TFT/LCD驱动IC NT35510芯片手册datasheet
TFT/LCD驱动IC、手机显示屏驱动IC-NT35510，文档详细讲解了该芯片的接口定义，以及驱动显示屏的解决方案.NOVATEKPRELIMINARYNT355105.4.2 MDD/ Link Packet Descriptions by the NT355101625.4.3 Writing Video Data to Memory Sequence.......1725.44 Writing Register Sequence...….…,…1725.4.5 Reading video Data from Memory Sequence.7735.4.6 Reading Register Sequence………,…,…,…,…,…,…,…,…,…,…,…,…,…,…,…,…,………735.4.7 Hibernation Setting-..,.,…,…T745.4.8 MDD/ Deep Standby Mode Setting-……,……,…,…,…,…,…,…,………,…,…1755.5 INTERFACE PAUSE1775. 6 DATA TRANSFER BREAK AND RECOVERY.1785.7 DISPLAY MODULE DATA TRANSFER MODES,58RGB| NTERFACE,,nn,,…,…,,,……18158.1 Genera/ Description.…,.,.,…,…1815.8.2 RGB Interface Timing Chart1825.8.3 RGB Interface Mode Set.1835.8.4 RGB Interface Bus Width Set.18759 FRAME MEMORY,……,,,191591 Configuration…....…n1915.92 Address Counter….……………,7925.9.3 Interface to Memory Write Direction.........1935.9.4 Frame Memory to Display Address Mapping.......n…1945.10 TEARING EFFECT INFORMATION1955.10.1 Tearing Effect Output Line1955.10.2 Tearing Effect Bus Trigger..........面面面面面面面aa面面看日自DB自2005.11 CHECKSUM2125.12 POWER ON/OFF SEQUENCE2145. 12. 1 Case 1-REsX line is held High or Unstable by Host at Power On..................2155. 12.2 Case 2- ResX line is held Low by host at power on...e.2165.12.3 Uncontrolled power off2765.13 PoWER LEVEL MODES wmmmmmm2175.13.1 Definition2175.13.2 Power level Mode flow chartn2185.14 RESET FUNCTION…112205.14. 1 Register Default value2205.14.2 Output or Bi- directiona/{o)Pins………,,,…,……………,…,…,,…,…………,……,………2225.14.3 Input Pins………,…,,…,…2221028/20113Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT355105.15 SLEEP OUT-COMMAND AND SELF-DIAGNOSTIC FUNCTIONS OF THE DISPLAY MODULE2235. 15. 1 Register loading Detection.....2235.15.2 Functionality Detection2245.15.3 Chip Attachment Detection…….2255.16 DISPLAY PANEL COLOR CHARACTERISTICS mmmm 2265.17 GAMMA FUNCTI0N..…,………面国面面面国面2275.18 BASIC DISPLAY MODE■日量2285.19 NSTRUCTION SETTING SEQUENCE2295.19.1 Sleep In/Out Sequence…,…,…,…,…,…,…,…,…,…,,…,…,…,…,,…2295192 Deep Standby Mode Enter/ Exit Sequence……2305.20 INSTRUCTION SETUP FLOW2315. 20.1 Initializing with the Built-in Power Supply circuits2315. 20.2 Power OFF Sequence232521 MTP WRITE SEQUENCE…….2335.22 DYNAMIC BACKLIGHT CONTROL FUNCTION234522.1 PWM Control Architecture面面面面面面a面a面面2365. 22.2 Dimming Function for LABC and Manual Brightness Control6.22. 3 Dimming Function for CABC and Force PWM Function,2445.22.4 PWM Signal Setting for CABC and LABC2455.2.5 Content Adaptive Brightness Contro/CABC)………,2475.22.6 Ambient Light Sensor and Automatic Brightness Contro(LABC)…,…,…,…,…,…,…,…,…,………2485.23 COLUMN, 1-DOT, 2-DOT, 3-DOT AND 4-DOT INVERSION (VCOM DC DRIVE2556 COMMAND DESCRIPTIONS2566.1 USER COMMAND SET256NOP0000)....,.…260SWRESET: Software Reset (0100h ...267RDDID: Read Display ID(0400h-0402h)262RDNUMED: Read Number of Errors onRDDPM: Read Display Power Mode(0A00h)............264RDDMADCT: Read Display MAdo间0B0oh),…,265RDDCOLMOD: Read Display Pixel Format0cooh)………266RDDM: Read Display image Mode间 0D00h)……,…………………………………………………………267RDDSM: Read Display signa/Mode(0E00h)……................,…………………268RDDSDR: Read Display Self-Diagnostic Result(sLPN: Sleep In(1000h)-……2701028/20114Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510SLPOUT: Sleep Out(100h)……,…,…,…,…,…,…,…,…,……272PTLON: Partial Display Mode On(1200h).........274NORON: Norma| Display Mode On(1300h)...............………275INVOFF: Display Inversion Off (2000h)276yvoN: Display Inversion On(2100b)….......……量道量道面道量温量量量面量面面面面目面面277ALLPOFF: All Pixel Off(2200h)278ALLPON: All Pixel On(2300h280GAMSET: Gamma Set(2600h)…,,,,,,…,282DISPOFF: Display ofi(2800b)….……....,,…,…,…,…,……,283DISPON: Display On( 2900b)284CASET: Column address set(2A00h~2A03h).……,,…285RASET: Row Address Setn287RAMWR: Memory Write(2c00h)289RAMRD: Memory290PILAR: Partial Area(3000h-3003)....∴291TEOFF: Tearing Effect Line OFF (3400h)面面面面面a面面294TEON: Tearing Effect Line ON (3500h)295MADCTL: Memory data Access Control (3600h)..............................296DMOFF: dle mode o(3800……299IDMON: ldle Mode On (3900h).......300COLMOD: Interface Pixel Format 3A00h)302RAMWRC: Memory Write Continue(3c00h)…..........……303RAMRDC: Memory Read Continue(3E00h)……,…,,…,,,…,…304STESL: Set Tearing Effect Scan Line(4400h-4401)...........305GSL: Get Scan Line(4500h-4501h),.…,…,…,…,…,…,…,…,…,…,…,,…307DPCKRGB: Display Clock in RGB Interface(4A00h)308DSTBON: Deep Standby Mode On(4F00h)BIEaIESEBBSEBSEEEE309WRPFD: Write Profile value for Display (5000h-500Fh)........................310WRDISBV: Write Display Brightness(5100h)...………311RDDISBV: Read Display Brightness(5200h)…,…312WRCTRLD: Write CTRL Display(5300h)………313RDCTRLD: Read CTRL Display value(5400h)……,.....,…....……,…,…………315WRCABO: Write Content Adaptive Brightness Contro(5500h)…………………317RDCABO: Read Content Adaptive Brightness Control(5600h)…….…,…,…,…,…,……,…,…,……………………318NRHYSTE: Write3191028/20115Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510WRGAMMSET: Write Gamma Setting(5800h-5807h)..eec.321RDFSVM: Read Fs Value MSBs(5A00h)...........323RDFSVE: Read Fs value lsBs(5B0h)..............….……324RDMFFSVM Read Median Filter Fs value MSBs (cooh).325RDMFFSVL: Read Median Filter Fs value LSBs(5D00h)326WRCABCMB: Write CABC minimum brightness(5E00h).,…,…,…,………,,………327RDCABCMB: Read CABC minimum brightness(5Fooh).........328WRLSCO: Write Light Sensor Compensation Coefficient value(6500h~6501h)………,……………,…,…,…………329RDLSCCM: Read Light Sensor Compensation Coefficient Value MSBs(6600h )......,.........-. 330RDLSCCL: Read Light Sensor Compensation Coefficient Value LSBsRDBWLB: Read Black/White low Bits(7000h)332RDBkX: Read Bkx (7100h)333RDBky: Read Bky(7200h)334RDWX: Read Wx( 7300b)............. e..335RDWy: Read wy(7400h)…336RDRGLB: Read Red/Green Low Bits(7500h).......337RDRx: Read Rx(7600).……338RDRy: Read Ry(7700b)..........339RDGX: Read…,,,,,,,,340RDGy: Read Gy(7900h)....................n…341RDBALE: Read blue/ color low Bits(7A00h)……n,,342RDBx: Read Bx(7B00b)-..……,,,343RDBy: Read By(7c00b),,,,.,.,.,.,.,.,.,...,.,.,.,.,.,.,.,…,…344RDAx: Read ax(7D0oh)………,…345RDAy: Read Ay(7E00h)……,…,…,…346RDDDBS: Read DDB Start(A100h-A104h347RDDDBC: Read DDB Continue(A800h-A804h)349RDFCS: Read first checksum(AA0oh)……351RDCCS: Read Continue Checksum(AF00h)-.…………352RDID1: Read iD1 value(DAooh).ee..353RDD2: Read D2 Value(DB0oh)……354RDD3: Read D3vaue( COoh)……………,……………,…………………,…3557 SPECIFICATIONS…3567.1 ABSOLUTE MAXIMUM RATINGS.3567.2 ESD PROTECTION LEVEL3561028/20116Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT355107. 3 LATCH-UP PROTECTION LEVEL3567.4 LIGHT SENSITIVITY3567. 5 DC CHARACTERISTICS3577.5.1 Basic characteristics.357752MP/ Characteristics35975.3 MDD/ Characteristics wwwwwww 3617.5. 4 Current Consumption in Standby Mode and DSTB Mode..3627.6 AC CHARACTERISTICS3637.6.1 Parallel Interface Characteristics (80-Series McU)36376.2 SerialInterface Characteristicsaaaassaaaaussuaaaaaaaaaaaaaaaaaaaa3647.6.3 12C Bus Timing Characteristics36576.4 RGB Interface Characteristics3667.6.5 MIP/DS/ Timing Characteristics3677.6.6 MDD/ Timing Characteristics........3717.6.7 Reset Input Timing3728 REFERENCE APPLICATIONS. G.…3738.1 MICROPROCESSOR INTERFACE3738. 2 CONNECTIONS WITH PANEL. m..n..37810/28/2011Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510REVISION HISTORYPrepareChecked ApprovedVersionContentsDatebyy0.00OriginalKevinn swDennis2010/02/12Page 9, remove 32ORGB X 480Page 10, Features, remove 32ORGB X 480 and mux descriptionVGHO VGLO for gate control signals, remove VDDIM/SSIMPage11, update power voltage rangePage 12, Block diagramPage 13 to 22Add: VDD DET, DIOPWR, PSWAP, DSWAP, VGHO, VGLO, VRGHVREFCP, CSP, CSN, LVGL, C61P, C61N, VRGH, VREF, GOUT.Remove: VDDIMSSIM. VDDELUpdate: MVDDL,VGL,VGH, Test pinsPage23, update IF tablePage 51 to 66: update SPl, M3=1 setting in figurePage 102, 103, change DSIM, DSiG bit Reg to OXB 100Page 115, 124 Add WrPFD 50h on tablePage201, modified to 480X864 memoryPage202, Remove 320x480Page204, update whole Frame memory tablePage 205, TE map to 480 lines, DOPCTR change to B100hPage207, tvdI TBDPage225, 226, update VDD in figurePage227, Modes to 7Page232, Sout update to Gout0.01Page235, Add chip attachment Detection sectionKevinSWDens2010/03/17Page237, update Gamma StructurePage255, 270, update FOSC, ExamplePage266, update KB CLEDPage272, Add inversion sectionPage273, 274, Power ArchitecturePage275, update DIOPWRVREFCP, VGMP1,VGLOPage276, update C61P/N, LVGL, VGLO, VRGH,VREFCP, DIOPWR,VGMP 1/2VGMNVGSPVGSNPage291, change name to RAMKPPage306 to 312, remove 320x 480 resolution settingPage337, 5400h Cmd add a andg bitPage385, Absolute Max Rating for MV Hv, remove VDDIMPage 386, VDDIM removePage387, Vdev value modifiedPage402, 403, Remove MVDDI in notePage406, Remove 320 X 480, update 360X640 Sout sequencePage 173 to 181, MDDI windowless packetPage377, 379, A1, A8 cmd updatePage387 to 396, VDDI to 3.3VPage362 to 37670h to 7Eh cmd default valuePage28, 29, 30, 40, 41, 42 MPU figure updatePage 12, 274 Block and power architecture update10/28/20118Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510Page 10, remove 36ORGB X 640, Add 480RGBx720Page 11, update GPo[3: 01pdate VGHO, VGLOge 13, update Block DiagramPage 18, update IM, GPO, VSEL, and EXB1TPage 20, update VGLO, LVGLPage 21, update VGLX,VGL REG, Remove CP6 P/NPage 23, update VDD BCPage 24, update ContACT1-4, VSSIDUMPage 25, update iF description tablePage 207, update Address CounterKevinDennis2010/0406Page 235, update Resolution DataPage 252, remove CLED VOLPage 271, remove KB CLED_ VOLPage 277, add 4 dot inversionPage 306, 308, 313, 326 resolution update, remove nHD, add 480X720Page 384, update absolute voltagePage 385, update DC specPage 386, update Note3, Note5Page 405. update resolutionPage 406. update Alignment Mark-Page10,11205,206,234,305307,312,325404, update resolutionPage 13, update Block diagramPage 17-24, update pin description(MDDI not support DSWAPUpdate TEIR, TE_L, DSTB SEL, RESX, VSEL VREF PWR 12C_SDAremove VDD BD, ENDIOVPagB104121ric data type 0x24Page 134, update eotP optionPage 175, update MDDI support typPage 176, 177, update sub frame header, link shut down packetSWDennis2010/05/18Page 179, 180, update skew calibration packet, client capability packetPage 184, update packet type is 20Page 209, 214, update tE off, output is low, tering effect bus triggerPage 241, update gamma to 10 bits settingPage 276, update 3-dots inversionPage 384 update VIH, VIL, VoH,VOLPage 388, update hibernation wake upPage 390, 392 update Note2-Remove pad chapter to application note10/28/20119Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510Page 14, update block diagram of RGBBPPage 16, update WRX/SCL/2C SCL, sDI/2C SDAPage 19-25, update IM3 pin description, RGBBP(remove 12C SA1)OSC Test description, KBBC to test pinPage 21, update VREF PWr descriptionPage 26, update IM tablePage 42-44, update MPU read scriptionPage 49-52, update SPl+RGB or SPl+MDDI description0.04Page 60, update 12C AddressKevinSWDen201007/27Page 181, 182, update 16 bit SPI pause descriptionPage 187-189, update RGB figurePage 200, update TE waveform in RGB mode 2Page 237, MTP sequencePage 238-258, update one dimming control for LABC CABcremove KBBc function descriptionPage 260, update 0X04 Cmd, remove KBBC CmdPage 262, update 0XA 1,0xA8 CmdRemove all the KBBc related function registerPage11,12,190,191,219,284-287,291,304,376,remove 480RGBX 360Page 15, update MTP PWR application voltagePage 16, update CSX, RDX, DC/X, SDI, SDOPage 18, update DSWAPPage 19, correct typo for IM[3: 0]in MDDI+SCL(falling edge)Page 38&44, update typo for data format in table0.05Page 53, update read data 8-8-8-bit only in SPIKevinDenn2010/10/18Page 183, 184, update note for min porch of RGB interfacePage 232, update MTP sequence and MTP PWR voltagePage 235, 236, remove PWM ENH OE bit(keep x2Page 312, 314, update typo for BCTRL and BLPage 371, 372: update figuresPage 373: update figure, add RGB+l2CPage 374: update figures, IM settingPage 375: update figures, IM settingPage 15, update DVDD typicage 129, update typo in figure of AwERPage 194, update typo for Hsync218 add condition of irregulaoffPage 219, 255, update command name typo of 05h commandPage 228-231, update typo in figuresPage 234, update typo for ALS in figure 5. 22.10.1Page 235, update CLED VOL bit in figure 5. 22.2KevinDennis2010/12/24Page 312, 314, update typo for BCTRL bl bitsPage 316, update typo in flow chartPage 346, update description of parameterPage 355, update maximum rating for VGH, GlxPage 358, 359, update 2 lane description in conditionPage 362, update pin name typo in figure-Page 376, update typo for CRGB condition10/28/201110Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformation
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ANSYS_WORKBENCH设计、仿真与优化
《ANSYSWorkbench设计、仿真与优化》以最新版ANSYSWorkbench11.0为依据，以工程人员产品设计的流程为主线，由浅入深地介绍了ANSYSWorkbench在产品设计、仿真与优化过程中的具体功能、使用方法和应用实例。ⅣANSYS Workbench设计、仿真与优化4.2.1基础…………484.2.2分析关键………494.2.3分析步骤……………………………………494.3振动电机轴谐响应分析……………….544.3.1基础………………54………54.3.3分析步骤……………………………………………………………554.4机柜随机振动分析…………………………………………………………614.4.1基础……………………………………………………………614.4.2分析关键…………………………………………………624.4.3分析步骤………………………………………………………62第5章机构运动学分析…………………675.1机构运动学分析基础………………………………………………………675.2轻型打桩机机构运动学分析……………………………………685.2.1工程背景……………………………………………5.2.2分析关键…………………………………………685.2.3分析步骤…………69第6章热力学分析………………………………………756.1热分析基础…………………………………………………………756.2汽缸盖稳态温度场分析……………………………………………766.2.1工程背景766.2.2分析关键………………………………………………………776.2.3分析步骤……………………………………776.3涡轮增压器涡壳瞬态温度场分析和热应力分析………………………………806.3.1工程背景………………………………………………806.3.2分析关键………6.3.3分析步骤…………………………81第7章疲劳分析……………………………………………………867.1疲劳分析基础……………………………………:867.1.1疲劳分析定义……………………………………………867.1.2 AWE Fatigue程序处理疲劳问题的过程………………862按键疲劳分析………………………………………………………877.2.1工程背景………………………………………………………877.2.2分析关键…………………887.2.3分析步骤…………………………………………………887.3轮毂疲劳分析………………………………………………………………92日录7.3.1工程背景………927.3.2分析关键………27.3.3分析步骤……93第8章优化设计……………………………………………………………………968.1优化设计基础……………………………………………968.1.1优化设计的基本原理…968.1.2优化设计的分类………………………………………………………978.1.3AWE优化设计的分析步骤………………988.2支架拓扑结构优化设计………………………………………………………998.2.1工程背景………8.2.2分析关键…………………………………………998.2.3分析步骤…98.3散热器形状优化设计……………………………………………………………1028.3.1工程背景………………………………………………………1028.3.2分析步骤…………………103第9章二次开发1109.1二次开发基础………………………………………………………11109.2参数化程序设计语言……………………………………………………1109.2.1APDL简介…………………………1109.2.2APDL的参数和宏………………………………………………1119.2.3气动刹车装置非线性分析12…………………………119.3用户操作向导……………………1159.3.1 Wizard简介…………………………………………………………1159.3.2操作向导编辑器…………………………………11169.4客户化定制…………1179.4.1SDK简介………………………………………………………………1179.4.2客户化定制实例…………………………………………………118第1章 ANSYS Workbench基础1.1 ANSYS Workbench概述随着计算机辅助工程(CAE)技术在工业应用领域中的广度和深度的不断发展,它在提高产品设计质量、缩短周期、节约成本方面发挥了越来越重要的作用。目前,CAE分析的对象已由单一的零部件分析拓展到系统级的装配体,如飞机、汽车等整机的仿真。同时,其分析的领域已不再仅仅局限于结构力学,已涉及流体力学、热力学、电磁学、多场耦合等更加丰富的物理空间。而且,CAE分析不再仅仅是专职分析人员的工作,设计人员参与CAE分析已经成为必然ANSYS Workbench Environment(AwE)作为新一代多物理场协同CAE仿真环境,其独特的产品构架和众多支撑性产品模块为产品整机、多场耦合分析提供了非常优秀的系统级解决方案。它所包含的3个主要模块:几何建模模块( Design Modeler)、有限元分析模块( Design Simulation)和优化设计模块( Design Xplorer)将设计、仿真、优化集成于一体,可便于设计人员随时进入不同功能模块之间进行双向参数互动调用,使与仿真相关的人、部门、技术及数据在统一环境中协同工作。具体来讲AWE具有的主要特色如下。1.强大的装配体自动分析功能针对航空、汽车、电子产品结构复杂,零部件众多的技术特点,AWE可以识别相邻的零件并自动设置接触关系,从而可节省模型建立的时间。而现行的许多软件均需要手动设置接触关系,这不但费时同时还容易出错。除此之外,AWE还提供了许多工具,以方便手动编辑接触表面或为现有的接触指定接触类型。AWE提供了与CAD软件及设计流程之间的无与伦比的整合性,从而发挥CAE对设计流程最大限度的贡献。最新的AWE使用接口,可与CAD系统中的实体及曲面模型双向连接,具有更高的CAD几何导入成功率。当CAD模型变化时,不需对所施加的负载和支撑重新定义。AWE与CAD系统的双向相关性还意味着,通过AWE的参数管理可方便地控制CAD模型的参数,从而提高设计效率;AWE的这一功能,还可对多个设计方案进行分析,自动修改每一设计方案的几何模型。2.自动化网格划分功能许多CAE用户都花大部分的时间在建立网格上,AwE在大型复杂部件,如飞机组装配件的网格建立上独具特色,自动网格生成技术可大大节省用户的时间。根据分析类型不同,有很多因素影响分析的精度。传统的专业分析人员花大量的时间和训练来掌握各种分析,手动处理模型以保证分析的精度;而对于设计人员来讲,他所关注的应该是自己的产品设计,而不是有限元方法,因此需要一个可靠的工具来替代传统的工具,尽可能实现自动化。AWE的自动化网格划分功能如下:自适应网格划分,对于精度要求高的区域会自动调整网格密度ANSYS Workbench设计、仿真与优化·自动化网格划分,生成形状、特性较好的元素,保证网格的高质量。·自动收敛技术,是自动迭代过程,通过自适应网格划分以使指定的结果达到要求的精度。例如,如果对装配中某一个零件的最大应力感兴趣,可指定该零件的收敛精度。·自动求解器选择,AWE根据所求解问题的类型自动选择适合的求解器求解。智能化的负载和边界条件自动处理。3.协同的多物理场分析环境及行业化定制功能CAE技术涵盖了计算结构力学、计算流体力学、计算电磁学等诸多学科专业,而航空产品的设计对这几个学科专业都有强烈的CAE需求。单个CAE软件通常只能解决某个学科专业的问题,导致使用者需要购买一系列由不同公司开发的、具有不同应用领域的软件,并将其组合起来解决其实际工程问题,这不但增加了软件投资,而且很多问题会由于不同软件间无法有效而准确地传递数据而根本不能实现真正的耦合仿真计算。目前,全面的、真正的“多物理场耦合分析”(如图1.1所示)时代已经来临,多场分析能力已经成为现代CAE软件技术水平的重要标志。多组分/多相流}(流体力学)[可压缩流H高级辐射高级疲劳高度非线性共轭传热结构力学多物理场耦合(温度场非线性非线性/辐射时/频域动力稳态/瞬态线性静力低频电磁场}(电磁场)M高导/对流图1.1现代高级CAE软件AWE组合分析能力4.快捷的优化工具 DesignXplorerAWE本身既是一个成熟的多物理场协同CAE仿真平台,又是一个基于最新软件技术的开放式开发平台,利用其开发包 Workbench SDK可以非常便捷地实现诸如专用程序开发、流程自动化和简化、专家经验的保存和固化、分析规范的保存和固化、自有程序的包装、其他程序的集成等众多的用户化开发功能。在 Workbench基础上,设计与分析间的关系就简化为:·分析部门(或人员)根据需求为设计部门量身定做各种特定产品的专用分析程序,这些程序融专家经验、自有程序、分析规范等为一体,完全专用化和自动化,一次定制,终身受益;设计部门(或人员)在针对性极强的专用程序上轻松实现设计分析-优化评价等工作;AWE多物理场协同仿真环境充分体现了 ANSYS公司“面向实实在在的工业需求,以技术为本,以优化用户产品研发流程为目标,为用户提供完整CAE解决方案”的宗旨。在AWE环境下,整个CAE应用的方式和意义都将发生革命性的变化。仿真分析的目的是优化产品性能,AWE/ DesignXplorer是基于DSDB数据库文件的参数优化工具,结合CAD系统/AGP和 Design Space/AWE进行优化:在CAD系统/AGP中第1章 ANSYS Workbench基础3·进行参数化建模,在 Design Space或AWE中进行初步的分析,并确定感兴趣的参数,在DesignXplorer中进行参数优化优化参数可以是CAD模型的几何参数、结构形式、施加的边界条件、求解得到的分析结果等,也可以是由这些参数进行数学运算后派生出来的参数,既可以进行连续性参数和离散化参数的优化,又可以进行单目标或多目标的优化,得到设计空间的三维设计响应面/二维设计曲线,并自动根据优化结果更新几何模型文件。因此,作为新一代多物理场协同CAE仿真环境,AWE以其独特的产品架构和众多支撑性产品模块已为越来越多的产品提供了非常优秀的系统级解决方案1.2 ANSYS Workbench产品设计流程和文件格式1.2.1 ANSYS Workbench产品设计流程AwE提供一个集成统一的仿真环境帮助工程人员完成产品CAE开发的全过程。在AWE环境下,典型的项目开发,包括以下模块:DesignModeler,几何建模和CAD模型导入模块;Design Simulation,结构、热和电磁有限元分析模块;Design Xplorer,最优化设计模块。AwE统一的开发环境以及具有攀升化的设计方案,帮助企业真正实现产品设计仿真到优化的协同。其中, Design Simulation与CAD系统之间可进行双向模型参数互动、可将 ANSYS嵌入CAD运行环境,使用CAD环境中的几何模型的链接,不存在模型转换失真的棘手问题。同时, Design Simulation从CAD中导入装配体时可以自动建立装配接触关系。这样,设计人员可以在 Design Simulation中进行零件以及装配体性能的初步快速分析,并确定感兴趣的区域和性能,再利用 Design Simulation中高端CAE仿真工具和疲劳分析模块一 Fatigue Module对产品强度、动力学特性以及疲劳寿命进行深入的认知,确定优化设计参数,最后在多目标优化模块一 Design Xplorer中同步优化参数,改进产品设计。软件系统的主框架如图1.2所示。ANSYS WorkbenchDesignModelerE Design Simulation Design Xplorer图1.2AWE系统框架图除了上述的主要流程模块之外,AWE还包括以下辅助模块:Engineering Data,用于设定材料和载荷加载信息;FE Modeler,用于输入来自 NASTRAN, ABAQUS,或 Design Simulation所建立的网格模型,作为 ANSYS有限元分析的输人,它也能将网格模型反演生成几何模型;ANSYS AUTODYN,爆炸、冲击等结构显式动力学分析模块。ANSYS Workbench设计、仿真与优化1.2.2文件格式AWE中涉及的主要文件的类型及格式如表1.1所示表1.1AWE中文件格式说明文件名类型说明obname, wbdbWorkbench项目数据库文件,用于管理项目中的不同类型模块文件bname agdbDesign Modeler数据库文件,用于存储几何模型信息jobname cmdbCFX- Mesh数据库文件,用于存储流体网格信息jobname dsdbDesign Simulation数据库文件,存储结构、热和电磁仿真中的所有模型信息obname, edbEngineering Data数据库文件jobname fedbFE Modeler数据库文件,用于存储从 NASTRAN或 DesignSimulation输入的网格信息jobname adANSYS AUTODYN数据库文件,用于存储显式分析软件 AUTODYN必需的信息jobname ddbDesignXplorer数据库文件,用于存储优化方程中设计参数和目标参数的关联信息13安装和起动配置1.3.1 ANSYS Workbench11.0安装安装 ANSYS Workbench1.0前需要将 Windows2000打SP2补丁( Windows XP打SP1补丁),并安装IE6.0以上。另外,系统的日期和时间,要是当前的日期和时间。具体的安装步骤如下。(1)放入安装光盘,在弹出的“ ANSYS DVD Launcher”窗口中,选择“Next”,进入下一级安装窗口,如图1.3所示。ANSYS Products 11.0for Windows 32-bitOperating SystemsANSYS图1.3 ANSYS DVD Launcher窗口1第1章 ANSYS Workbench基础(2)在弹出窗口(如图1.4)中,选择安装的产品“ ANSYS Products”,并在接下来的安装语言窗口,选择“ English”,进入下一级安装界面。ANSYS ProductsInstall ProductsANSYS AA图1.4 ANSYS DVD Launcher窗口2(3)在图1.5所示的弹出窗口中,选择“ L AGREE”后,单击“Next”,进人到下一级安装界面ANSYS需oLGRIEsiDoN et图1.5 InstallShield wizard窗口1(4)根据您的需求选择安装的路径(如图1.6),单击“Next”后进入到“ Select Installation Components"。(5)在图1.7所示的窗口中选择完毕后一直单击“Ncxt”,安装程序开始安装ANsYs11.0。(6)在图1.8所示的窗口中单击“ Finish”,完成软件安装。(7)回到步骤(2)中的“ ANSYS DVD Launcher”窗口,单击“ License Management”,出现下一提示画面(如图1.9),问是否是 license server machine,选择“是(Y)(8)出现下一提示画面(如图1.10),问是否有 license文件,选择“否(N)(9)出现下一提示画面(如图1.11),问是否继续安装,选择“是(Y)ANSYS Workbench设计、仿真与优化图1.6 Installshield wizard窗口2ANSYSwr图1.7 InstallShield Wizard窗口3ANSYS图1.8 InstallShield Wizard窗口4
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