利用Hilbert变换提取信号瞬时特征的算法实现
研究了在工程中如何通过算法来实现利用 Hilbert 变换提取信号的瞬时特征。深入地分析了如何利用数值微分法提高提取瞬时频率特征的精度。最后,给出了一种可行的算法,并通过实验验证了这种方法可以在工程中有效地提取信号的瞬时频率特征。84微机发展第13卷①H(x)=y;H(x)=y;(i=0,1,…n)(j=0,1(11)②在每个小区间/x1,x1+17i=0,1,…,n-1)上由相关定理知:当划分的小区间的长度趋于零时H(x)是三次多项式。s(x)及其一至三阶导数分别一致收敛到f(x)及其一至可以写出分段三次 Hermite插值函数的分段表达式:三阶导数。所以用三次样条插值函数去近似表达用离散值(x)=(1+2x-x过+)2v;+表示的原函数,具有较高的可靠性。3)两种插值的比较挨尔米特 Hermite插值较三次样I-i,1+2条插值具有较好的稳定性与收敛性,但它只能休让各段曲线在连接点上的连续性,而不能保证整条曲线在这些点上y+1Ditl的光滑性。而有时不仅要求曲线连续,而且要求曲线的曲X/(i=0,18)率也连续即要求分段插值函数具有连续的一阶导数,埃H(x)的导数为尔米特 Hermite插值此时就不能满足上述要求6次样条插值较埃尔米特 Hermite插值具有较好的H(x光滑程度,用三次样条插值函数求数值导数比用埃尔米特+2(x-x2(xHermite插值可靠性大,但计算比较复杂,二者的区别见图h2yV+17, h(i-0,12)三次样条插值。已知函数y=f(x)在区间/a,b上的n+1个节点上的值y=f(x;)(i=0,1,…m),求插值函数s(x),使(i=0,1图4 Hermite插值与三次样条插值的比较图2在每个小区间x,x+1(=0.1.…n-1)上利用埃尔米特 Hermite插值得到的2FSK信号的瞬时s(x是三次多项式,记为s(x频率见图5,利用二次样条插值得到的该信号的瞬时频率③3(x)在la,b/上二阶连续可徵。见图6。数s(x)称为f(x)的三次样条插值函数可以利用节点处的二阶导数值为参数,也可以利用节点处的导数值为参数求三次样条插值涵数的表达式。若利用节点处的一阶导数值为参数,求得的三次样条插值函数的表达式为(x)=M-1x-x-)36 h6 hMihi5 DEMeN5a亩pai66hx∈[x;,x+17,b-x+1-x,S"(x)=M图5由 Hermite插值提取图6由三次样条插值提取(j=0,1的2FSK信号的瞬时频率的2FSK信号的瞬时频率对s(x)进行求导,利用S(x)在节点处一阶导数连从图5、图6可以看出利用三次样条插值得到的瞬时续的性质结合边界条件求解出参数M,把求得的参数代频率可以准确反映出信号具有的的摒时频率特征而利用入公式(10),即得三次样条插值函数的s(x)分段表示式。埃尔米特 Hermite插值得到的瞬时频率与信号具有的瞬s;(x)的导数为时频率特征不符。这是因为利用数值微分法求瞬时频率插值以后喫进行求导。三次样条插值函数具有连续的二阶M2 hiM; 2 hj导数,因而具有较好的光滑程度,符合求导条件,所以可以J+1-h(M2+1-M/)准确求出信号的瞬时频率;而埃尔米特 Hernite插值.不够光滑,虽能保证插值多项式收敛于原函数,但不能保证插x Elx,x;+1 h,=xi+I-x, S(xj )=M;值多顷式的导数收敛于原函数的导数,所以求得的值与信o1994-2010ChinaAcademicJournalElectronicPublishingHouse.Allrightsreservedhttp://www.cnki.net第6期刘慧婷等:利用 Hilbert变提取信号瞵时特征的算法实现号实际的瞬时频率值不符。实验结果和理论分析结果是(1) Hilbert变换只能近似应用于窄带信号,即形如纹的(t)=a(1)cosu+6(1)),其中>>B(B为信号带2.3.3结论宽)的信号。但实际应用中,存在许多非窄带信号, Hilbcrt利用数值微分法求瞬时频率ω(t)的步骤可以归纳变换对这些信号无能为力为:首先通过三次样条插值得到分段多项式p(1),(2)对于任意给定时刻,通过 Hilbert变换运算后的结pp(抄);然后分别对分段多项式p(t),Pp()关于变量t果只能存在一个频率值,即只能处理任何时刻为单一频率进行求导,得到pd(,ppd(t);最后求出每一时刻t所对的信号。这显然不合理,因为在实东中同一信号会含有多应的导数值,即求得t(t,u(t)。再把求得的值代入公种频率成分式(6)就完成了提取瞬时频率ω(1)的过程。求解结果见(3)对信号进行 Hilbert变换时,信号的两端会出现严图7重的端点效应。提取某些信号瞬时特征所得的瞬时频率在局部出现了负数,端点效应是造成负频率的一个原因而端点效应可以通过利用特征波对原有数据序列进行延拓的方法来解决,具体解决办法将在今后讨论。尽管目前出现了EMD担论4,其目的是将不满足Hibt变换的信号进行分解得到若干个IMF( intrinsic mode function),然后进行 Hilbert运算,达到提取信号瞬时特征的目的。该理论开辟了信号处理的新空间。但它还不够成熟还需喫进一步的完善和研究图7利用数值微分法提取信号的瞬时频率特征参考文献从图7可以看出,以三次烊条指值进行的数值微分可[]黄长蓉. Hilbert变换及其应用[J].成都气象学院学报以准确岀提取岀信号的瞬时频率特征。199,14(3):273-276.[2]杨小牛,楼A义,徐建良.软件无线电原理与应用[M].北3结束语京:电子工业出版社,2001在工程中, Hilbert变换使得我们对短信号和复杂信号[3]丁丽妤.数值计算方法[M].北京:北京理工大学出版社,的摒时特征的提取成为可能特别是对瞬时频率特征提1997取,在工程中具有十公重要的意义。文中讨论的利用三次[4] Huang N e. The empirical mode decomposition and the hilbert样条插值进行数值徵分以提取瞬时特征的方法是可行的,spectrum for nonlinear and nor stationary time series anal ysis但还存在着如下问题。[].Proc.R.soc.Lond.A,1998,454:903-995(上接第81页)218994。例22(x)=(1-2siny=223101075一般的(A算法计算了120代,求到的最大值为454176.219。154370083改进的α算法计算了34代,求到的最大值为1048575.875。改进后的αA算法收敛速度(指迭代次数)比一般GA算法几乎快了一个数量级,精度也提高了不少,特别是例2的最大值提高一倍多,速度提高这么快是未曾料到的y=74958参考文献+4X Axl Thla[1]陈国良.遗传算法及其应用[M]·北京:人民邮电出版社,图2函数2的图像1996一般GA算法计算了20代,求到的最大值为[2]袁亚湘,孙文瑜.最优化理沦与方法[M]北京:科学出版社,19991.218983[3]张铃,张钹·遗传算法杋理的硏究[J]·软件学报,改进(A算法计算了5代,求到的最大值为2000,11(7):945952o1994-2010ChinaacAdemicJournalElectronicPublishingHouse.Allrightsreservedhttp://www.cnki.net
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cpci express的标准
目前能找到的cpci express总线的标准ContentsIntroduction1.1 Statement of Compliance131.2 Terminology131.3 Applicable Documents181.4 Objectives…191.5 Name and Logo Usage....翻1E,B面201.5.1 Logo Use201.5.2 Trademark polic201.6 Intellectual Property211.7 Special Word Usage221.8 Connectors1.8.1 Legacy CompactPCI Connectors221.8.2 High -Speed Advanced differential Fabric Connectors1.83 UPM Power Connectors∴…251.8.3.1 System Slot/Board and Type 1 Peripheral Slot/Board.251.8.3.2 Switch Slot/ Board261.8.4 eHM C271.8.5 CompactPCI Pluggable Power Supply Connector271.9 Slot and board descriptions281.9.1 Connector Reference Designators...............311.9.2 System Slot and Board1.9.3 Type 1 Peripheral Slot and Board321.9.4 Type 2 Peripheral Slot and Board331.9.5 Hybrid Peripheral slot351.9.6 Legacy Slot1.9.7 Switch Slot and board.36197.13uSwitchSlotandboard.wwwwwww.361.9.7.2 6U Switch Slot and board371.10 EXample Configurations402 Mechanical Requirements452.1 Mechanical Overview452.2 DrayStandard452.3 Units452.4 Keepout Zones452.5 Connector Requirements.452.5.1 ADF Connectors452.5.1.1 Board connectors452.5.1.3 Backplane Connectors with Hot-Plug Suppor o2.5.1.2 Backplane Connectors without Hot-Plug Support46462.5.2 eHM Connectors462.5.2.1 Board Connector Type Designation.462.5.2.2 Backplane Connectors without Hot-Plug Support .........462.5.2.3 Backplane Connectors with Hot-Plug Support..... 462.5.3 UPM Connectors462.5.3.1 Backplane Connectors…………462.5.3.2 Board Connectors without Hot-Plug Support47PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification2.5.3.3 Board Connectors with Hot-Plug Support2.5.4 HM Connectors472.5.5 47-Position Pluggable Power Supply Connector472.6 Chassis Subrack Requirements472.7 Backplane Requirements472.7.1 3U Backplane Dimensions and Connector Locations....... 472.7.2 6U Backplane Dimensions and Connector Locations2.8 Slot Numbering and Glyphs512.9 Board Requirements2.9.1 3U System/Type 1/Type 2 Board Dimensions and ConnectorLocations512.9.2 6U System/Type 1/Type 2 Board Dimensions and ConnectorLocations2.9.3 3U Switch board dimensions and connector locations wwm. 5429.4 6U Switch board dimensions and connector locations.552.9.5 Board pcb thickness562.9.6 ESD Discharge Strip562.9.7 ESD Clip562.9.8 Front Panels562.9.9 CompactPcI Express logo572.9.10 PMC/XMC Support….5729.11 Cross sectional vi582.9.12 Component Outline and Warpage582.9.13 Solder Side Cover(Optional)582. 9.14 Component Heights2.9. 15 System Slot Identification592.10 Rear-Panel 1/0 Board Requirements592.10.1 3U Rear-Panel l/o board dimensions592.10.2 6U Rear-Panel l/o board dimensions3 Electrical Requirements623. 1 Signal Definitions623.1.1 PCI Express Signals.623.1.1.1 PCI EXpress Transmit SigInaIs3.1.1.2 PCI Express Receive Signals623.1.1.3 Interconnect Definition633.1.1.3.1 Link definit633.1.1.3.2 Link Grouping.633.1.1.4 Electrical B643. 1.1.4.1 AC Coupling653.1.1.4.2 Insertion loss653.1.1.4.3 Crosstab‖k3.1.1.4,4 Lane-to-Lane skew3.1.1. 4.5 Equalization673.1.1.4.6 Skew within the Differential Pair(Intra-PairSkew)3.1.1.5 Jitter Budget Allocation683.1.1.5.1 Random Jitter(Rj)683.1.1.5.2 System Level Jitter Distribution693.1.1.5.3 Interconnect Jitter Budget693.1.1.5.4 Eye Patterns703. 1.1.5.5 Type 2 Peripheral Transmitter Eye4PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specification3.1.1.5.6 Controller Transmitter Eye3.1.1.5.7 Type 2 Peripheral Receiver Eye3.1.1.5. 8 Controller Receiver eye743.1.1.5. 9 Backplane Compliance Testing3.1.1.5. 10 Alternative Controller tX measurement.wm.773.1.1.6 Reference Clock783.1.1.6.1Hot-Pug…...….783.1.1.6.2 Clock Fan-Out..793. 1.1.6.3 Clocking dependencies3. 1.1.6.4 AC-Coupling and Biasing793.1.1.6.5 Routing length803. 1.1.6.6 Reference Clock Specification813.1.1.6.7 REFCLK Phase Jitter Specification3.1.2ESD853.1.35VauX.853.1.4 SMBI3.1.4.1 SMBus " Back Powering Considerations883.1.4.2 Backplane Identification and Capability Using SMBus. 883.1.5 PWRBTN# Signal943.1.6 PS ON# Signal.943.1.7 PWR OK Signal.......953.1.8 WAKE# Signal3.1.8. 1 Implementation Note983.1. 9 PERST# Signal993.1.9.1 nitial Power-Up(G3toL0)……………………1003.1.9.2 Power Management States(so to S3/S4 to so)1013.1.9.3 Power down1023.1.10 SYSEN# Signal…1033.1.11 Geographical Addressing1033. 1. 12 LINKCAP Signal1043.1.13/OPin1043.1.14 Reserved pins1043.2 Hot-Plug Support.1043.2.1 Hot-Plug sub-System Architecture1043.2.2 Power enable1073.2.3 Wake#1083.2.4 Module Power good1083.2.5 Present detection1083.2.6 System Management Bus1083.2.7 System Management Bus alert1083.2.8 Attention LED1093.2.9 Attention Switch1093.2.10 DC Specifications1093.3 Backplane Connector Pin Assignments1093.3.1 System SI3.3.1.1 4-Link Configuration1103.3.1.2 2-Link Combination Configuration3.3.2 Peripheral Slot I ype 11133.3. 3 Peripheral Slot Type 2.1153.3.4 Hybrid Peripheral slot.1153.3.5 Legacy slot117PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification3.3.6 Switch Slot1173.3.6.1 3U Switch Slot3.3.6.2 6U Switch Slot x4 Link width1183.3.6.3 6U Switch Slot--X8 Link Width.1213.4 Power Supply Requirements…1233.4.1 Current Available1233.4.2 Regulation and Ripple and noise1243.4.3 Backplane Power Decoupling1243. 4.4 Power Supply Timing1243.4.5 Additional Power Requirements for Boards SupportingHot-Ppluc1254 Keying Requirements4Legacy Slots and Legacy boards12642 eHM Ke126A CompactPCI Express Advanced Differential Fabric Connector......129A 1 General data129A 1.1 Objective of this document.129A.1.2Scope129A.1.3 Intended Method of mounting129A 1. 4 Ratings and characteristics130A.1.5 Normative references130A.1.6 Markings……131A 1.7 Type Designation国131A.1.8 Ordering Information132A 1. 9 Special Connector LoadingsA2 Technical InformationA.2.1 Contacts and terminations133A 3 Dimensional Information134A.3.1 Isometric view and common features.134A 3.2 Engagement Information134A.3. 2.1 Electrical Engagement Length134A.3.2.2 First Contact point135A 3.2.3 Perpendicular to Engagement direction135A.3.2.4 Inclination135A 3.3 Backplane Connectors136A 3.3.1 Dimensions1136A.3.3.2 Contacts136A.3.3.3 Contact Tip Geometry…………137A.3.3,4 Terminations137A. 3. 4 Front board connectors wwwwwwwwwww138A,3. 4. Dimensions.138A 3.4.2 Terminations138A 3.5 Mounting Information for Backplane Connectors138A. 3.5. 1 Hole Pattern on Backplanes139A 3.5.2 Backplane Contact Positional Requirements139A.3.5.3 True position of male contacts.139A.3.6 Mounting Information for Front Board Connectors.140A 3.6.1 Hole Pattern on Printed boards140A 4 Characteristics1416PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specificationA.4.1 Climatic Category141A 4.1.1 Climatic Category Test batch P: Initial EXamination .....141A 4.1.2 Climatic Category Test Batch A: Mechanical Tests.. 141A 4.1.3 Climatic Category Test Batch B: Harsh Environments. 144A.4.1.4 Climatic Category Test Batch C: Damp Heat146A 4.1.5 Climatic Category Test Batch D: ExtendedEnvironmental Tests147A 4.1.6 Climatic Categary Test Batch E: ExtendedEnvironmental Tests148A.4.2 Electrical characteristics148A.4.2.1 Impedance148A 4.2.2 Crosstalk149A.4.2.3 Propagation Delay149A42.4 Differential skew..149A 4.25 Insertion Loss149BEnriched hard-Metric ConnectorB. 1 General data国面国B150B. 1. 1 Objective of this document150B.1.2 Description of the Connector,s Approach150B.1.3 Descriptive Partitions Found Further This document150B 1.4 Normative References15B 1.4.1 Primary references describing the generic Part ofthe co151B.1.42Additionalreferenceswwwwwww.15B.1.5 Intended Method of Mounting151B 1.6 Markings.152B.1.7 Type Designation(General)152B2 Technical Information∴152B 2.1 Definitions152B 2.2 Contacts152B 2.3 Contact Performance Level154B 2.4 Keying154B.2.4.1 Mating rules155B.2.4.2 Examples for mating and nonmating configurations . 156B.2.5 Type Designation156B 2.6 Applicational Information157B 2.6.1 Alignment and Gathering157B26.2 Polarization翻面面∴158B3 Dimensional InformationQB.3.1 General158B.3.2 View and common features158B3.3 Remarks on Mating Properties of eHM Connector…………159B 3. 4 Fixed Board connector160B 3.4.1 Dimensions160B 3.4.2 TerminationsB.3.4.3 Mounting Information for Fixed Board Connectors..161B 3. 4.4 Hole pattern on fixed board161B.3.4 5 Position of connectors on fixed board∴161B 3.5 Free board connectors162B 3.5.1 Dimensions162B 3.5.2 Termination163PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not Design TO/Do Not Claim Compliance To/Do Not Distribute This specificationB.3.5.3 Mounting Information for Free Board Connectors. .......163B 3.5.4 Hole pattern on free board163B 3.5.5 Position of connectors on front board163B4 Characteristics81.163B.4.1 Climatic Category∴163B 4.2 Electrical Characteristics163B.4.2. 1 Creepage and clearance Distances163B 4.2.2 Voltage Proof164B.4.2. 3 Current-Carrying Capacity.164B.4.2.4 Contact resistance.……164B 4.2.5 Insulation Resistance.164B 4.3 Mechanica164B.4.3.1 Mechanical Operation.164B.4.3.2 Engaging and Separating Forces164B 4.3.3 Contact retesert164B 4.3.4 Static Load. Transverse.164B 4.3.5 Gauge Retention Force.164B 4.3.6 Vibration(Sinusoidal.164B 4.3.7 Shock164B 4.3.8 Polarization method165B.4.3.9 Robustness and effectiveness of coding device .........165B.4.3.9.1 Conditions According to IEC60512-7,Test 13e....B165B 5 Test schedule165B.6 Quality Assessment Procedures…………….…..….…......…...165c Universal Power Connector(UPM)166C 1 General data.I....8.4.4面面面..166C.1.1 Objective of this document166C2 Dimensions167C 3 Perpendicular to Engagement Direction169C4 Inclination169C 5 Mounting Information169C 6 Climatic Category.171Figuresg1-1 HM Connectors231-2 Advanced Differential Fabric(ADF) Connector241-3 UPM Power Connector for System and Type 1 Peripheral Slots/Boards..251-4PowerConnectorforswitchslots/boardswwwwww.26-5 eHM Connector1-647- Position CompactS| Pluggable Power Supply Connector……….281-7 CompactPCI Express 3U Slot Examples29-8 Compact PCI Express 6u Slot Examples301-9 System Board311-10 System Slot321-11 Type 1 Peripheral Board321-12 Type 1 Peripheral Slot.331-13 Type 2 Peripheral Board-14 Type 2 Peripheral Slot34PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specification1-15 Hybrid Peripheral slot351-16 Boards Supported By Hybrid Peripheral Slots361-17 3 Switch Board371-18 3 Switch Slot371-19 6U Switch board38-20 6U Switch Slot391-21 Backplane with Hybrid Peripheral Slots and Legacy Slots401-22 Backplane with all Hybrid Peripheral Slots411-23 Backplane with Type 2 and Hybrid Peripheral Slots421-24 3U Backplane with Switch, System, Type 1, and Type 2 Slots1-256 U Backplane with Switch, System,Type1, and type2S∴………43442-1 Backplane Overall Dimensions482-2 30 Backplane connector Locations492-3 6U Backplane Connector Locations502-4 board compatibility glyphs2-5 Glyph for Boards that Operate in Either System or Peripheral Slots512-6 Slot Compatibility Glyphs……512-7 3U System, Type 1, and Type 2 Board Dimensions and ConnectorLocations522-8 6U System/Type 1/Type 2 Board Dimensions and Connector Locations...532-9 3 Switch board Dimensions and connector locations542-106uswItchboarddimensionsandconnectorlocations..w.wwwwww.552-11 Modification to PCB to Support Thicker Boards562-12 CompactPCI Express Logo572-13 Alternate CompactPC| Express Logo....….….…572-14 Approximate Clearance Between the PMC/XMC PCB and the aDFConnector………………..572-15 Board cross-Sectional view82-16 3U Rear-Panel l/o board dimensions,602-17 6U Rear-Panel l/o Board Dimensions613-1 2-Link and Loss definition643-2 Backplane Connector Footprint683-3 Interconnect jitter allocation703-4 Peripheral TX Eye Mask723-5 Controller TX eye Mask733-6 Peripheral RX Eye Mask743-7 Controller RX Eye Mask753-8 Backplane TX Compliance signal763-9 Backplane RX Eye…763-10 Alternative Controller measurement783-11 Biasing for HCSL Clock Input3-12 Biasing Simulation Results.803-13 Single-Ended Measurement for swing.833-14 Single-Ended Measurement Points for delta cross point833-15 Single-Ended Measurement Points for Rise and Fall Time Matching ..........833-16 Differential Measurement Points for Duty Cycle and Period833-17 Differential measurement points for rise and fall time843-18 Differential Measurement Points for Ringback843-19 Eight-Slot Backplane Example913-20 Power Supply Timing95PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification3-21 WAKE Rise and fall time measurement points983-22 WAKE# Circuit Example93-23 Power Up…1013-24 Power Management states1023-25 Power down1033-26 Typical Hot-Plug Interface Implementation1063-27 4-Link Configuration Backplane Example1103-28 2-Link Combination Configuration backplane example112A-1 Sample Part Number with Explanation132A-2 Special Connector Loading 01001面着国面国B面面国33A-3 View of connectors with common features134A-4 Connector Mating Sequence35A-5 Dimensional Drawing of Backplane Connector.136A-6 Contact Geometry for Zone 2 Backplane Connector137A-7 Dimensional Drawing of Front Board Connectors138A-8 Hole Requirements for backplane Connector139A-9 Backplane Pin Contact Positional Tolerance ................................................140A-10 Hole Requirements for the Front Board Connector140B-1 View of Fixed and Free Board Keying Design(Left Perspective, RightDetailed).……155B-2 View of a Mating and a Non-Mating Keying Combination156B-3 View of fixed and free Board connectors..158B-4 View of Fixed Board connector Including polarization Feature.......159B-5 Dimensional drawing of Fixed board eHM connector160B-6 Hole Requirements for eHM on Fixed Board161B-7 Dimensional drawing of eHM Free Board connector…162B-8 Hole Requirements for eHM Free Board Connector............163C-1 UPM-F-7 Female 7-Position power connector dimensional information 167C-2 UPM-F-5 Female 5-Position Power Connector Dimensional Information ....168C-3 Male 7-Position power connector dimensional information168C-4 UPM-M-5 Male 5-Position Power connector dimensional Information169C-5 Hole pattern for 7-Row male uPm Power connector169C-6 Hole pattern for 5-Row male UPM Power connector170C-7 Hole pattern for female 7-Row uPm Power connector..170C-8Holepatternforfemale5-rowuPmpowerconnectorwwww.171Tables3-1 Interconnect Loss Budget Type 1 Peripheral3-2 Interconnect Loss Budget Type 2 Peripheral653-3 Allowable Interconnect Lane-to-Lane skew673-5 Interconnect Jitter buaget on3-4 Total System Jitter Distribution......69703-6 Type 2 Peripheral Transmitter Eye............713-7 Controller TX Compliance Eye Requirements723-8 Type 2 Peripheral RX Compliance Eye Requirements..733-9 Controller RX compliance Eye Requirements743-10 Backplane TX Compliance Signal (Signal Generator)753-11 Backplane RX compliance eye7610PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specification
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