控制理论导论:从基本概念到研究前沿
控制理论导论:从基本概念到研究前沿 很详细的理论介绍前言维纳(N. Wiener)在1948年出版的专著《控制论,或关于在动物和机器中的控制与通讯》,标志着控制论作为科学的一门重要分支正式诞生.维纳也因此成为控制论的主要创始人之一,我国著名科学家钱学森在1954年出版的专著《工程控制论》又进一步推动了控制论与工程技术问题的峦切结合从那时到现在,控制论经历了半个世纪的迅猛发展.工业化和高科技的发展,对工业控制提出了越来越高的要求,特别是制导和航天技术的发展,促进了自20世纪60年代初以来现代控制理论的诞生和发展.而计算机的出现和高速发展,网络技术的日新月异使得高精度控制的在线实现成为可能半个世纪后的今天,控制论已经成为一门理论严谨、内容丰富、分支众多、发展迅速、应用广泛的学科领域.钱学森曾经从生产力,特别是技术革命的进程分析了控制论的产生和发展,他强调:“我们可以毫不含糊地说,从科学理论的角度来看,20世纪上半叶的三大伟绩是相对论、量子论和控制论,也许可以称它们为三项科学革命,是人类认识客观世界的三大飞跃控制理论发展到今天,恐怕没有一位系统与控制专家能够同时掌握控制理论的所有前沿分支,正如当今一个数学家很难同时是拓扑学、几何学、代数学、微分方程、泛函分析、概率统计、数论等各方面的专家.但是,与纯数学不同的是,一个优秀的系统与控制科学家,应该能对不同的控制理论与控制方法有一个比较全面的了解.控制论是一门应用性很强的科学理论,它面对的是各种各样错综复杂的实际系统.宇宙飞船到底是有夯维模型还是无穷维模型,是随机系统还是确定性系统,是该采用最优控制还是用鲁棒控制,抑或是多种模型和多种控制手段的综合,不可能有现成的答案模型的刻画、控制手段的选择,都是控制工程师自己的事情.这种以问题为导向、以解决问题为目标的研究路线,要求系统与控制的理论工作者和工程师面对需求或实际对象,有宽阔的知识面,对本学科各个重要分支的理论和方法有一个全面、综合的了解.这也是我们对研究生,特别是对那些有志在系统与控制科学的理论与应用研究方面,实现其人生宏伟理想的博士研究生们的要求和期盼.控制论方面的书籍汗牛充栋,文献更是如山似海,但不求甚解的“泛读”不如“不读精读一本好的工具书,可以让人达到事半功倍的效果20世纪70年代中期至80年代,我们的老研究室主任关肇直主编的“现代控制前言理论小丛书”,为现代控制理论在中国的传播和发展起到了历史性的作用.20多年过去∫,控制论有了长足的发展,相当一部分内容亟待更新.另外,“小丛书”虽册数较多,但系统性和整体性还不完善.所以,我们希望本书能达到以下几点要求(1)从必要的数学基础到控制理论,基本上自成体系,一个具有现代工程数学背景的大学毕业生就能读懂它的主要部分(2)它具有全方位性,能够对控制理论的几个主要方向都作出一定深度的介绍.使“读破”这卷书的读者能对现代控制理论有一个较为全面的了解3)它是一本综合性的教科书,基本部分论述详尽具体,每节后附有启发性的习题,可供学生循序渐进地学习,引导研究生迅速进入研究前沿(4)它又是一本前沿性的参考书,提高部分对现代控制理论的最新进展和挑战性课题作了专门介绍,可供有关科学和工程研究工作者参考这样一个目标绝非一两个人所能完成的,国内外也未曾见过此类书籍,这是一个创新的尝试.本书是由八位资深研究员执笔,十多位一线科研人员参与,依靠大家的协作、奉献和团队精神完成的.部分内容曾作为中国科学院有关专业博士生课程教材试讲本书的内容大体上可分为两大部分.第一部分前5章)是工具篇,介绍本书及控制理论中用到的一些基本数学工具.这些可以看作是对控制论专业博士研究生的基本要求,也可以作为有关科研工作者理论进修的参考或工具型手册第1章包括线性代数和线性系统两部分.在线性代数部分中给出一些在一般大学教科书中不多见的内容,如张量积、奇异值分解等,可以看作是标准线性代数课程的补充.线性系统部分则包括能控性、能观测性、标准分解等一些基本知识现在这些内容不仅对于控制专业,而且对许多相近专业已经成为必修的基础理论了第2章介绍常微分方程的基本理论,包括解的存在和唯一性、解的延拓及解对初值和参数的连续依赖性;线性常微分方程的基本结果;稳定性理论和平面定性理论初步.这些内容是集中参数控制理论的必不可少的数学工具第3章的内容包括抽象代数、拓扑及微分几何.对抽象代数只讨论群、环与代数概念.对点集拓扑作了较全面的介绍.对代数拓扑,只涉及同伦、基本群等.微分几何因为是非线性系统研究的基本工具,本章对它的讨论相对而言较详细.对流形、向量值纤维丛、黎曼流形、辛几何等均作了讨论第4章从测度论的观虑引进严格的概率空间、事件独立性等概念,介绍概率中的独立变量、极限定理等基本工具,然后介绍鞅与鞅差序列.并讲述随机过程和前言随机微分方程初步.为随机控制系统提供理论基础第5章介绍分布参数系统控制所要用的泛函分析、线性算子半群理论和偏微分方程的一些基本知识主要内容包括 Hilbert空间和 Banach空间、线性算子理论、谱理论、线性发展方程、 Sobolev空间、偏微分方程边值问题等.当然这些基本理论的深入掌握则需要读者去阅读有关的专著了本书的第二部分后6章)是控制篇,介绍现代控制理论中最活跃的几个理论分支,目的是帮助研究生了解有关控制理论,并引导他们进入科研前沿,也可以作为相关研究人员的参考资料第6章首先讨论了线性系统H控制的基础理论与设计方法.然后讨论非线性系统H-控制问题它在理论与设计上都与线性系统有显著区别最后给出一些它在上程设计中应用的典型例子第7章介绍集中参数系统最优控制理论的基本绪果.从T程实际问题归纳出最优控制问题的共同特点和数学描述开始,讲述最优控制理论的基本结果.包括最大值原理;线性系统时间最短控制;线性二次最优控制;双方极限原理及其与H灬控制的关系,为了解20世纪60年代的最优控制理论与9年代的干扰抑制控制之间的区别和联系提供“桥”第8章讨论非线性系统控制理论.由于非线性系统控制的理论与方法十分丰富,这里着重于非线性系统的几何理论.内容包括主要的经典方法与理论结果如能控性、能观测性、不变分布及解耦、线性化与近似线性化等.也包括新近发展起来的后推式自适应控制,中心流形方法,耗散理论,哈密顿系统理论等第9章讨论自适应系统.内容包括自适应估计和自适应控制两部分.该章将首先对自适应系统作以综合介绍,然后讨论定常及时变参数系绕的自适应估计理论和方法,其中涉及线性时变随机系统的稳定性研究;接着给出自校正调节器和自适应极点配置等典型自适应控制器的基本理论与设计技巧.该章的习题也是从事该领域进一步研究的必要基础第10章讨论分布参数控制系统的基本理论,包括无穷维线性系统的稳定性、能控性、能观测性、反馈镇定、弹性梁振动控制、波动方程的控制和无穷维线性系统二次型最优控制,以及时域乘子法、频域乘子法、Resz基方法等各种具体方法的介绍第1章研究关于以制造系统,计算机网等为应用背景的离散事件动态系统先简单综述了各种方法,然后主要论述了极大代数方法,包括建模与分析,能达能观测性,周期(“极点”)配置与稳定性,最优控制与调度等.最后论述了这个方向aIy.前言的两个最新进展:双子(Did代数方法与极小极大函数方法本书各章的执笔人为:张纪峰(第1章),秦化淑(第2章),程代展(第3章),陈翰酸(第4章,冯德兴(第5章).申铁龙(第6章),秦化淑(第7章),程代展(第8章)郭雷第9章),冯德兴(第10章),陈文德第11章)最后,由郭雷、程代展和冯德兴等负责统编如今,复杂系统科学、信息科学与生命科学的发展,社会与生态问蔥,高科技与经济全球化都给控制理论提出了新的挑战,同时也给予控制理论发展以新的机遇希望寄托于年轻的一代,寄托于现在的大学生和研究生们、伴随着中华民族的腾飞,他们必将成为未来国际系统与控制科学主导潮流的弄潮几.如果能用我们的肩膀为他们的成长起一点铺路石子的作用,那么本书的目的也就达到了笔者感谢华夏英才基金对本书出版的支持,感谢常金玲、刘智敏等同志在本书打印、编排等方面的贡献,感谢科学出版社的支持与帮助.本书的出版还得到国家自然科学基金委员会创新研究群体科学基金和重点项目(60334040)的资助笔者学识浅薄,错误和疏漏在所难免,愿专家和读者不吝赐教编者2004年3月中国科学院数学与系统科学研究院系统控制重点实验室数学符号表属于∈C∩u包含于集合交运算集合并运算集合差运算蕴含当且仅当实数域RCzzN复数域整数域4非负整数集自然数集,即正整数集空集Re实部虚部pan M由M中向量的线性组合构成的线性子空间SIRI符号函数LP(9)可测集92上p次可积函数空间LPJ; Rn)区间J到Rm上的p次可积函数空间r(a)矩阵A的迹A矩阵A的转置Reo(A)矩阵A的特征值的实部dim M子空间M的维数cool子空间N的余维数ker(A)矩阵A的零(核)空间Image (A)矩阵A的值域直和宜交和第3、8章专用符号MnX弧m×n矩阵集n×"矩阵集TI數学符号友GL(n, r)一般线性群gl(n, R)般线性代数So(n, R)特殊正交线性群特殊正交线性代数p(n, R)辛群sp(n, R)辛代数李括号协变张量的外积泊桑括号H
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索尼 imx274 datesheet
imx274 datesheet,可以对接Hi3519V101,4K,分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
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