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cc
说明: 雷达信号理论的分析工具及其matlab 仿真, 可供学习使用。(Analysis tools for radar signals theory and mtlab simulink)
- 2010-09-29 15:20:05下载
- 积分:1
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MapleAndMATLABdealScienceProblemV3
用Maple和MATLAB解决科学计算问题,第三版,电子工业出版社(Using Maple and MATLAB to solve scientific computational problems, Third Edition, Electronic Industry Press)
- 2009-12-19 11:13:48下载
- 积分:1
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DALI_Stander_Protocol
dali协议完整这文档,分享给大家。NEMA STANDARD PUBLICATION 243-2004
Digital Addressable Lighting Interface (DALI) Control Devices Protocol(dali agreement complete this document。NEMA STANDARD PUBLICATION 243-2004
Digital Addressable Lighting Interface (DALI) Control Devices Protocol)
- 2014-11-12 17:43:52下载
- 积分:1
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Alizadeh_Sadough_IST_2010
Power Minimization in Uni-directional Relay
Networks with Cognitive Radio Capabilities
- 2012-11-21 12:00:16下载
- 积分:1
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AIAA-1994-3473-359
使用模糊自适应主动控制飞机起落架振动阻尼的研究(Using fuzzy adaptive active control landing gear vibration damping research)
- 2014-09-01 23:38:15下载
- 积分:1
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Parametric
ctel tel inamo debasi iesali mcha ljawbma university
- 2015-03-02 09:37:16下载
- 积分:1
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3900001
本文研究的是利用奇异性指数实现对设备状态监视和故障预警功能。首先用LabVIEW 采集传感器电信号,然后对采集到的电信
号进行小波变换得到信号包络奇异点的奇异性指数,即设备运行状态的特征值(In this research project, we use LabVIEW to do wavelet-transformation to the signal collected by sensors in order to get singularity
index from the singular points of the particular signal’s envelope. Through comparing this eigenvalue to the figures in a standard database, we can
know the functional status of the instruments. Not only the diagnoses are continuously displayed, but alarms about signs of dysfunction will also be
raised in a proper way. In other words, both the supervision of the instrument and warning of dysfunction can be achieved)
- 2012-01-31 16:35:56下载
- 积分:1
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L1730SSFTMENG
LG Monitor user s guide L1730S&L1930S
- 2010-08-02 23:31:18下载
- 积分:1
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registration_book
图像配准的经典教材,对做医学图像配准和相关研究的人很有帮助(image registration of the classic textbook on conducting medical image registration and related research to people)
- 2007-03-19 08:41:26下载
- 积分:1
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Thermal Cycling
说明: The main goal of this step is to detect whether there is a mismatch of the thermal expansion
coefficients, PCB mounting problems, weak solder joints, and IC package integrity
- 2020-06-16 04:00:01下载
- 积分:1