5G Mobile and Wireless Communications Technology
关于5G通信和无线传输的相关知识5G Mobile and wirelessCommunications TechnologyEDITED BYAFIF OSSEIRANEricssonJOSE F MONSERRATUniversitat politecnica de valenciaPATRICK MARSCHCAMBRIDGEUNIVERSITY PRESSCAMBRIDGEUNIVERSITY PRESSUniversity Printing House, Cambridge CB2 8BS, United KingdomCambridge University Press is part of the University of CambridgeIt furthers the Universitys mission by disseminating knowledge in the pursuit ofeducation learning and research at the highest international levels of excellencewww.cambridge.orgInformationonthistitlewww.cambridge.org/9781107130098C Cambridge University Press 2016This publication is in copyright. Subject to statutory exceptionand to the provisions of relevant collective licensing agreementsno reproduction of any part may take place without the writtenpermission of Cambridge University PressFirst published 2016Printed in the United Kingdom by TJ International Ltd. Padstow Cornwalla catalogue record for this publication is available from the british libraryLibrary of Congress Cataloguing in Publication dataOsseiran. Afif editor5G mobile and wireless communications technology /[edited by] Afif Osseiran, EricssonJose F monserrat, Polytechnic University of Valencia, Patrick Marsch, Nokia NetworksNew York: Cambridge University Press, 2016LCCN2015045732|ISBN978110713009( hardback)LCSH: Global system for mobile communications. Mobile communication systems- StandardsLCC TK5103483A152016DDC62138456dc23Lcrecordavailableathttp://icCn.loc.gov/2015045732IsBN 978-1-107-13009-8 HardbackCambridge University Press has no responsibility for the persistence or accuracy ofURLS for external or third- party internet websites referred to in this publicationand does not guarantee that any content on such websites is, or will remainaccurate or appropriateTo my new born son S, my twin sons H& N, my wife L s-y for her unwaveringencouragement, and in the memory of a great lady my aunt K eA OsseiranTo my son, the proud fifth generation of the name Jose Monserrat. And with thewarmest love to my daughter and wife, for being always there.E MonserratTo my two small sons for their continuous energetic entertainment, and my dearwife for her amazing patience and support.P MarschContentsList of contributorspage xIvForewordAcknowledgmentsXIXAcronymsXXIIIntroduction1. 1 Historical background1.1.1 Industrial and technological revolution: from steam enginesto the internet1. 1.2 Mobile communications generations: from IG to 4G1.1.3 From mobile broadband ( mbb) to extreme MBB1. 1.4 IoT: relation to 5G1.2 From ICT to the whole economy6771.3 Rationale of 5G: high data volume, twenty-five billion connecteddevices and wide requirements1.3.1 Security1.4 Global initiatives1. 4.1 METIS and the 5G-PPP1. 4.2 China: 5G promotion group2241. 4.3 Korea: 5G Forum141. 4.4 Japan: ARIB 2020 and Beyond Ad Hoc1. 4.5 Other 5G initiatives14.6 Iot activities1.5 Standardization activities445551.5.1ITU-R1.5.23GPP161.5.3 EEE161.6 Scope of the book16References185G use cases and system concept212. 1 Use cases and requirements212.1.1 Use cases212. 1.2 Requirements and key performance indicatorsContents2.2 5G system concept322.2.1 Concept overview322. 2.2 Extreme mobile broadband342.2.3 Massive machine-type communication362.2.4 Ultra-reliable machine-type communication382.2.5 Dynamic radio access network392.2.6 Lean system control plane432. 2. 7 Localized contents and traffic flows52.2.8 Spectrum toolbox2. 3 Conclusions48References48The 5g architecture503.1 Introduction503.1.1 NFV and SDN503.1.2 Basics about ran architecture533.2 High-level requirements for the 5G architecture563.3 Functional architecture and 5g flexibility573.3.1 Functional split criteria583.3.2 Functional split alternatives593.3.3 Functional optimization for specific applications3.3.4 Integration of lte and new air interface to fulfill 5Grequirements3.3.5 Enhanced Multi-RAT coordination features663. 4 Physical architecture and 5G deployment3.4.1 Deployment enablers673.4.2 Flexible function placement in 5G deployments713.5 Conclusions74References75Machine-type communications774.1 Introduction774.1.1 Use cases and categorization of mto774.1.2 MTC requirements804.2 Fundamental techniques for MTC834.2.1 Data and control for short packets834.2.2 Non-orthogonal access protocols854.3 Massive mtc864.3.1 Design principles864.3.2 Technology components864.3. 3 Summary of mMTC features944.4 Ultra-reliable low-latency MTC944.4. 1 Design principles944.4.2 Technology componentsContents4.4.3 Summary of uMTC features1014.5 Conclusions102References103Device-to-device(D2D)communications1075.1 D2D: from 4G to 5G1075.1.1 D2D standardization: 4G LTE D2D1095.1. 2 D2D in 5G: research challenges1125.2 Radio resource management for mobile broadband D2D1135.2.1 RRM techniques for mobile broadband d2d5.2.2 RRM and system design for D2D1145.2.3 5G D2D RRM concept: an example5.3 Multi-hop d2d communications for proximity and emergencyservices1205.3.1 National security and public safety requirements in 3GPPand Metis1215.3.2 Device discovery without and with network assistance125.3.3 Network-assisted multi-hop d2d communications1225.3.4 Radio resource management for multi-hop D2D1245.3.5 Performance of D2D communications in the proximitcommunications scenario1255. 4 Multi-operator d2d communication1275.4.1 Multi-operator D2D discovery275.4.2 Mode selection for multi-operator D2D1285.4.3 Spectrum allocation for multi-operator D2D295.5 Conclusions133References1346Millimeter wave communications1376. 1 Spectrum and regulations1376.2 Channel propagation1396.3 Hardware technologies for mm W systems1396.3.1 Device technology1396.3.2 Antennas1426.3.3 Beamforming architecture1436.4 Deployment scenarios6. 5 Architecture and mobility1466.5.1 Dual connectivit1476.5.2 Mobility1476.6 Beamforming1496.6. 1 Beamforming techniques1496.6.2 Beam finding1506.7 Physical layer techniques1526.7.1 Duplex scheme152
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RK3229 MIC
RK3229 的多mic阵列麦方案，RK原厂提供，对于做多MIC客户用途比较大RaCkChpP瑞芯微电子福州瑞芯微电子股份有限公司目录目录3概述■1■■1■■1■1■■1■■1■1面■■■■■■4产品版本4适用对象41-概述,:■:■":■::■::::::::::::.::.::.::.::.::::":::::::::::::::::::1.1麦克风阵列EK廾发平台简介1.2麦克风阵列EVK框图.13麦克风阵列E∨K组件2麦克风阵列E硎K介绍..………82.1整体效果图82.2结构与接口示意图3麦克风阵列子板模块简述n113.16+0+2麦克风阵列方案说明113.2内、外圈园周阵列麦■重着国面重着国面重着国面日重面重面重面自重面自■重■,面■重■面■重■,面重■,面■113.3 Codec.3.4PA133.5 Loopback回采电路,,,,,,,,,133.6排针∴144注意事项∴.….154.1注意事项15Copyright 2015 @Fuzhou Rockchip Electronics Co., LtdRaCkChpP瑞芯微电子福州瑞芯微电子股份有限公司前言概述本文档主要介纽RK麦克风阵列EVK基本功能特点和硬件特性、硬件配置以及使用方法,旨在帮助相关开发人员更快、更准确地使用该EVK,进行麦克风阵列冫案的应用开发E∨K由RK3229主板与麦克风阵列子板共两部分组成,本文档着重介绍麦克风阵列相关内容,即麦克风阵列」板及其与RK3229主板相关联部分。涉及RK3229主板的其他功能,可参考《RK3229BOX开发板用户使用指南》以获取更详细信息。产品版本本文档对应的产品版本如下:品名称版本描述RK SDK BOX RK3229 Discrete PowerV1.0RK3229主板DDR3P416DD6V1020160120LⅩFRK BOX EVB MICARRAYTESTBOARDV1.06+0+2麦克风阵列子板RK3229V1020160901适用对象本文档主要适用于以下人员:技术支持工程师单板硬件开发工程师频算法工程师嵌入式软件开发工稈师测试工程师Copyright 2015 @Fuzhou Rockchip Electronics Co., LtdRaCkChpP瑞芯微电子福州瑞芯微电子股份有限公司缩略语缩略语指文档中常用的词组简称:内部整合电路(两线式串行通讯总I2CInter-Integrated Circuit线)I2SInter-IC Sound集成电路内置音频总线PAPowerAmplifier此处特指音频功率放大器RKRockchip lectronics Co. Ltd瑞芯微电子有限公司Copyright 2015 @Fuzhou Rockchip Electronics Co., LtdRaCkChpP瑞芯微电子福州瑞芯微电子股份有限公司1概述1.1麦克风阵列EVK开发平台简介RK3229芯片是一款包括NeOn和FPU协处理器在内的四核 ARM Cortex-A7处理器,主频1.5GHz;集成∫32 bits ddr3/DDR3L/ LPDDR2/ LPDDR3控制器,提供了高性能、髙分辨率应用程序所需要的内存带宽。芯片能胜任高分辨率(4K/60Hz)显示、多通道(8+2)音频处理和主流应用。芯片内置3路I2S接口,I2S1用于HDMI输出的音频处理,另外2路I2S0与I2S2可供用户自由分配。其中,I2S2支持同吋2通道输入与2通道输出,I2S0则可最扃支持至8通道输入或8通道输出。麦克风阵列E∨K是基于6+0+2名麦克风方案(6+0+2介绍见3.1章节)的硬件参考设计,同时RK3229主板将芯片资源都作了引出,方便客户验证、调试与二次开发,只需要简单修改参考设计的模块电路,就可以完成产品的硬件设计12麦克风阵列EvK框图RK3229主板使用12∨/2A适配器供电,通过UART串口进行调试,验证各功能模块。开发板配有HDMI输出, SPDIF输出,ⅥWIFI+BT模组, Etherne接口,USB接口,TF卡,红外接收以IR,CVBS视频接口等,非常有利于芯片方案的深入研发与快速产品化。主板与麦克风阵列子板通过10x2的2.54mm排线连接,音频接口包括5V电溟、1组I2S1信号、1组I2C信号与2个通用GPIO。详细资源使用情况见下图:Copyright 2015 @Fuzhou Rockchip Electronics Co., LtdRaCkChpP瑞芯微电子福州瑞芯微电子股份有限公司口RockchipRK3229Serug OARI2wskur Reset nimrod4x二C/D2XLDOPowerUSB HUST2J图1RK3229主板系统框图工C3Vf∞rMICaD5V王CC⊥K工CM工c5图2麦克风阵列子板系统框图13麦克风阵列EvK组件麦克风阵列EWK主要包括以下物品:RK3229主板麦克风阵列子板电源适配器,规格:输入100VAC240VAC,50;输出12VDC,2A2.54m20针排线Copyright 2015 @Fuzhou Rockchip Electronics Co., LtdRaCkChpP瑞芯微电子福州瑞芯微电子股份有限公司2麦克风阵列EW介绍2.1整体效果图麦克风阵列EWK整体实物图如下ppDJoZl (l esnw最w箱x思图1麦克风阵列EVK实物图Copyright 2015 @Fuzhou Rockchip Electronics Co., LtdRaCkChpP瑞芯微电子福州瑞芯微电子股份有限公司g88888图2麦克风阵列子板实物图-正面、背面2.2结构与接口示意图麦克风阵列了板PB布局如图所示外园麦克风、6个直径Rcm闪园麦先风、6个直径5cmCodecPAT排针Codec(6PA2喇刺叭翰出2RK BOX EVB NICARRAY TESTBOARD RK3226_2018%ad图5麦克风阵列子板PCB正面图Copyright 2015 @Fuzhou Rockchip Electronics Co., LtdRaCkChpP瑞芯微电子福州瑞芯微电子股份有限公司各模块及接∏说明如卜表表1麦克风阵列子板说明编号说明措述1选项1-外圈麦克风直径80mm6个数字麦克风2选项2-内圈麦克风直径50mm6个数字麦克风选3odec每个 Codec支持2路输出与2路输入PAD类音频功放芯片456喇叭输出2个喇叭输出排针与RK3229主板连接的排针Copyright 2015 @Fuzhou Rockchip Electronics Co., Ltd10
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