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于 2014-12-14 发布 文件大小:874KB
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  DSPtms6417+ARM9的一个亮灯小程序，主要有参考意义，可以在omapl138上面跑，在ccs上面打开。需要加载syslink(DSPtms6417+ ARM9 of lighting a small program, the main reference value, can be run in omapl138 above, the top can be opened in ccs. Need to load syslink)

文件列表：

hello
.....\.ccsproject,532,2014-10-10
.....\.cproject,23519,2014-12-10
.....\.project,2647,2014-10-10
.....\.xdchelp,0,2014-10-10
.....\Debug
.....\.....\ccsObjs.opt,78,2014-12-10
.....\.....\configPkg
.....\.....\.........\.interfaces,0,2014-12-10
.....\.....\.........\.libraries,e674,0,2014-12-10
.....\.....\.........\compiler.defs,444,2014-10-10
.....\.....\.........\compiler.opt,449,2014-12-10
.....\.....\.........\config.bld,416,2014-12-10
.....\.....\.........\custom.mak,290,2014-12-10
.....\.....\.........\package
.....\.....\.........\.......\.vers_b150,0,2014-12-10
.....\.....\.........\.......\.vers_g180,0,2014-12-10
.....\.....\.........\.......\.vers_r170,0,2014-12-10
.....\.....\.........\.......\.xdc-y25,0,2014-12-10
.....\.....\.........\.......\.xdc-z52,0,2014-10-10
.....\.....\.........\.......\build.cfg,167,2014-10-10
.....\.....\.........\.......\cfg
.....\.....\.........\.......\...\Dsp.xe674.mak,311,2014-10-10
.....\.....\.........\.......\...\Dsp_pe674.cfg,11214,2014-12-10
.....\.....\.........\.......\...\Dsp_pe674.cfg.dot,39927,2014-10-10
.....\.....\.........\.......\...\Dsp_pe674.cfg.xml,955514,2014-10-10
.....\.....\.........\.......\...\Dsp_pe674.dep,38959,2014-10-10
.....\.....\.........\.......\...\Dsp_pe674.mak,2977,2014-12-10
.....\.....\.........\.......\...\Dsp_pe674.oe674,4236204,2014-10-10
.....\.....\.........\.......\...\Dsp_pe674.oe674.dep,24529,2014-10-10
.....\.....\.........\.......\...\Dsp_pe674.rov.xs,1421560,2014-10-10
.....\.....\.........\.......\...\Dsp_pe674.rta.xml,19439,2014-10-10
.....\.....\.........\.......\...\Dsp_pe674.xdc.inc,37,2014-10-10
.....\.....\.........\.......\...\Dsp_pe674.xdl,5532,2014-10-10
.....\.....\.........\.......\configPkg.ccs,1218,2014-12-10
.....\.....\.........\.......\configPkg.class,6522,2014-12-10
.....\.....\.........\.......\configPkg.java,5409,2014-12-10
.....\.....\.........\.......\configPkg.pjt,217,2014-10-10
.....\.....\.........\.......\configPkg.sch,0,2014-10-10
.....\.....\.........\.......\external
.....\.....\.........\.......\internal
.....\.....\.........\.......\lib
.....\.....\.........\.......\package.bld.xml,2863,2014-12-10
.....\.....\.........\.......\package.defs.h,203,2014-12-10
.....\.....\.........\.......\package.xdc.dep,2524,2014-12-10
.....\.....\.........\.......\package.xdc.inc,251,2014-12-10
.....\.....\.........\.......\package_configPkg.c,430,2014-12-10
.....\.....\.........\.......\rel
.....\.....\.........\.......\...\configPkg.xdc.inc,114,2014-12-10
.....\.....\.........\.......\...\configPkg.xdc.ninc,0,2014-10-10
.....\.....\.........\package.bld,2514,2014-12-10
.....\.....\.........\package.mak,10143,2014-12-10
.....\.....\.........\package.xdc,88,2014-10-10
.....\.....\.........\package.xs,679,2014-12-10
.....\.....\dsp
.....\.....\...\ccsSrcs.opt,55,2014-12-10
.....\.....\...\main_dsp.pp,13009,2014-12-10
.....\.....\...\Server.pp,13661,2014-12-10
.....\.....\...\subdir_rules.mk,1979,2014-12-10
.....\.....\...\subdir_vars.mk,1137,2014-12-10
.....\.....\hello.map,241018,2014-10-10
.....\.....\makefile,3351,2014-12-10
.....\.....\objects.mk,268,2014-12-10
.....\.....\sources.mk,2066,2014-12-10
.....\dsp
.....\...\Dsp.cfg,6863,2014-10-10
.....\...\main_dsp.c,4999,2014-02-23
.....\...\Server.c,10863,2014-10-10
.....\...\Server.h,1983,2014-02-23
.....\OMAPL138.ccxml,1543,2014-10-10
.....\shared
.....\......\AppCommon.h,2586,2014-10-10
.....\......\config.bld,3044,2014-10-10
.....\......\SystemCfg.h,1968,2014-10-10

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OTHER BUS OPERATIONS……·。垂,音着垂。着音D。。着。D音着音垂。音着D音非非音垂音非·非1103.6.1. Device selection…....…,103.6.2. Special cycle...........3.6.3. IDSEL Stepping…………,,…,…,,…,,…,,,,,………,…1133.6.4. Interrupt acknowledg3.7. ERROR FUNCTIONS春音·。音垂1153.7.. Parity ger1153.7.2. Parity Checking...........………,163.7.3. Address parity errors…...…,…163.7.4.Error Reporting…17173.7.5. Delayed Transactions and Data Parity Errors.......... 203.7.6. Error Recovery.............,213. 8. 64-BIT BUS EXTENSION1233.8.1. Determining bus Width during System initialization.…….…,1263.9.64- BIT ADDRESSING…..…………………………………………1273.10SPECIAL DESIGN CONSIDERATIONS.1304. ELECTRICAL SPECIFICATION.. m.m.9.1374.1. OVERVIEW…1374.1.1. Transition Road Map……1374.1.2. Dynamic vs Static Drive specificalion…1384.2. COMPONENT SPECIFICATION.……,………………,1…………………1394.2.1. 5V Signaling environment1404.2.2. 33V Signaling environment鲁鲁·垂垂1464.2.3. Timing specification1504.2.4.1determinate Inputs and metastable作,…………1554.2.5. Vendor provided specification..,..…,.…………….………17564.2.6. Pinout recommendation157PCI LOCAL BUS SPECIFICATION. REV.3.04.3. SYSTEM BOARD SPECIFICATION.………1584.3.1. Clock skew,…………………1584.3.2.R··1584.3.3. Pull-ups:····.················:·····…1614.3.4Power1634.3.5. System Timing Budget. ...........1644.3.6. Physical requirements............………674.3.7. Connector Pin assignments……/6844. ADD-IN CARD SPECIFICATION1714.4.1.Add- in Card Pin Assignment..,.,.,………………,1714.4.2. Power Requirements….,.,.,.,.,.,.,,.….,764.4.3. Physical requirements.........1785. MECHANICAL SPECIFICATION1815.1. OVERVIEW1812. ADD-IN CARD PHYSICAL DIMENSIONS AND TOLERANCES...........1825.3. CONNECTOR PHYSICAL DESCRIPTION…………………1954. CONNECTOR PHYSICAL REQUIREMENTS. ...............................2055. CONNECTOR PERFORMANCE SPECIFICATION……………,…2066. SYSTEM BOARD IMPLEMENTATION……………2076. CONFIGURATION SPACEb●看●鲁D鲁0e●2136. 1. CONFIGURATION SPACE ORGANIZATION音垂垂D·垂看垂…2136.2. CONFIGURATION SPACE FUNCTIONS .......................2166.2.1. Device ldentification鲁垂垂2166.2.2. Device Control鲁着鲁D垂2176.2.3. Device status2196. 2.4. Miscellaneous registers·······:········:···:·:··:·:······:··············4······:····2216.2.5. Base addresses……………………….22463. PCI EXPANSION ROMS2286.4. VITAL PRODUCT DATA.2296.5. DEVICE DRIVERS2296.6. SYSTEM RESET.…………………………2306.7. CAPABILITIES LIST2308. MESSAGE SIGNALED INTERRUPTS ...................................................................2316.8.1. MSI Capability Structure..............2326.8.2. MSl-X Capability and Table structures……………….……..2386.8.3. MSI and Msi-X Operation2467. 66 MHZ PCI SPECIFICATION2557. 1. INTRODUCTION2557.2. SCOPE7. 3. DEVICE IMPI TION CONSIDERATIONS7.3.1. Configuration space.......2557. 4. AGENT ARCHITECTURE256PCI LOCAL BUS SPECIFICATION, REV.3.07.5. PROTOCOL.……2567.5.1.66 MHZ ENABLE(M66EN) Pin definition.…………,………,,2567.52Latency..-..-.-2577.6. ELECTRICAL SPECIFICATION……………2577.6.. Overview·.·······.··2577.6.2. Transition roadmap to 66 MHz PCI··········.2577.6.3. Signaling Environment.......... 2587.6.4. Timing specification.……2597.6.5. Vendor provided specification. 26.57.6.6. Recommendations·.·························:············:······:········.:··········2657.7. SYSTEM BOARD SPECIFICATION.………,…,……………2667.7.1. Clock Uncertainty ......2667.7.2. Reset2677.7.3. Pullups..2677.7.4. Power..······.·.·::·····布鲁····音D鲁番。是。音垂看····非D∴2677.7.5. System Timing Budget7.7.6. Physical requirements2687.7.7. Connector Pin assi! nments…..,.,.,..,.,.,..,.,.,2697.8. ADD-IN CARD SPECIFICATIONS春音·。音垂2698. SYSTEM SUPPORT FOR SMBUSn2718. 1. SMBUS SYSTEM REQUIREMENTS2718.1.1. Power………278. 2. Physical and Logical sMBi27l8.1.3. Bus connectivit2728.1.4. Master and slave support....….….…..…..…..,2738.1.5. Addressing and Configuration2738.1.6.Ele2748.1.7. SMBus behavior on Pcl reset.........................2748.2.ADD- IN CARD SMBUS REQUIREMENTS…………2758.2.7Connection2758.2.2. Master and Slave Support...,.…..…….…,...….,2758.2.3. Addressing and Configuration……,…,…,……,…,…,…,….….…..….,2758. 2. 4. Power2758. 2.5. Electrical.········.····························275A. SPECIAL CYCLE MESSAGES●鲁●e鲁277A 1. MESSAGE ENCODINGS277A,2. USE OF SPECIFIC ENCODINGS ................................................277B. STATE MACHINES279B. 1. TARGET LOCK MACHINE·;.···.:..···:...···:··.·:····281B.2. MASTER SEQUENCER MACHINE283B 3. MASTER6PCI LOCAL BUS SPECIFICATION. REV.3.0C. OPERATING RULES289C 1. WHEN SIGNALS ARE STABLE..·····.:·.·.::···:·;289C.2. MASTER SIGNALS…音·。·看290C.3. TARGET SIGNALS…291C.4. DATA PHASES…292C.5. ARBITRATION.……………………………………292C.6. LATeNCY······:“·······293C.7. DEVICE SELECTION……………,……………………………293C 8. PARITY垂垂垂D·垂294D. CLASS CODESD 1. BASE CLASS OOH...w.w...296D 2. BASE CLASS OlH296D. 3. BASE CLASS O2H··297D 4. BASE CLASS O3H297D.5. BASE CLASS04H.………………………298D. 6. BASE CLASS OSH298D.7. BASE CLASS06H...………….…………………299D 8. BASE CLASS OZH,300D 9. BASE CLASS OSH.301D.10. BASE CLASS C9H.……………………………………………….301D.11. BASE CLASS OAH.…………………302D 12. BASE CLASS OBH302D. 13. BASE CLASS OCH303D.14. BASE CLASS ODH….…304D. 15. BASE CLASS OEH304D. 16. BASE CLASS OFH·····.····;····:·;:·······304D.17. BASE CLASS JOH.……………………………………………1305D, 18. BASE CLASS 11H305E. SYSTEM TRANSACTION ORDERINGE.I. PRODUCER- CONSUMER ORDERING MODEL308E. 2. SUMMARY OF PCI ORDERING REQUIREMENTS310E.3. ORDERING OF REQUESTS........................................311E.4. ORDERING OF DELAYED TRANSACTIONS…………312E.5. DELAYED TRANSACTIONS AND LOCK#.317E.6. ERROR CONDⅠ TIONS……318. EXCLUSIVE ACCESSES..m.msn0..319F.1. EXCLUSIVE ACCESSES ON PCIF 2. STARTING AN EXCLUSIVE ACCESS321F.3. CONTINUING AN EXCLUSIVE ACCESS323F 4. ACCESSING A LOCKED AGENT324F 5. COMPLETING AN EXCLUSIVE ACCESS325F. 6. COMPLETE BUS LOCK ......................................................................325IO SPACE ADDRESS DECODING FOR LEGACY DEVICES..9.... 327PCI LOCAL BUS SPECIFICATION, REV.3.0CAPABILITY IDS。,0329I. VITAL PRODUCT DATA331VPD FORMAT3I.2COMPATIBILITY……………………………334L.3. VPD DEFINITIONS3341.3.1. VPD Large and small resource Data Tags......·D垂看3341.3.2. VPD Example…3378PCI LOCAL BUS SPECIFICATION. REV.3.0FiquresFIGURE -I: PCI LOCAL BUS APPLICATIONS春DFIGURE 1-2: PCI SYSTEM BLOCK DIAGRAM17FIGURE2-1: PCI PIN LIST.…………..…………21figure 3-1: ADDRESS PHASE FORMATS OF CONFIGURATION TRANSACTIONS...... 48Figure 3-2: LAYOUT OF CONFIG ADDRESS REGISTER, ..............................................50Figure 3-3: HOST BRIDGE TRANSLATION FOR TYPE O CONFIGURATION TRANSACTIONSADDRESS PHASE51FIGURE3-4: CONFIGURATION READ…………156FIGURE3-5: BASIC READ OPERATION………………………65FIGURE 3-6: BASIC WRITE OPERATION66FIGure 3-7: MASTER INITIATED TERMINATION........................ 68FIGURE3-8: MASTER- ABORT TERMINATION…………69Figure 3-9: RETRY. ..........................................................................................................73FiGure 3-10: DISCONNECT WITH DATA. ........................74FiGure 3-11: MASTER COMPLETION TERMINATION:·:····:··.·4····.···…75FiGURE 3-12: DISCONNECT-1 WITHOUT DATA TERMINATION·····76Figure 3-13: DISCONNECT-2 WITHOUT DATA TERMINATION76FiGure 3-14: TARGET-ABORT…177figure 3-15: BASIC ARBITRATIONFIGuRE 3-16: ARBITRATION FOR BACK-TO-BACK ACCESS…94FiGurE 3-17: DEVSEL# AsSERTION·····:···.·:··110Figure 3-1 8: IDSEL STEPPING114FiGure 3-19: INTERRUPT ACKNOWLEDGE CYCLE. ...................................................114FIGURE3-20: PARITY OPERATION………116FIGuRE 3-21: 64-BIT READ REQUEST WITH 64-BIT TRANSFER125FIGURE 3-22: 64-BIT WRITE REQUEST WITH 32-BIT TRANSFER..........126FIGURE 3-23 64-BIT DUAL ADDRESS READ CYCLE129FIGURE 4-1: ADD-IN CARD CONNECTORS...........................138FIGURE4-2:V/ICURⅤ ES FOR5 V SIGNALING.…………………143FIGURE 4-3: MAXIMUM AC WAVEFORMS FOR 5V SiGnaling145FIGURE 4-4: V/I CURVES FOR 3.3V SIGNALING148FIGURE4-5:MAⅹ IMUM AC WAⅤ EFORMS FOR3.3ⅴ SIGNALING………150FIGURE 4-6: CLOCK WAVEFORMS151FIGURE 4-7: OUTPUT TIMING MEASUREMENT CONDITIONS.··4·:······.·154FIGURE4-8: INPUT TIMING MEASUREMENT CONDITIONS…………154FIGURE 4-9: SUGGESTED PINOUT FOR POFP PCI COMPONENT···“···:.···.····:·········157FIGURE4-10: CLOCK SKEW DIAGRAM………158FIGURE 4-1: RESET TIMING16lFIGURE4-12: MEASUREMENT OF TPROP,3.3 VOLT SIGNALING……………166FIGURE 5-1: PCI RAW ADD-IN CARD(3.3V, 32-BIT).183FIGURE 5-2: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 32-BIT)..........184FIGURE 5-3: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 64-BIT)....185FIGURE 5-4: PCI RAW LOW PROFILE ADD-IN CARD(3.3V, 32-BIT)..........186PCI LOCAL BUS SPECIFICATION, REV.3.0FIGURE5-5: PCI ADD-Ⅰ N CARD EDGE CONNECTOR BEⅤEL……187FIGURE56: PCI ADD-IN CARD ASSEMBLY(3.3V)……………………………88FIGURE 5-7: LOW PROFILE PCI ADD-IN CARD ASSEMBLY 3.3V)189FIGURE 5-8: PCI STANDARD BRACKET………190FIGuRE 5-9: PCI LOW PROFILE BRACKET191FIGURE 5-10: PCI STANDARD RETAINER···192FIGURE5-11: IO WINDOW HEIGHT∴………………193FIGURE 5-12: ADD-IN CARD INSTALLATION WITH LARGE IO CONNECTOR.......194FIGURE 5-13: 32-BIT CONNECTOR196FIGURE 5-14: 3.3V/32-BIT CONNECTOR LAYOUT RECOMMENDATION. ........................197FIGURE5-15:3.3V/64-BIT CONNECTOR198FIGURE 5-16: 3.3V/64-BIT CONNECTOR LAYOUT RECOMMENDATION 199FIGURE 5-17: 3.3V/32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES2(垂D·。垂,音着垂。着音D。。着。D音着音垂。音着音FIGURE 5-18: 3.3V/64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES….201FIGURE5-19: UNIVERSAL 32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES………………………………202FIGURE 5-20: UNIVERSAL 64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES203FIGURE5-21:PCⅠADD- IN CARD EDGE CONNECTOR CONTACTS……204FIGURE5-22: CONNECTOR CONTACT DETAIL………………205FIGURE 5-23: PCI CONNECTOR LOCATION ON SYSTEM BOARD208FIGURE5-24:32- BIT PCI RISER CONNECTOR……209FIGURE 5-25: 32-BIT/3.3V PCI RISER CONNECTOR FOOTPRINT210FIGURE 5-26: 64-BIT/3.3V PCI RISER CONNECTOR211FIGuRE5-27:64-BI/3.3ⅴ PCI RISER CONNECTOR FOOTPRINT∴………212FIGURE 6-1: TYPE OOH CONFIGURATION SPACE HEADER215FIGURE 6-2: COMMAND REGISTER LAYOUT217FIGURE6-3: STATUS REGISTER LAYOUT……………………………219FIGURE 6-4: BIST REGISTER LAYOUT222FIGURE 6-5: BASE ADDRESS REGISTER FOR MEMORY........... 225FIGURE 6-6: BASE ADDRESS REGISTER FOR L/O225鲁着D音看FIGURE 6-7: EXPANSION ROM BASE ADDRESS REGISTER LAYOUT.....,..... 228FIGURE6-8: EXAMPLE CAPABILITIES LIST…….231FIGURE6-9: MSI CAPABILITY STRUCTURES…..……233FIGURE 6-10: MSI-X CAPABILITY STRUCTURE238FIGurE 6-11: MSI-X TABLE STRUCTURE翻音。音239FIGurE 6-12: MSI-X PBA STRUCTURE…239FIGURE 7-1: 33 MHZ PCI VS 66 MHZ PCI TIMING······:··················257FIGURE7-2:3.3 V CLOCK WAVEFORM.…………259FIGURE 7-3: OUTPUT TIMING MEASUREMENT CONDITIONS263FIGURE -4: INPUT TIMING MEASUREMENT CONDITIONS263FIGURE75:TvAL(MAX) RISING EDGE…………264FIGURE 7-6: TVAL(MAX) FALLING EDGE·265FIGURE77:TVAL(MIN) AND SLEW RATE……26510
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