丨TK读取的DC○M文件用VTK显示深入探讨与研究。在MFC单文档视图区,因为旨在说明方法所以未给出复杂的交互界面。4参考文献VTK薮据处理管道中采用了vkD|cOM|mageReader:类、 teNderer类、 vtkRenderwindow类、[1 Kitware Inc. NLM Insight Segmentation and registration ToolkitEB/OL」2005.http:/www.itκOrgtkRenderwindowInteractor类、 traCtor2D类、[21 Ackerman MJ. the visible human project. Proceedings of thelEEE,1998;863):501-504.v+ < Mapper类,并实例化各个类的对象并创建相21/mD(Q小用m时应智能指针。图7为显示效果,相应关键代码如下计算机技术发,200816(4=515 NEMA. The DICOM standard. Technical report, NEMA,Brain Map->SetInput(vtkreader->Getoutput()http://medial.nemaorg,2004[61http:/www.itk.org/courseWare/training/gettIngstartedl-webpageBrainActor->SetMapper (BrainMap);ren->AddActor(BrainActor)http:ww.kitwvare.comiproducts/books/vtkquide.htmlBenoit Regrain EricBoix, Mathieu and Jean Pierre roux. the「TK所读取的图像一经VTK显示后图像发牛了翻GDCM Library. CNRS, INSERM, INSALyon, UCBLyonhttp://www-creatis.insa-lyon.fr/publIc/gdcm转,并且是上下翻转而左右并不发生翻转,原因是ITK的坐标系统和VTK的坐标系统Y轴是相反的,所以为了来自本文课题的更多信息能正确显示图像还需要将Y轴进行翻转,可见这种翻转墓金资助:国家自然科学基金资助项目(60761002)可以发生在两种情形,一种是在K读入图像的时候翻作耆贡:笫一作者进行实验设计及评估,实验实施转即改变文件的读取方式,该种方式可参考∏TK的为笫二作者,资料收集为笫三作者,第二作者成文,第FliplmageFilter类,该类可以实现翻转任何坐标轴中的作者审校并对文章负责图像,对于本文屮情形可以使用一个[0,们翻转排列,列益冲突:课题未涉及任何厂家及相关雇主或其灺经表示X轴保持不变时对Y轴进行翻转;另一种是在K图济组织直接或间接的经济或利益的赞助像薮据凵经转换为ⅥTK图像数据后将新的TK图像数本文创新性:于201101以文章关键词为检索关键词据Y轴鄱转,这也正是本文实现的图像翻转方法。相应在CNK丨欻捃库、维普中文科技期刊数据库、万方学位论关键代码:文全文数据库, ELSEVIER数据库等多个数据库中检索未flipY->SetFilteredAxis(1)见具有相同创新点文章flipY->SetInputConnection(vtkreader->Getoutput方法创新:为医学图像读写及显示后一系列的玉学Eort()像处理工作搭建了灵活实用的实验平台,进而得到相关基BrainMap->SetInput(flipY->GetOutput():金资助。以上便是集成环境下的D|COM图像显小。o1994-2011ChinaAcadcmicJournalElcctronicPublishingHousc.Allrightsroscrved.http://www.cnki.nctCn.zg/ckf.com2420P.O. Box 1200, Shenyang 110004
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