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贝叶斯网络学习、推理与应用

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专门讲贝叶斯网络学习的书籍,很经典,需要学习的可以下载图书在版编目(CIP)数据贝叶斯网络学习推理与应用王双成著.一上海:立信会计出版社,20102lsBN978-754292470-4I.①贝…Ⅱ.①王….①贝叶斯推断Ⅳ①0212中国版本图书馆CP数据核字(2010)第07142号责任编辑赵志梅封面设计周祟文贝叶斯网络学习、推理与应用出版发行立信会计出版社地址上海市中山西路2230号邮政编码20035电话(021)64411389传真(021)644125网址www.lirinaph.comE-mail kaph@ sh163 net网上书店www.shl-.netTel:(021)6411071经销各地新华书店印刷上海申松立信印刷有限责任公司开本890毫米X1240毫米/32印张9375字数254千字版次2010年2月第1版印次2010年2月第1次书号IsBN978-7-54292470-4/0定价20.00元如有印订差错,请与本社联系调换内容简介贝叶斯网络是概率理论与图形理论的结合,围绕的一个基本问题是联合概率计算。基于贝叶斯网络可进行联合概率的条件和边缘分解从而有效降低运算复杂性并解决与联合概率计算有关的一系列向题。贝叶斯网络已在许多领域得到了广泛的应用,是不确定性知识表示和推理的有力工具。本书按照贝叶斯网络基础、学习、推理、集成和应用的框架介绍贝叶斯网络的相关理论、方法和算法,有助于读者对贝叶斯网络理论体系的认识和理解,可供相关专业的高年级本科生、研究生和科研人员学习与参考贝叶斯网络( Bayesian networks)是描述随机变量之间依赖关系的图形模式,被广泛用于不确定性问题的智能化求解。它具有多功能性、有效性和开放性(是一个能够集成其它智能技术与数据处理方法的平台)等特征,能够有效地转化数据为知识(具有形象直观的知识表示形式),并利用这些知识进行推理(具有类似于人类思维的推理方式),以解决分析、预测和控制等方面的问题。其有效性已在风险管理、信息融合、医疗诊断、系统控制和生物信息分析等许多领域得到验证。自从20世纪80年代后期加利福尼亚大学计算机科学系 Pearl(1988)给出贝叶斯网络的严格定义并创建贝叶斯网络基础理论体系以来,贝叶斯网络获得了长足的发展。这些研究主要从贝叶斯网络学习推理、集成和应用四个方面展开,出现了许多经典的方法和算法,也解决了大量的实际问题。本书共分五个部分。第一部分是贝叶斯网络基础,包插第1、第2、第3章。第1章介绍在贝叶斯网络研究中经常使用的一些概率公式和方法。第2章从概率模式、图形模式和它们之间联系的视角简要阐述贝叶斯网络的基础理论。第3章绐出贝叶斯网络学习和推理中可能用到的一些量化方法和标准第二部分是贝叶斯网络学习,包括第4章至第10章。这儿章分别从具有完整数据、丢失数据、隐藏变量、连续变量、噪声和小数据集等情况给出了一系列贝叶斯网络学习方法,以及随环境变化的贝叶斯网络更新算法。第三部分是贝叶斯网络推理,包括第11、第12章。第11章从贝叶斯网络信念更新和信念修正两个方面简要介绍经典的准确和近似推贝叶斯劂络学习、推瑰与应用理方法。第12章给出一系列贝叶斯网络分类器(分类预测推理)。第四部分是贝叶斯网络集成,包括第13章至第16章。这几章介绍将贝叶斯网络与因果理论、决策理论、可能理论和时序过程相结合而得到的因果贝叶斯网络、决策贝叶斯网络(影响图)、可能贝叶斯网络(可能网)和动态贝叶斯网络。第五部分是贝叶斯网络应用,包括第17、笫18章。第17章介绍基于贝叶斯网络的聚类分析方法。第18章给出贝叶斯网络在预警和评估等方面的应用。本书是作者在多年从事贝叶斯网络研究基础上整理而成的,其撰写和出版得到国家自然科学基金(60675036)、上海市教委重点学科基金(51702)和上海市教委科研创新重点项目(09z202)的资助。王双成2009年11月于上海立信会计学院录第一部分贝叶斯网络基础第1章概率论基础1.1概率计算公式1.2贝叶斯方法33561.3贝叶斯概率音要鲁要是音音吾辛音晋晋费音省普辛音萨自即鲁音普鲁香备善鲁曹普辛鲁曹曹鲁鲁第2章贝叶斯网络基础理论…2.1概率模式中的条件独立性2.2图形模式中的d- separation性102.3条件独立性与d- separation性之间的联系…2.4贝叶斯网络基本定理……122.5贝叶斯网络模型…………………………122.6变量之间基本依赖关系和结点之间基本结构……………14第3章常用的检验方法和评价标准153.1变量之间依赖关系检验…153.2贝叶斯网络结构常用打分标准…183.3分类准确性评价标准…………243.4贝叶斯网络学习可靠性评价标准…28第二部分贝叶斯网络学习第4章具有完整数据的贝叶斯网络学习314.1基于打分搜索的贝叶斯网络结构学习……………………312贝叶斯网络学习、推理与应用4.2基于依赖分析的贝叶斯网络结构学习36第5章具有丢失数据的贝叶斯网络学习…………455.1基于近似打分搜索的结构学习………455.2基于 Gibbs sampling和依赖分析的贝叶斯网络结构学习…音非垂48第6章具有隐藏变量的贝叶斯网络学习是·音音曹面喜鼻口要音·面鲁要普鲁看豪556.1不考虑隐藏变量的贝叶斯网络结构和道德图学习………556.2发现隐藏变量6.3确定隐藏变量取值和维数…………………………………586.4确定局部结构……606.5实验与分析………………………………………60第7章具有连续变量的贝叶斯网络学习D看口637.1不离散化连续变量的贝叶斯网络学习……637.2离散化连续变量的贝叶斯网络学习…66第8章具有噪声的贝叶斯网络学习…………788.1噪声平滑方法……798.2噪声平滑过程………………………808.3实验与分析82第9章小数据集贝叶斯网络学习…………………879.1小数据集贝叶斯网络结构学习……889.2小数据集贝叶斯网络多父结点参数的修复……96第10章贝叶斯网络更新学习看看dt10.1贝叶斯网络增量学习…●鲁···。靳鲁鲁毒●毒。鲁鲁■。音啬·最番着着鲁音音·自啬10310.2贝叶斯网络适应性学习………1410第三部分贝叶斯网络推理第11章贝叶斯网络基本推理11711.1统计推断……………………11711.2贝叶斯网络中的信念更新………………………11911.3贝叶斯网络中的信念修正………132第12章贝叶斯网络分类推理p由要中。;中叠鲁量。自·申中··画电·13612.1贝叶斯分类器…13712.2朴素贝叶斯分类器…14012.3广义朴素贝叶斯分类器……s14412.4TAN分类器………14612.5贝叶斯网络分类器…15312.6基于类约束的贝叶斯网络分类器………15612.7基于贝叶斯网络的特征子集选择要鲁费鲁量要鲁卧电香曹15812.8分类器的训练与泛化………………………………17212.9基于贝叶斯网络的联合预测………………………174第四部分贝叶斯网络集成第13章因果贝叶斯网络;音p即曹看最看晋看看看面画哥垂晶最音是看语音西卣垂17713.1单连通因果网学习s…………17813.2基于依赖分析的因果贝叶斯网络结构学习番备普最看啬■曹音音番春17813.3基于结点排序和局部打分-搜索的因果贝叶斯网络结构学习18513.4因果贝叶斯网络参数学习……18813.5基于贝叶斯网络的因果知识表示………………18913.6因果量化分析189第14章决策贝叶斯网络l914贝叶斯网络学习、箍理与应用14.1影响图的构成19114.2影响图的基本变换和最优决策…画·垂画画……19214.3影响图举例…………………………193第15章可能贝叶斯网络…19815.1可能网的概念鲁非鲁中·中鲁鲁·普西·鲁善鲁鲁善善申善鲁曹鲁鲁善善@·售鲁善鲁鲁登要19815.2可能网结构学习……202第16章动态贝叶斯网络……………………………20416.1一般动态贝叶斯网络20416.2具有平稳性和马尔可夫性假设约束的动态贝叶斯网络…20516.3几种特殊的动态贝叶斯网络………………………………21016.4动态贝叶斯网络分类器…………………………211第五部分贝叶斯网络应用第17章贝叶斯网络用于聚类分析………………21717.1离散数据聚类………………21717.2自动混合数据聚类— AutoClass…22217.3基于 Gibbs sampling的混合数据聚类225第18章贝叶斯网络用于预测23518.1经济周期波动转折点预测…23518.2风险预警23618.3风险评估…244附录常用贝叶斯网络…………………………………………250参考文献270

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  • microTCA规范
    PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft 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