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zoeppritz
这是用于求解精确求解zoeppritz方程的程序，可用于AVO反演，合成地震记录等(This function computes the particle displacement reflection and
transmission coefficients (the relative displacement amplitudes)
for a solid-solid interface, a liquid-solid interface,
a solid-liquid interface, and a liquid-liquid interface.
The medium on each side of a given interface is perfectly elastic.
The output is the value of the reflection or transmission
coefficient, specified by the user at the incidence angle anginc
(see input parameters).
)
- 2012-07-24 11:46:34下载
- 积分：1
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BigNumber
大数类，重载了各类操作符，可以直接使用(fate categories, a variety of heavy-duty operator can be used directly)
- 2005-02-27 10:55:05下载
- 积分：1
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driver
Driver Fatigue Detection Based on Eye Tracking
- 2009-09-10 06:13:06下载
- 积分：1
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Field_ampl_analy
利用地震方位属性进行反演，获得各向异性强度和方位参数；同时对计算结果进行归一统计性处理。(Property inversion, seismic orientation anisotropy and orientation parameters and normalized statistical processing of the calculation results at the same time.)
- 2013-04-17 12:44:55下载
- 积分：1
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foundations-of-linear-operator-theory-2005
介绍线性算子的基本概念的文章,这是书里面的一个章节(Foundation of linear operator theory)
- 2020-06-21 00:40:02下载
- 积分：1
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GS迭代法
说明： 牛顿迭代法的matlab代码，数值分析中重要的一个算法(Matlab code of Newton iterative method)
- 2019-12-01 10:06:30下载
- 积分：1
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C_classical_src
平常练习的一些程序，比较基础，包括求斐波那契数、完数等等(Some of the usual practice procedures, more infrastructure, including seeking Fibonacci numbers, number, etc. End)
- 2013-11-18 21:18:19下载
- 积分：1
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Gauss
高斯消元法、高斯列主元消元法解线性方程组。程序由本人独立完全独立完成。版权所有！(Gaussian elimination method out PCA Gaussian elimination method for solving linear equations. I am independent program consists entirely independently. All rights reserved!)
- 2013-08-10 12:31:59下载
- 积分：1
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zhaomingdagonglvfaguanerjiguan
根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电
银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) .
采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选
择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)
- 2012-10-25 13:22:30下载
- 积分：1
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-recursive-
天线组阵中相位差的递推最小二乘估计与滤波(Phase array antenna group recursive least squares estimation and filtering)
- 2013-12-20 13:17:48下载
- 积分：1
