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wifi 802.11n 协议标准
wifi 802.11n 协议标准Contents2. Normative references ........................................................................................................................... 13. Definitions ...........................................................................................................EEE Std802.11n"-2009(Amendment to ieEE Std 802.11-2007as amended by ieee std 802. 11k-2008EEE Std80211r-2008, EE Std802.11y-2008,and IEEE Std 802. 11w-2009)EEE Standard forInformation technology-Telecommunications and informationexchange between systems-Local and metropolitan area networks-Specific requirementsPart 11: Wireless LAN Medium Access Control (MAC)and Physical Layer(PHY SpecificationsAmendment 5: Enhancements for HigherThroughputSponsorLANIMAN Standards committeeof theIEEE Computer SocietyApproved 11 September 2009IEEE-SA Standards boardAbstract: This amendment defines modifications to both the IEEE 802 1 1 physical layer(PHY)andthe IEEE 802 11 medium access control (MAC) sublayer so that modes of operation can be enabledthat are capable of much higher throughputs, with a maximum throughput of at least 100 Mb/s, asmeasured at the Mac data service access point (SAP)Keywords: high throughput, MAC, medium access control, MIMO, MIMO-OFDM, multiple inputmultiple output, PHY, physical layer, radio, wireless local area network, WLANThe Institute of Electrical and Electronics Engineers, Inc.3 Park Avenue New york NY 10016-5997 USACopyright@ 2009 by the Institute of Electrical and Electronics Engineers, IncAll rights reserved. Published 30 October 2009. Printed in the United States of AmericaIEEE is a registered trademark in the U.S. Patent Trademark Office, owned by the Institute of Electrical and ElectronicsEngineers, IncorporatedPDFSBN978-0-7381-60467STD95961Print:|SBN9780-7381-6047-4STDPD95961No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the priorwritten permission of the publisherIEEE Standards documents are developed within the ieee Societies and the standards Coordinating Committees ofthe IEee Standards Association (IEEE-SA) Standards Board. The ieee develops its standards through a consensusdevelopment process, approved by the American National Standards Institute, which brings together volunteersrepresenting varied viewpoints and interests to achieve the final product. Volunteers are not necessarily members of theInstitute and serve without compensation. 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Comments on standards and requests for interpretations shouldbe submitted to the following addressSecretary, IEEE-SA Standards board445 Hoes lanePiscataway, NJ 08854USAAuthorization to photocopy portions of any individual standard for internal or personal use is granted by The Instituteof Electrical and Electronics Engineers, Inc, provided that the appropriate fee is paid to Copyright Clearance CenterTo arrange for payment of licensing fee, please contact Copyright Clearance Center, Customer Service, 222 RosewoodDrive, Danvers, MA 01923 USA; +1978750 8400 PerImission lo photocopy portions of any individual standard foreducational classroom use can also be obtained through the Copyright Clearance CenterIntroductionThis introduction is not part of IEee Std 802. 11n-2009, IEEE Standard for Information technology-Telecommunications and information exchange between systems--Local and metropolitan networks--Specifirequirements-Part 11: Wireless LAN Medium Access Control(MAC) and Physical Layer(PHY) SpecificationsAmendment 5: Enhancements for Higher ThroughputThis amendment specifies enhancements to IEEE 802. 11 physical layer(PHY)and medium access control(MAC) sublayer to provide modes of operation with useful data rates substantially higher than thosepreviously available. Significantly higher IEEE 802. 11 wireless local area network(WLAN) throughput isexpected to improve user experiences for current applications and to enable new applications and marketsegmentsNotice to usersLaws and requlationsUsers of these documents should consult all applicable laws and regulations. Compliance with theprovisions of this standard does not imply compliance to any applicable regulatory requirementsImplementers of the standard are responsible for observing or referring to the applicable regulatoryrequirements. iEEE does not, by the publication of its standards, intend to urge action that is not incompliance with applicable laws, and these documents may not be construed as doing so on that is not inCopyrightsThis document is copyrighted by the Ieee. It is made available for a wide variety of both public and privateuses.These include both use, by reference, in laws and regulations, and use in private self-regulationstandardization, and the promotion of engineering practices and methods. By making this documentavailable for use and adoption by public authorities and private users, the ieee does not waive any rights incopyright to this documentUpdating of IEEE documentsUsers of ieFF standards should be aware that these documents may be superseded at any time by theissuance of new editions or may be amended from time to time through the issuance of amendments,corrigenda, or errata. An official ieee document at any point in time consists of the current edition of thedocument together with any amendments corrigenda or errata then in effect In order to determine whethera given document is the current edition and whether it has been amended through the issuance ofamendmentscorrigendaorcrrata,visittheIeeEStandardsAssociationwebsiteathttp://ieeexplore. ieee. org/xpl/standards. jsp or contact the iEee at the address listed previously.For more information about the IEEE Standards Association or the Ieee standards development process,visittheIeeE-sawebsiteathttp://standards.ieeeorgErrataErrata,ifanyforthisandallotherstandardscanbeaccessedatthefollowingUrl:http://standards. ieee. org/reading/ieee/updates/errata/index. html. Users are encouraged to check this URL forta periodicallyInterpretationsCurrentinterpretationscanbeaccessedatthefollowingUrl:http://standards.ieeeorg/reading/ieee/interp/index htmlCopyright C 2009 IEEE. All rights reservedPatentsAttention is called to the possibility that implementation of this amendment may require use of subjectmatter covered by patent rights. By publication of this standard, no position is taken with respect to theexistence or validity of any patent rights in connection therewith. a patent holder or patent applicant hasfiled a statement of assurance that it will grant licenses under these rights without compensation or underreasonable rates, with reasonable terms and conditions that are demonstrably free of any unfairdiscrimination to applicants desiring to obtain such licenses. Other Essential Patent Claims may exist forwhich a statement of assurance has not been received. The Ieee is not responsible for identifying EssentialPatent Claims for which a license may be required, for conducting inquiries into the legal validity or scopeof Patents Claims, or determining whether any licensing terms or conditions are reasonable or nondiscriminatory. Users of this standard are expressly advised that determination of the validity of any patentrights, and the risk of infringement of such rights, is entirely their own responsibility. Further informationmay be obtained from the ieee Standards associationParticipantsWhen this amendment was sent to sponsor ballot, the IEEe 802. 11 Working Group had the followingofficersBruce P. Kraemer, ChairJon Walter Rosdahl, Vice Chair; Treasurer; and Chair, Task Group mbAdrian P. Stephens Vice chairStephen McCann, Secretary and Chair, Publicity standing Committee and Task group uTerry L. Cole, Technical Editor and Assigned Number AuthorityTeik-Kheong Tan, Chair, Wireless Next Generation Standing CommitteeDavid Bagby, Chair, Architecture Standing CommitteeBruce p. kraemer Co-Chair IMT-Advanced ad hoc commiteeLee armstrong, Chair, Task Group pDonald E Eastlake Ill, Chair;, Task Group sNeeraj Sharna, Chair, Task group lDorothy V. Stanley, Chair, Task Group v and IETF Ad hoc CommitteeJesse Walker, Chair. cTl Ad hoc committeePeter Ecclesine, Chair, Task group yMenzo Wentink, Chair, Task group zGancsh Venkatesan, Chair, Task Group aaEldad Perahia, Chair, Very High Throughput Study groupDarwin Enger, Co-Chair. IMT-Advanced ad hoc committeeWhen this amendment was sent to sponsor ballot, Task Group n had the following officersBruce P Kraemer. chairSILi. vice chairGarth Hillman and Jon Walter Rosdahl, SecretaryAdrian P. Stephens, Technical editorWhen this amendment was sent to sponsor ballot, the IEeE 802. 1l Working Group had the followingmembershiOsama S. aboulmagdMalik audchAmit bansalTomoko adachiCcrt A, awatoJohn. barrAlok aggarwalDavid bagbGal bassonCarlAldanaMichael bahrussa BavafaThomas AlexanderFan baiTuncer BaykasLee r. ArmstrongGabor BaikoJohn L. BenkoAlex ashleyDennis j. bakerMathilde benvenisteCopyright C 2009 IEEE. All rights reservedBiorn A. berkeRobert Y huangChiu ngoDaniel borgesDavid hunterEero nikulaAnthony braskichYasuhiko inoueRichardH. noensJoseph brennanAkio isoHideaki odagiriDavid britzJunghoon JeeJisung OhG. BumillerHongseok JeonChandra s. olsonNancy Cam-WingetYeonkwon JeongYouko omorNecati CanpolatJorjeta G JetchevaSatoshi oyamaJavier cardonaLusheng jiRichard H. PaineDouglas s ChanDaniel JiangAuld. palaniveluClint F. ChaplinPadam AflChangmin ParkCarl W. KainJungsoo parkMinho CheongNaveen K KakanMinyoung ParkMasato katoⅤ ijaykumar PatelNakjungDouglas KanBcminih. peirisLiwen chuRichard H. KennedyEldad perahiaTerry L. ColeJohn KenneJames e. petranovichRyon K. ColemanStuart 3. KerryAl PetrickCharles IJoonsuk kinFahd pirzadaTodor CooklevKyeongpyo KimJames d. portaroXavier p CostaSeong S. kimHenry s. PtasinskiDavid E CypherYongsan KimRene purnadiMarc de courvilleJarkko kneckChang w. PyoRolf J de vegtMark m. kobayashiEmily H QiTheodorus denteneerFumihide KojimaLuke QianJeremy de vriesTom KolzeHuyu QuSusan DickeyBruccp KJim e raabZhiming DingJohannes P KruysⅤ nuth raiYoshiharu doThomas KuehnelAli RaissiniaJohn dorseyThomas m. KuriharaHarish ramamurthyRoger P durandStephen G raymentSrinivasa duvvuriEdwin kwonLeonid razoumovDonald e. eastlakeZhou lanIvan reePeter Ecclesiaejeremy A landtEdward reussMichael ellisJoseph P. lauerAlex reznikStephen P. EmeottTae H. LeeRandal roebuckMarc emmelmannWooyoung leeJon walter rosdahlDarwin EngwerJoseph levyRichard royJoseph epsteinSheung liAlexander safonovⅤ inko ercegPaul linKazuyuki sakodaLars p. falkIlang liuHemanth sampathRobert fanfcllMichael livshitzKatsuyoshi SatoStefan fechterPeter LocHirokazu sawadaPaul h. feinberDaniel lubarDon schultzMatthew FischerAnthony f. maidaYongho SeokWayne k. FisherJakub majkowskiHuairong shaoRoberta fracchiAlastair MalarkyNeeraj sharmaRyuhei FundaJouni K. malinenStephen J ShellhammerMatthew gastAlexander maltsevlan SherlockJames p gilbBill marshallKai shiJeffrey gilbertRoman m. maslennikovShusaku shimadaReinhard GlogerSudheer mattaFrancois simonDavid goodallStephen Mc cannHarkirat SinghTugrul guenerJustin p mcnewGraham K. SmithJianlin gven meseckeMatt smithMark hamiltonRobert r. millerYoo-Seung SongC.J. HanseMichael monteKapil seBrian d. hartRajendra T. moortiVinay SridharaAmer A haHitoshi moriokaDorothy stanleⅤ egard hasselPeter MurrayAdrian P. StephensRobert f heileAndrew milesDavid S Stephenson〔 undo r. HertzRohit nabarCarl R. StevensonJunling hiJohn stineWendong huKengo nagataGuenaelt strutCopyright C 2009 IEEE. All rights reservedChin s SumGanesh VenkateHarry R. worstellEiji TakagiDalton t.Ⅴ ictorPengfei xiaMineo takaiGeorge A. vlantisAkira yamadaTcik-Khcong TanCssc r. walkerTakeshi yamamotoAllan thomsonunlWangmoya yamauraJerry thrasherngEric okuboCraig d. WarrenSu K. YongAlexander TolpinFujio WatanabeSeiji YoshioJason trachewskyPatrick WayeChristopher YoungSolomon b. traininMenzo m. wentinkArtur zaksRichard D. Van NeeFrank whettenHongyuan zhangAllert van zelstKyle williamsHuimin zhangMathieuⅤ arlet-AndmJames worshamJing zhiPrabodh varshneyJuan ZunigaContributions to this amendment was received from the following individualsBill ablⅵ inko ErcegPatrick labbeSantosh abrahamMustafa rozJoseph lauerTomoko adachiStefan fechterDongjun leeDmitry akhmetovPaul feinbergLin-Nan leeCarlos aldanaMatthew fischereeDave andrusGuido frederiksSok-kyu LeeMicha anholtTakashi FukagawaZhongding leiTsuguhide AokiPatrick FungJoseph levyYusuke asarEdoardo gallizioScott leyonhjelGeert awaterJames gardnerPen liDavid BaDevis gattSheung LiRaja banerjeaDavid HedbergYuan liKaberi banerieeGarth hillmanKevin liaoAmit bansalJin-Meng hoIsaac limGal bassonDale hocevarAlfred linAnui batraLouise hooAlbert liuJohn benkoMuhammad akramDer-Zheng liuMathilde benvenisteYasuhiko inoueMichael livshitzBjorn BjerkeKaz ishidaYufei BlakenshipTakashi ishidoshiroPeter LojkoDaniel borgesLakshmi lyerHui-Ling LouDouglas chanEric JacobsonAdina matacheJerry ChangYuh-Ren jauhLaurent mazetJohn ChangTaehyun JeonWilliam mcfarlandJeng-Hong ChenJari JokelaDarren mcnamaraStephen ChenVKJonesIrina medvedevYi-Ming ChenPadam AflArnaud meylanPei-ju ChiangNaveen KakaniMorgan mikFrancois chinSriniavs kandalaSeungwook minWoon Hau ChinAteet KapurPatrick mo上 mily chouAssaf KasherAndy molischLiwen chuMasato katoR. Tushar moortiKeith ChuggJohn KetchumMike moretonBrian ClassonJoonsuk KYuichi moriokaSean CoffeyPansop KimMarkus muckGabriella convertinoYoungsoo KimSyed Aon mujtabaMarc de courvilleGuenter KleindlAndrew mylesRolf de vegtKiyotaka KobayashiRohit nabarFranz dielacherCenk Koselhasa NagaiYoshiharu doiBruce p KraemerKengo NagataJohn deThomas KuehnelSeigo NakaodouglasTakushi KunihiroSanjiv nandaPeter ecclesiaeJoe KwakChiu nDarwin EngwerJoseph kwakAjit NimbalkerLeonid epsteinEdwin kwonGunnar NitscheCopyright C 2009 IEEE. All rights reservedHuaning NiuErik SchylanderRichard van neeIvan oakesMichael sealsNico van waesYoshihiro ohtanilual-Rong ShaoAllert van zelstEric OjardSuman sharmaAndres vila casadoTakeshi onizawaSteve shellhammerGeorgeⅵ lantisJob oostveenIan SherlockTimothy WakeleyFabio osnatoMasaaki shidaJesse walkerKafle padamTakashi shonoBrad wallacePratima paiSebastien SimoensMark wallaceArul palaniveluMassimiliano sitiRod waltonSubra parameswaraDoug SmithQi WThomas pareMatt smithXiaowen WangJean-Noel PatillonAmjadDeric WatersWei-Chung PengRobert staceyMark WebsterEldad perahiaAdrian P. StephensMenzo WentinkJim petranovichRichard WeseKrishna madhavan pillaiVictor StolpmanMike WilhoyteMadhavan pillaiSumei sunTimothy WongAngelo PoloniXiantao sunJames WoodyattNeeraj poojaryShravan surineniHenry ptasinskiIlan sutskoverAriton XhafaAleksandar PurkovicEiji Takagio xiaLuke oianMasahiro takasTomoya YamauraAli RaissiniaSeiichiro TakahashiEric YangSthanunathan ramakrishnanDaisuke takedaWen-Chang YehHarish RamamurthyTeik-Kheong TanChristopher YoungSridhar rameshYasuhiro TanakaHeejung YuRaffaele rivaStephan ten brinkArtur ZaksJon walter rosdahlGanesan ThiagarajanEldad zeiraStephanie Rouquette-LeveilEric OkuboHongyuan zhaMike rudeTim TowellJin ZhangJohn sadowskiJason trachewskyNing ZhangAtul salhotraSolomon traininQuan ZhouVincenzo scarpaDavid tungJohnny ZweigDonald schultzStefano valleJim syrenThe following members of the individual balloting committee voted on this amendment. Balloters may havevoted for approval, disapproval, or abstentionOsama aboulmagdBill cannonSouray duttaTomoko adachiJing CaoRichard eckardAlok AggarwalEdward CarlesCarl EklundThomas alexandeJames CarloStephen emeottRichard AlvinJuan CarreonMarc emmelmannEdward ChalfDarwin EngwcButch AntonDouglas s ChanJoseph epsteinDanilo antonelliKuor-Hsin ChangRobert fanfelleClint ChaplinShahin FarahaniDavid BagbyWei-Peng ChenShulan FengGabor BaikoYung-Mu ChenOddgeir FikstvedtMatthew ballHong ChengMatthew fischerRaja banerjeaAik ChindapoPrince francisVered BKeith ChowAvraham FreedmanJohn barrLiwen ChuDevon gaylePhilip beecherRyon ColemanMichael GeipelMathilde benvenisteCharles cookTheodore Georgantasharry bimsTodor CookiePieter -Paul giesbertsBjorn BjerkeHelge CowardJames gilbMonique brownJoseph decuirReinhard glogerRussell dietzMariana goldhamerWilliam byrdThomas dineenScrgiu gomaPctcr. calderonJohn dorseyDavid goodallCopyright C 2009 IEEE. All rights reserved
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高频电路设计与制作 市川裕一.pdf
高频电路设计与制作 市川裕一.pdf 高频电路设计与制作 市川裕一.pdf图字:01-2005-1166号内容简介本书是“图解实用电子技术丛书”之一。全书共分9章。本书首先对高频的基本知识加以介绍,然后在后续的篇章里,对开关、低噪声放大器、混频器、滤波器、检波电路、振荡电路、PLL的设计与制作等进行详细论述。本书全面地阐述了有关高频电路设计的基础理论及其实际制作,且配有大量的印制电路板图、仿真电路等,图文并茂,大大地提高了本书的参考阅读价值本书适合电子通信及其相关领域的工程技术人员参考阅读,也可作为大专院校电子、通信专业学生的课外阅读资料。图书在版编目(CIP)数据高频电路设计与制作/(日)市川裕一,青木胜著;卓圣鹏译;何希才校北京:科学出版社,2006(图解实用电子技术丛书)ISBN7-03-017369-4I.高…Ⅱ.①市…②青…③卓…④何…Ⅲ.高频电路-设计Ⅳ.TN710.2中国版本图书馆CIP数据核字(2006)第058116号责任编辑:赵方青崔炳哲/责任制作:魏谨责任印制:刘士平/封面制作:李力北京东方科龙囹文有限公司制作http://www.okbook.com.cn学寓版出版比京东黄城根北街16号邮政码:100717http://www縹海印剁有限责任公司印刷科学出版社发行各地新华书店经销2006年8月第版开本:B5(720×1000)2007年2月第二次印刷印张:印数:4001-7000字数:271000定价:39.00元(如有印装质量问题,我社负责调换(新欣》)译者序对电路设计而言,高频电路是由具有丰富经验的技术人员进行设计的。所以,高频电路的设计工作重任往往肩负在前辈工程师的身上。因为高频电路涉及的参数很多,设计时受周边电路的影响很大,不仅要考虑电路本身的设计,也要顾及所使用印制基板的材质、厚度和印制布线等。只要设计不当,就会产生寄生电容形成谐振电路,造成信号被衰减或产生噪声,导致无法满足设计要求。因此,高频电路设计人员需要有经验,所谓经验,就是设计时能事先避免一些不合常理的设计以及解决电路设计时所遇到的问题般初学者可能不具备这些能力。但是,随着科技的进步,高频电路设计的门槛逐渐降低,高频电路/微波电路用的仿真软件也得到了快速的发展。不了解高频电路的人,只要使用髙性能仿真软件,就能得到所需要的性能。因此,设计人员只要依照仿真电路,稍具备一些基本设计概念,就能够设计出高频电路。一般说来,虽能靠仿真软件来设计出所期望的电路,但是,最后还是靠人工去完成。因此,设计人员必须不断学习新知识、积累实际操作经验才能顺利地完成设计任务,而本书就是充实自己的一本好书。本书是高频电路设计的入门书,其内容包括:高频的基础知识,开关、低噪声放大器、混频器、滤波器、检波电路、振荡电路以及PLL等的设计与制作。这些设计与制作都是最基本的概念,根据实际的图表加以说明,使初学者能很快进入高频电路设计领域,对一些有经验的设计者而言,本书也是一本不可或缺的参考书本书内容新颖,深入浅出地介绍了高频电路设计。由于时间仓促,立意虽宏,疏漏之处尚祈不吝指教GHz Jidai no Kousyuuha Kairo SekkeiBy yuichi Ichikawa, Masaru AokiCopyright c 2003 by Yuichi Ichikawa. Masaru AokiAll rights reservedOriginally published in Japan by CQ Publishing Co, Ltd, TokyoChinese (in simplified character only) translation rights arranged withCQ Publishing Co, Ltd, JapanGHz時代O高周波回路設計市川裕—青木胜cQ出版株式会社2004著者简介市川裕一1963年生于群马县1985年毕业于群马大学部电子工学科1985年进入日本光电工业(株)1985年进入日本电气电波机器 Engineering(株),从事微波电路设计1988年进人(株)横尾制作所,从事卫星通信用LNB的设计开发1992年进入太阳诱电(株),从事微弱无线组件设计1999年创办 I-Laboratory,从事高频/微波电路的开发、设计与试制,咨询现在出任1 Laboratory代表青木胜1955年生于埼玉县1979年进入八重州无线(株),从事无线通信设备开发1983年进入日本摩托罗拉(株),从事通信设备的信号处理,控制软件的开发现在出任(有)DST代表董事长图解实用电子技术丛书高频电路设计与制作开关/放大器/检波器/混频器/振荡器的技巧详解〔日]市川裕一青木胜著卓圣鹏译何希才校钭学出版北京前言直到最近,所谓“高频”是指在电气电路中一块特殊的领域。那里是“电子技术人员的世界”,尤其在微波电路的设计现场,反复使用小刀加工印制图案,完成焊接铜箔的作业。作者到现在仍然记得,在刚刚进入高频行业时,听公司的前辈说过,“成为一名合格的技术人员,需要花费10年的工夫”。由于在高频领域常采用试探法,因此,也许从事数字电路或低频电路的专业人员看来,高频电路世界是不易接近的领域。然而随着移动电话的迅速普及,蓝牙( Bluetooth)、无线LAN等无线数据通信设备的快速开发,高频电路技术越来越受到关注。直到今天,人们认为“高频、微波设备是面向防卫产业的特殊技术”,但随着时代的变迁成为最先进技术及通信革命中不可或缺的普遍技术。实际上,在以电气大厂家为中心的高频领域,各种行业不同厂家的加入,且此领域中高频电路技术人员难求的局面仍在延续与过去相比,现在高频电路设计门槛变低而容易进入。原因是根据用户的要求,高频电路/微波电路用的仿真软件在迅速发展。不了解高频电路的人,看看学学久而自通,对输入电路进行最佳化,就能简单设计出相应特性的电路。若使用最近高性能的仿真软件,如果是简单的无源电路,有时也能够实际得到趋近预测特性的性能。但是,仿真软件毕竟是工具,是否能有效利用这种工具全凭使用者所具备的经验与理论基础。在实际的高频电路中,由于有仿真软件不能表现的许多电路要素;因此,实际上,一定要考虑肉眼看不见的电路要素,进行元件的配置,绘制印制图案。使用仿真软件的人,由于积累经验、具备知识的不同,完成的性能有很大差异。常听说“在公司只能做确定工作,不能积累各种经验”。此时,最有效的工作方法是使用仿真软件。若使用仿真软件,就能验证工作中所处理电路的工作情况,并进行调整。若使用刊载于文献与书中的电路或仿真软件附属的样品电路,就能够简单处理各种电路。若由仿真得到虚拟经验,并同时进行日常实用电路的设计与调整,就能极大地提高设计能力。这里,作者最想说的是“要积累丰富的经验”,不仅要阅读文献、书籍,还要尽量多地接触电路,自己动手实际制作,并通过测试调整使电路稳定可靠地进行工作。若接触众多电路,即使要必须设计全新电路或无经验电路时,也会取得成功的。本书是以晶体管技术2000年11月~2001年12月的连载与2000年6月特刊内容作为蓝本,内容加以补充,而后编辑而成。第2章以必须理解的内容为最低限度,对设计高频电路时史密斯图的用法和匹配方法进行了说明。高频电路入门者阅读的图书定是以电磁场理论为中心进行讲解,因此,本书尽量删除了一些难以理解的说明。第3章~第9章,是实际设计、试作并评价2GHz频带的各种高频电路本书所试作的电路还不是十分成熟的电路,有许多改善之处。试作相同电路,无问题也正常动作,“成功啦!”由此感到很高兴,但这并不是结束,而是“经验”积累的开始,大家手脑并用,使这种电路具有更佳的特性。采用试探法过程中,或许大家有新的发现。这就是电路特性好过了头,反而会变坏,这也是“经验”。作为积累经验的题材若能利用本书,那是件高兴的事将自己的想法整理出来以文章的形式呈现给大家,这对于作者来说,也是一次很好的学习机会,并且也是积累经验的过程。本人能够承担本书编写工作,感到非常荣幸最后谨向在百忙之中很快完成了第8章和第9章的编写任务的DST公司的青木胜先生,以及为了使本书浅显易懂而做编辑工作的晶体管技术编辑部的寺前裕司先生致以深深的谢意。2002年冬市川裕目录第1章欢迎进入高频世界—一成为高频工程师为目标1.1频带和电路1.2高频电路设计环境的变化………11241.3现在高频电路设计中广泛存在的弊端……第2章高频的基础知识——为了更好地理解高频信号…2.1信号的波长…………2.2高频电路看作分布常数的电路………2.3高频中最重要的工作是传输线的设计…………112.3.1表示传输线电气特性的“特性阻抗”…………112.3.2高频使用的传输线……2.4用分布常数与集中常数制作的高频电路2.5高频中功率比电压与电流更容易处理…162.5.1S参数的概要…………………2.5.2实际高频元件数据表中记载的S参数…2.6用史密斯图求阻抗2.6.1史密斯图222.6.2在史密斯图上描绘阻抗………………………252.6.3元件与传输线路的增加以及史密斯图上的阻抗轨迹………………………262.7高效率地传输高频信号的技术—匹配………302.7.1禁止使用电阻取得匹配……,,,2.7.2阻抗匹配实例1………………322.7.3阻抗匹配实例2…2.7.4匹配电路构成的不同造成输入阻抗特性的差异……………………………3目录2.7.5使用实际元件的匹配电路………2.8实际无源元件的高频阻抗………2.9能发挥高频电路性能的印制基板的设计2.9.1高频电路用印制基板的基础知识2.9.2印制图案的精度与特性阻抗的偏差2.9.3印制图案“弯曲”对特性阻抗的影响……2.9.4邻近接地图案对信号图案的影响2.9.5邻近信号图案的耦合会彼此影响……………第3章开关的设计与制作—控制信号流的技术3.1高频开关的作用与性能……………3.1.1开关的作用……………………3.1.2开关要求的性能……………3.2开关的种类与选择……………3.3高频开关所使用的半导体元件3.3.1PIN二极管…………3.3.2 MESFET……………………………………633.4PIN二极管作为开关元件的特性实验……………63.5开关基本型—SPST开关的种类与特性…3.5.1两种SPST开关…………………………3.5.2SPST开关的接入损耗与隔离特性3.6SPDT开关的种类与动作3.6.1串联型与并联型的组合开关………………753.6.2两种串联型的组合开关……3.7试作的SPDT开关特性的仿真分析3.7.1SPDT开关的规格…………………………793.7.2试作SPDT开关的高频特性+,隔离特性的改善、,单3.8SPDT开关的试作873.9试作SPDT开关基板的初始特性与调整3.10试作前仿真预测与评价结果不同的原因…………95
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