索尼 imx274 datesheet
imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
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华为FusionInsight HD 2.7 技术白皮书.pdf
华为FusionInsight HD 2.7 技术白皮书，详细介绍了华为版Hadoop的各个组件功能。华为FusionInsight是华为企业级大数据存储、查询、分析的统一平台。华为 Fusionlnsight hd27技术白皮书日录目录1简介…1.1 Fusionlnsight hD概述1.2 FusionInsight HD组件介绍.2重点组件介绍52.集群管理 Manager622分布式文件系统HDFS23统一资源管理和调度框架YARN24分布式批处理引擎 Mapreduce.25分布式数据库 HBase2.6数据仓库组件Hive27分布式内存计算引擎 Spark28全文检索组件Solr.29批量数据集成 Loader( Scoop)….122.10实时数据采集 Flume142.11流式事件处理( Storn)…2.11.1 Storm2.11.2 StreamCQL…2.11.3 Flink2.12分布式高速缓存 Redis2.|3分布式消息队列 Kafka2.14作业编排与调度 Oozie...........212.15数据继承入凵Hue文档版本01(2017-07-30)华为专有和保密信息版权所有c华为技术有限公司华为 Fusionlnsight hd27技术白皮书1简介简介1.1 FusionInsight HD概述1.2 FusionInsight hD组件介绍文档版本01(2017-07-30)华为专有和保密信息版权所有c华为技术有限公司华为 FusionInsight hd27技术白皮书1简介11 FusionInsight hD概述FusionInsight是华为仝业级大数据存储、查询、分析的统一平台,能够帮助全业快速构建海量数据信息处理系统,通过对巨量信恳数据实吋与非实时的分析挖掘,发现全新价值点和企业商机应用层REST API数据服务明细影像推荐/伪控关系轨迹Data世像ServiceREST API/SQL/SDKloaderMe知认FormerManager数据分析Data Farm数据集成信数据挖识、服务框智慧配置管理性能管理告警管理数据处理发全管理DataoS hadoop Spark2 STORM(Flink LibrA租户管理灾备管理FusionInsigh解决方案由5个子产品 FusionInsight hD、 Fusioninsight libra、FusionInsight miner、 FusionInsight Farmer和1个操作运维系统 FusionInsight manager构成FusionInsight HD:企业级的大数据处理环境,是一个分布式数据处理系统,对外提供大容量的数据存储、分析查询和实时流式数据处理分析能力。usionInsight HD包括 Zookeeper、 Hadoop、 HBase、 Loader、 HBase、Hive、Hue、 Oozie、 Phoenix、Solr、 Redis、 Spark、 Streaming、 Kafka、E、 Flink等组件。FusionInsight miner:个业级的数据分析平台,基于华为 FusionInsight hd的分布式存储和并行计算技术,提供从海量数据中挖掘出价值信息的平台。FusionInsight Farmer:企业级的大数据应用容器,为企业业务提供统一开发、运行和管埋的平台。Fusionlnsight Manager:企业级大数据的操作运维提供,提供高可靠、安全、容错、易用的集群管理能力,支持大规模集群的安装部署、监控、告警、用户管理、权限管理、审计、服务管理、健康检査、问题定位、升级和补丁等功能FusionInsight librA:企业级的MPP关系型数据库,基于列存储和MPP架构,是为面向结构化数据分析而设计开发的,能够有效处理PB级别的数据量。 FusionInsightLibrA在核心技术上跟传统数据库有巨大差别,可以解决很多行业用户的数据处理性能问题,可以为超大规模数据管理提供高性价比的通用计算平台,并可用于支撑各类数据仓库系统、BⅠ( Business intelligence)系统和决策支持系统,统一为上层应用的决策分析等提供服务。文档版本01(2017-07-30)华为专有和保密信息版权所有c华为技术有限公司华为 FusionInsight hd27技术白皮书1简介12 FusionInsight hD组件介绍数招外析数据集成菜群理款据挖握数据挖掘处理Mahout(on MRMI I ib(on Spark)ahx款什理作业调应DSL领域描述语U。2e枇处互询KV面流式杏诈HiveparksQLRedisStreamcQL批量分市式计算引Loade故障管卫七处理流处理附件处理MapReduceFlinkstorm实时采性能管理分布式资源管Y消思队列安仝售翅Kalka分布式存储雪NOSQL数招库按素引≤QL行惴格式租户管理上传下载FtnonHDFSOROPalyueLCai bun De莫分布式文件系统备份曾理HDFSFusionInsight hd需要对廾源组件进行封裝和增强,对外提供稳定的大容量的数据存储、查询和分析能力。各自组件提供功能如下Manager:作为运维系统,为 I FusionInsight hD提供高可靠、安全、容错、易用的集群管理能力,支持大规模集群的安装/级/补丁、配置管理、监控管理、告警管理、用户管理、租户管理等。HDFS: Hadoop分布式文件系统( Hadoop Distributed File System),提供高吞吐量的数据访问,适合大规模数据集方面的应用。HBase:提供海量数据存储功能,是一种构建在HDFS之上的分布式、面向列的存储系统。Oozie:提供了对开源 Hadoop组件的任务编排、执行的功能。以 Java Web应用程序的形式运行在 Java servlet容器(如: Tomcat)中,并使用数据库来存储工作流定义、当前运行的工作流实例(含实例的状态和变量)。Zookeeper:提供分布式、高可用性的协调服务能力。帮助系统遷免单点故障,从而建立可靠的应用程序Redis:提供基于内存的高性能分布式KV缓存系统。Yarn: Hadoop2.0中的資源管理系统,它是一个通用的资源模块,可以为各类应用程序进行资源管理和调度。Mapreduce:提供快速并行处理大量数据的能力,是一种分布式数据处理模式和执行环境。Spark:基于内存进行计算的分布式计算架Hive:建立在 Hadoop基础上的井源的数据仓库,提供类似SQL的HⅤeQL语言操作结构化数据存储服务和基本的数据分析服务。Loader:基 J Apache Scoop实巩 FusionInsight hD与关系型数据库、p/sp文件服务器之间数据批量导入导出工具:同时提供 Java api/ shell!务调度接口,供第三方调度平台调用。●Hue:提供了开源 Hadoop绀件的 WebUI,可以通过浏览器操作HDFS的目录和文件,调用 Oozie米创建、监控和编排工作流,可操作 Loader组件,査看Zo< eeper集群情况。文档版本01(2017-07-30)华为专有和保密信息版权所有c华为技术有限公司华为 FusionInsight hd27技术白皮书1简介Flume:一个分布式、可靠和高可用的海量日志聚合系统,支持在系统中定制各类数据发送方,用于收集数据;同时,Fume提供对数据进行简单处理,并写入各种数据接受方(可定制)的能力。●Solr:一个髙性能,基于 Lucene的全文检索服务器。Solr对 Lucene进行了扩展,提供比 Lucene更为肀富的查询语言,同时实现」可配置、可扩展,并对查询性能进行了优化,并且提供了一个完善的功能管理界面,是一款非常优秀的全文检索引擎Kafka:一个分布式的、分区的、多副本的实时消息发布-订阅系统。提供可护展、扃吞吐、低延迟、高可靠的消息分发服务Storm:一个分布式、可靠、容错的实时流式数据处理的系统,并提供类SQLtreaInCQL)的查询语言Fink:分布式的、高可用的、能保证 Exactly Once语义的针对流数据和批数据的处理引擎SparkSQL:基于 Spark引擎的高性能SQL引擎,可与Hive实现元数据共享。Mahaut:提供基于 Mapreduce的数据挖掘算法库MLLib:提供基于 Spark的数据挖掘算法库phx:提供基于 Spark的图处理算法库文档版本01(2017-07-30)华为专有和保密信息版权所有c华为技术有限公司华为 Fusionlnsight hd27技术白皮书2重点组件介绍2重点组件介绍21集群管理 Manager22分布式文件系统HDFS2.3统一资源管理和调度框架YARN24分布式批处理引擎 MapReduce2.5分布式数据库 HBase2.6数据仓库组件Hive27分布式内存计算引擎 Spark28全文检索组件Solr2.9批量数据集成 Loader( Scoop)210实时数据采集 Flume2.ll流式事件处理( Storm)212分布式高速缓存 Redis213分布式消息队列 Kafka2.14作业编排与调度 Oozie2.15数据继承入口Hue文档版本01(2017-07-30)华为专有和保密信息版权所有c华为技术有限公司华为 Fusionlnsight hd27技术白皮书2重点组件介绍21集群管理 ManagerManager是 FusionInsight H的运维管理系统,为部署在集群内的服务提供统一的集群管理能力。 Manager支持大规模集群的安裝部署、性能监控、告警、用户管理、权限管理、审计、服务管理、健康检査、日志采集、升级和补丁等功能图2-1 Manager逻辑架构w已妇UP SereIAMCEPPMS匚就动aLdapOM M AgentNode AgentNTP ClerDHTLFusionInsight ManagerFusionInsight Manager由OMS和 NodeAgent组成:●OMS:操作维护系统的管理节点,OMS·般有两个,互为主备。NodeAgen:操作维护系统中的所有被管理节点,每个节点上一个。表2-1业务模块说明模块名称描述Web Service是一个部署在 Tomcat下的web服务,提供 Manager的htts:接口,用于通过浏览器访问 Manager。同时还提供基于 Syslog和SNMP协议的北向接入能力ControllerManager的控制中心,负责汇聚来自集群中所有节点的信息,统一问管理员展示,以及负责接收来自管理员的操作指令,并且依据操作指令所影响的范围,向集群的所有相关节点同步信息nodeAgent存在于每一个集群节点,是 Controller对部署在该节点上组件做切操作的代理。代表本节点上部署的所有组件与 Controller交互,实现整个集群多点到单点的汇聚IAM负责记录审计日志。在 Manager的U上每一个非查询类操作,都有对应的审计日志文档版本01(2017-07-30)华为专有和保密信息版权所有c华为技术有限公司华为 Fusionlnsight hd27技术白皮书2重点组件介绍模块名称描述PMS性能监控模块,搜集每一个OMA上的性能监控数据并提供査询CEP汇聚功能模块。比如将所有OMA上的磁盘已用空间汇总成一个性能指标FMS告警模块,搜集每一个OMA上的告警并提供查询OMMAgent各节点上面性能监控和告警的Agen,负责收集该 Agent Node上的性能监控数据和告警数据CAS统一认证中心,登录 Web service时需要在CAS进行脊录认证,浏览器通过URL自动跳转访问CASAOS权限管理模块,管理用户和用户组的权限OMS Kerberos提供单点登录及 Controller与 Nodc agent间认证的功能OMS Ldap在集群安装前为用广认证提供数据仔储,在集群安装后作为集群中Ldap的备份DatabaseManager的数据库,负责存储配置、监控、告警等信息NTP负责集群内部各节点与OMS节点之向的时钟同步和OMS节点与外部时钟源之间的时钟同步。22分布式文件系统HDFSHDFS是 Hadoop的分布式文件系统,实现大规模数据叮靠的分布式读写。HDFS针对的使用场景是数据读写具有“一次写,多次读”的特征,而数据“写”操作是顺序写,也就是在文件创建时的写入或者在现有文件之后的添加操作。HDHS保证一个文件在个时刻只被一个调用者执行写操作,而可以被多个调用者执行读操作。图2-2分布式文件系统HDFSHDFS ArchitectureMetadata(Name, re)Metadata. opsNamenode/home/foo/data. 3Black opsRead DatanodesDatanodesReplicationBlocksRack 1WriteRack 2文档版本01(2017-07-30)华为专有和保密信息版权所有c华为技术有限公司
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