索尼 imx274 datesheet
imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
- 2020-12-11下载
- 积分：1
matlab在时间序列建模预测及程序代码
详细介绍了时间序列建模及预测过程，包括算法，也包括一些matlab工具箱中的代码计算结果表明,时,预测的标准误差较小,所以选取=。预测第月份的销售收入为计算的程序如卜为移动平均的项数由于的取值不同,的长度不一致,下面使用了细胞数组简单移动平均法只這合做近期预测,而且是预测目标的发展趋势变化不人的情况如果目标的发展趋势存在其它的变化,米用简单移动屮均法就会产生较大的预测偏差和滞后。加权移动平均法在简单栘动平均公式中,每期数据在求平均时的作用是等同的。但是,每期数据所包含的信息量不样,近期数据包含着更多关于未来情况的信息。因此,把各期数据等同看待是不尽合理的,应考虑各期数据的重要性,对近期数据给予较大的权重,这就是加权移动平均法的基本思想。设时间序列为加权移动平均公式为十·十∴+式中为期加权移动平均数;为的权数,它体现了相应的在加权平均数中的重要性。利用加权移动平均数来做预测,其预测公式为即以第期加权移动平均数作为第+期的预测值。例我国年原煤广量如表所示,试用加权移动平均法预测年的产量。表我国原煤产量统计数据及加权移动平均预测值表原煤产量三年加权移动平均预测值相对差(%)解取,按预测公式计算三年加权移动平均预测值,其结果列于表中。年我国原煤产量的预测值为(亿吨这个预测值偏低,可以修正。其方法是:先计算各年预测值与实际值的相对误差,例如年为将相对误差列于表中,再计算总的平均相对误差。由于总预测值的平均值比实际值低,所以可将年的预测值修正为计算的程序如下:在加权移动平均法中,的选择,同样具有一定的经验性。一般的原则是:近期数据的权效人,远期数据的权数小。至于人到什么稈度和小到什么程度,则需要按照预测者对序饥的了解和分析来确定。趋势移动平均法简单移动平均法和加权移动平均法,在时间序列没有明显的趋势变动时,能够准确反映实际情况。但当时间序列出现直线増加或减少的变动趋势时,用简单移动平均法和加权移动平均法来预测就会岀现滞后偏差。因此,需要进行修正,修正的方法是作二次移动平均,利用移动平均滞后偏差的规律米建立直线趋势的预测模型。这就是趋势移动平均法。次移动的平均数为+∴在一次移动平均的基础上再进行一次移动平均就是二次移动平均,其计算公式为D下面讨论如何利用移动平均的潛后偏差建立直线趋势预测模型。设时间序列从某时期开始具有直线趋势,且认为末来时期也按此直线趋势变化,则可设此直线趋势预测模型为其中为当前时期数;为由至预测期的时期数;为截距;为斜率。两者又称为平滑系数现在,我们根据移动平均值来确定平滑系数。由模型()可知所以+…十因此由式(),类似式()的推导,可得所以类似式()的推导,可得于是,由式()和式()可得平滑系数的计算公式为例我国年的发电总量如表所示,试预测和年的发电总量。表我国发电量及一、二次移动平均值计算表年份发电总量次移动平均二次移动平均,=解由散点图可以看出,发电总量基本呈直线上升趋势,可用趋势移动半均法来预测。图原始数据散点图取三,分别计算次和二次移动平均值并列于衣中。再由公式(),得于是,得时直线趋势预测模型为预测年和年的发电总量为计算的程序如下:把原始数据保存在纯文本文件中为移动平均的项数趋势移动平均法对于冋时存在直线趋势与厝期波动的序列,是种既能反映趋势变化,又可以有效地分离出来周期变动的方法。§指数半滑法次移动平均实际上认为最近期数据对未来值影响相同,都力权一;而期以前的数据对未来值没有影响,加权为。但是,二次及更高次移动平均数的权数却不是—,且次数越高,权数的结构越复杂,但永远保持对称的权数,即两端项权数小,中间项权薮大,不符合一般系统的动态性。一般说来历史数据对未来值的影响是随时间间隔的增长而递减的。所以,更切合实际的方法应是对各期观测值依时间顺序进行加权平均作为预测值。指数平滑法可满足这一要求,而且具有简单的递推形式指数平滑法根据平滑次数的不同,又分为一次指数平滑法、二次指数平滑法和三次指数平滑法等,分别介绍如下次指数平滑法.预测模型设时间序列为,a为加权系数,
- 2020-12-06下载
- 积分：1
