索尼 imx274 datesheet
imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
- 2020-12-11下载
- 积分：1
西门子S7-1200 SCL编程指令手册.pdf
西门子1200PLC SCL编程指令手册，详细介绍西直门1200和1500PLC的SCL编程指令R_TRG检测信号上升沿(S7-1200,S7-1500)RTR|G:检测信号上升沿唱圆说明使用检测信号上升沿”指爷,可以检测输入CLK的从“0"到“1”的状态变化。该指合捋输入CLK的当前值与保存在指定实例中的上次查询(边沿存储位)的状态进行比较。如果该指合检测到输入CLK的状态从“03变成了“1”,就会在输出Q中生成一个信号上升沿,输出的值将为TRUE或“1”一个周期。在其它任何情况下,该指合输出的信号状态均为“0”。烀该指合插入程序中时,烀自动打开“调用选项" Call options)对话框。在该对话框中,可以指定将边沿存储位存储在自身数据块中(单背景)或者作为局部变量存储在块接口中(多重背景)。语法“检测信号上升沿”指爷的语法如下所示(CLK:=参数下表列出了“检测信号上升沿”指爷的参数:参数声明数据类型存储区说明CLKInputBOOL、Q、M、D、L|到达信号,查询该信号的边QOutputBOOL1、Q、MAD、L边沿检测的结果示例以下示例说明了该指合的工作原理SCLR TRIG DB"(CLK : -TagIn>Tagout)i输入CLK中变量的上一个状态存储在“ R TRIG DB”变量中。如果在操作数Tagn1和"Tagn2”或在操作数“Tagn3中检测到信号状态从“0变为“1”,则输出“ Tagout_Q的信号状态为“”一个周期。3F_TRG:检测信号下降沿(S7-1200,S7-1500)FTRG检测信号下降沿唱圆说明使用检测信号下降沿”指爷,可以检测输入CLK的从“1”到"0”的状态变化。该指合捋输入CLK的当前值与保存在指定实例中的上次查询(边沿存储位)的状态进行比较。如果该指合检测到输入CLK的状态从“1"变成了“0,就会在输出Q中生成一个信号下降沿,即输出的值烀为TRUE或“1”一个周期。在其它任何情况下,该指合输出的信号状态均为“0”。烀该指合插入程序中时,烀自动打开“调用选项" Call options)对话框。在该对话框中,可以指定将边沿存储位存储在自身数据块中(单背景)或者作为局部变量存储在块接口中(多重背景)。语法“检测信号下降沿”指爷的语法如下所示(CLK:=参数下表列出了“检测信号下降沿指合的参数:参数声明数据类型存储区说明CLKInputBOOLQ,M、D、L到达信号,查询该信号的边沿QOutputBOOLQ、M、D、L|边沿检测的结果示例以下示例说明了该指合的工作原理SCLF TRIG DB(CLK :TagIn2 =>Tagout)输入CLK中变量的上一个状态存储在“FTRG_DB"变量中。如果检测到操作数“Tagn"的信号状态从“1变为“0”,则输出" Tagout"的信号状态为“1"4定时器操作(S7-1200,S7-1500)定时器操作该章节包括以下主题的信息:TP:生成脉冲S7-1200,S7-1500)TON:接通延时(S7-1200S7-1500ToF∴关断延时(S7-1200,S7-1500)●TONR:时间累加器(S7-1200,S7-1500)RESET TIMER:复位定时器(S7-1200,S7-1500)PRESET TIMER:加戟持续时间(S7-1200,S7-1500)°传统(S7-15005TP:生成脉冲(S7-1200,S7-1500)TP:生成脉冲唱圆说明使用“生成脉冲”指合来设置持续时间PT的参数Q。当参数|N的逻辑运算结果(RLO)从0变为“1”(信号上升沿)时,启动该指合。指合启动时,预设的时间PT即开始计时。随后无论输入信号如何改变都会将参数Q设置为时间PT。如果持续时间PT仍在计时,即使检测到新的上升沿,参数Q的信号状态也不会受到影响。可通过ET参数查询当前的时间值。该时间值从T#0s开始,在达到持续时间PT后结束。达到持续时间PT时,且参数|N的信号状态为“0”,则复位参数ET。说明如果程序中未调用定时器(这是因为会忽略定时器),则输出ET会在定时器计时结束后立即返回个常数值。每次调用“生成脉冲指合,都会为其分配一个G定时器用于存储指合数据。对于S7-1200cPUEC定时器是一个 C TIMER或 TP TIME数据类型的结构,可如下声明声明为一个系统数据类型为|C_TMER的数据块(例如,MyEC_TMER●声明为块中“ Static程序段内类型为 TP TIME的局部变量(例如,# MyTP_TIMER)对于S7-1500cPUEC定时器是一个 C TIMER、旧 C LTIMER、 TP TIME或 TP LTIME数据类型的结构,可如下声明声明为一个系统数据类型为 C TIMER或lC_ LTIMER的数据块(例如," MylEC_TIMER”)声明为块中 Static部分的 TP TIME或 TP LTIME类型的局部变量(例如,# MyTP_ TIMER)在程序中插入该指合时,将打开“调用选项” Call options)对话框,可以指定C定时器将存储在自身数据块中(单个背景)或者作为局部变量存储在块接口中(多重背景如果创建了一个单独的数据块则该数据块捋保存到项目树“程序块>系统块"( Program blocks> System blocks)路径中的“程序资源( Program resources)文件夹内。有关本主题的更多信息,请参见“另请参见"。只有在调用该指合且每次都会访问Q或ET输出时,才会更新指爷数据。语法生成脉冲”指合的语法如下所示●系统数据类型为EC_ Timer的数据块(全局DB)SCLTP(IN:=PT:=ET=>●局部变量TP:生成脉冲(S7-1200,87-1500)SCLmoloc1 timer(工NPT:=rQ=>)该指合的语法由以下部分组成参数声明数据类型存储区说明s7-1200S7-1500NBOOLBOOL.M.D.|启动输及脉冲的持续时PTIniTIMETIMEl、Q、M、D、间。LTIMEPT参数的值必须为正数OutputBOOLBOOLQ、M、D、在PT持续时间内保持置位状态的操作数TIMEETOutputMEl、Q、M、DLTIME当前时间值有关有效数据类型的更多信息,请参见“另请参见"。脉冲时序图下图显示了“生成脉冲”指合的脉冲时序图PTPTPTET示例7TP:生成脉冲(S7-1200,S7-1500)以下示例说明了该指爷的工作原理SCLTP DB".TP(IN Tag start,PT :=Tag PresetTime"Tag statusET =>"Tag ElapsedTime")i当“ Tag_ start"操作数的信号状态从“0”变为“1"时,PT参数预设的时间段开始计时,同时"Tag_ Status"操作数置位为“1”。当前时间值存储在 Tag_ ElapsedTime"操作数中8TON:接通延时(S7-1200,S7-1500)TON:接通延时唱圆说明可以使用接通延时”指合捋Q参数的设置延时PT指定的一段时间。当参数N的逻辑运算结果(RLO从“0变为“1”(信号上升沿)时,启动该指合。指合启动时,预设的时间PT即开始计时。超过持续时间PT时,参数Q的信号状态变为“1。只要启动输入仍为“1”,参数Q就保持置位。如果|N参数的信号状态从“1变为"0”,则复位参数Q。当在参数N上检测到一个新的信号上升沿时,将重新启动定时器功能。可通过ET参数查询当前的时间值。该时间值从T#0s开始,在达到持续时间PT后结束。只要参数N的信号状态变为0”,就立即复位ET参数。说明如果程序中未调用定时器(这是因为会忽略定时器),则输出ET会在定时器计时结束后立即返回一个常数值。每次调用“接通延时指合,必须捋其分配给存储指合数据的EC定时器对于S7-1200CPUEC定时器是一个 C TIMER或 TON TIME数据类型的结构,可如下声明●声明为一个系统数据类型为 C TIMER的数据块(例如, MylEC_ TIMER”)●声明为块中“ Static"程序段内类型为 TON TIME的局部变量(例如,# MyTON_TIMER)对于S71500cPUEC定时器是一个|EC_TMER、 EC LTIMER、TON_TME或 TON LTIME数据类型的结构,可如下声明●声明为一个系统数据类型为旧EC_ TIMER或C_ LTIMER的数据块(例如," MylEC_TIMER")声明为块中“ Static"部分的 TON TIME或 TON LTIME类型的局部变量(例如,# My TON_ TIMER)在程序中插入该指合时,捋打开“调用选项( Call options)对话框,可以指定C定时器烀存储在白身数据块中(单个背景)或者作为局部变量存储在块接口中(多重背景)。如果创建了一个单独的数据块,则该数据块捋保存到项目树“程序块>系统块( Program blocks> System blocks)路径中的“程序资源Program resources)文件夹内。有关本主题的更多信息,请参见“另请参见”。只有在调用该指合且每次都会访问Q或ET输出时,才会更新指合数据。语法接通延时指合的语法如下所示●系统数据类型为C_Tmer的数据块(全局DB)SCLTON(N:=PT:=,Q=>,三=>)9TON:接通延时(S7-1200,S7-1500)●局部变量SCLmoloc1 timer(工N:=rPT:=rQ=>ET)该指合的语法由以下部分组成参数声明数据类型存储区说明s7-1200s7-1500NInputBOOLBOOLl、Q、M、D启动输入接通延时的持TIME、Q、M、D、续时间PTInputTIMELTIMEPT参数的值必须为正数定时器PT内时OutputBOOLQ、M、D、间用完时,保持BOOL置位状态的操作数。TIMETIMEQ、M、DETOutputLTIME当前时间值有关有效数据类型的更多信息,请参见“另请参见”。脉冲时序图下图显示了“接通延时指合的脉冲时序图PTET
- 2020-12-03下载
- 积分：1
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