高频电路设计与制作 市川裕一.pdf
高频电路设计与制作 市川裕一.pdf 高频电路设计与制作 市川裕一.pdf图字:01-2005-1166号内容简介本书是“图解实用电子技术丛书”之一。全书共分9章。本书首先对高频的基本知识加以介绍,然后在后续的篇章里,对开关、低噪声放大器、混频器、滤波器、检波电路、振荡电路、PLL的设计与制作等进行详细论述。本书全面地阐述了有关高频电路设计的基础理论及其实际制作,且配有大量的印制电路板图、仿真电路等,图文并茂,大大地提高了本书的参考阅读价值本书适合电子通信及其相关领域的工程技术人员参考阅读,也可作为大专院校电子、通信专业学生的课外阅读资料。图书在版编目(CIP)数据高频电路设计与制作/(日)市川裕一,青木胜著;卓圣鹏译;何希才校北京:科学出版社,2006(图解实用电子技术丛书)ISBN7-03-017369-4I.高…Ⅱ.①市…②青…③卓…④何…Ⅲ.高频电路-设计Ⅳ.TN710.2中国版本图书馆CIP数据核字(2006)第058116号责任编辑:赵方青崔炳哲/责任制作:魏谨责任印制:刘士平/封面制作:李力北京东方科龙囹文有限公司制作http://www.okbook.com.cn学寓版出版比京东黄城根北街16号邮政码:100717http://www縹海印剁有限责任公司印刷科学出版社发行各地新华书店经销2006年8月第版开本:B5(720×1000)2007年2月第二次印刷印张:印数:4001-7000字数:271000定价:39.00元(如有印装质量问题,我社负责调换(新欣》)译者序对电路设计而言,高频电路是由具有丰富经验的技术人员进行设计的。所以,高频电路的设计工作重任往往肩负在前辈工程师的身上。因为高频电路涉及的参数很多,设计时受周边电路的影响很大,不仅要考虑电路本身的设计,也要顾及所使用印制基板的材质、厚度和印制布线等。只要设计不当,就会产生寄生电容形成谐振电路,造成信号被衰减或产生噪声,导致无法满足设计要求。因此,高频电路设计人员需要有经验,所谓经验,就是设计时能事先避免一些不合常理的设计以及解决电路设计时所遇到的问题般初学者可能不具备这些能力。但是,随着科技的进步,高频电路设计的门槛逐渐降低,高频电路/微波电路用的仿真软件也得到了快速的发展。不了解高频电路的人,只要使用髙性能仿真软件,就能得到所需要的性能。因此,设计人员只要依照仿真电路,稍具备一些基本设计概念,就能够设计出高频电路。一般说来,虽能靠仿真软件来设计出所期望的电路,但是,最后还是靠人工去完成。因此,设计人员必须不断学习新知识、积累实际操作经验才能顺利地完成设计任务,而本书就是充实自己的一本好书。本书是高频电路设计的入门书,其内容包括:高频的基础知识,开关、低噪声放大器、混频器、滤波器、检波电路、振荡电路以及PLL等的设计与制作。这些设计与制作都是最基本的概念,根据实际的图表加以说明,使初学者能很快进入高频电路设计领域,对一些有经验的设计者而言,本书也是一本不可或缺的参考书本书内容新颖,深入浅出地介绍了高频电路设计。由于时间仓促,立意虽宏,疏漏之处尚祈不吝指教GHz Jidai no Kousyuuha Kairo SekkeiBy yuichi Ichikawa, Masaru AokiCopyright c 2003 by Yuichi Ichikawa. Masaru AokiAll rights reservedOriginally published in Japan by CQ Publishing Co, Ltd, TokyoChinese (in simplified character only) translation rights arranged withCQ Publishing Co, Ltd, JapanGHz時代O高周波回路設計市川裕—青木胜cQ出版株式会社2004著者简介市川裕一1963年生于群马县1985年毕业于群马大学部电子工学科1985年进入日本光电工业(株)1985年进入日本电气电波机器 Engineering(株),从事微波电路设计1988年进人(株)横尾制作所,从事卫星通信用LNB的设计开发1992年进入太阳诱电(株),从事微弱无线组件设计1999年创办 I-Laboratory,从事高频/微波电路的开发、设计与试制,咨询现在出任1 Laboratory代表青木胜1955年生于埼玉县1979年进入八重州无线(株),从事无线通信设备开发1983年进入日本摩托罗拉(株),从事通信设备的信号处理,控制软件的开发现在出任(有)DST代表董事长图解实用电子技术丛书高频电路设计与制作开关/放大器/检波器/混频器/振荡器的技巧详解〔日]市川裕一青木胜著卓圣鹏译何希才校钭学出版北京前言直到最近,所谓“高频”是指在电气电路中一块特殊的领域。那里是“电子技术人员的世界”,尤其在微波电路的设计现场,反复使用小刀加工印制图案,完成焊接铜箔的作业。作者到现在仍然记得,在刚刚进入高频行业时,听公司的前辈说过,“成为一名合格的技术人员,需要花费10年的工夫”。由于在高频领域常采用试探法,因此,也许从事数字电路或低频电路的专业人员看来,高频电路世界是不易接近的领域。然而随着移动电话的迅速普及,蓝牙( Bluetooth)、无线LAN等无线数据通信设备的快速开发,高频电路技术越来越受到关注。直到今天,人们认为“高频、微波设备是面向防卫产业的特殊技术”,但随着时代的变迁成为最先进技术及通信革命中不可或缺的普遍技术。实际上,在以电气大厂家为中心的高频领域,各种行业不同厂家的加入,且此领域中高频电路技术人员难求的局面仍在延续与过去相比,现在高频电路设计门槛变低而容易进入。原因是根据用户的要求,高频电路/微波电路用的仿真软件在迅速发展。不了解高频电路的人,看看学学久而自通,对输入电路进行最佳化,就能简单设计出相应特性的电路。若使用最近高性能的仿真软件,如果是简单的无源电路,有时也能够实际得到趋近预测特性的性能。但是,仿真软件毕竟是工具,是否能有效利用这种工具全凭使用者所具备的经验与理论基础。在实际的高频电路中,由于有仿真软件不能表现的许多电路要素;因此,实际上,一定要考虑肉眼看不见的电路要素,进行元件的配置,绘制印制图案。使用仿真软件的人,由于积累经验、具备知识的不同,完成的性能有很大差异。常听说“在公司只能做确定工作,不能积累各种经验”。此时,最有效的工作方法是使用仿真软件。若使用仿真软件,就能验证工作中所处理电路的工作情况,并进行调整。若使用刊载于文献与书中的电路或仿真软件附属的样品电路,就能够简单处理各种电路。若由仿真得到虚拟经验,并同时进行日常实用电路的设计与调整,就能极大地提高设计能力。这里,作者最想说的是“要积累丰富的经验”,不仅要阅读文献、书籍,还要尽量多地接触电路,自己动手实际制作,并通过测试调整使电路稳定可靠地进行工作。若接触众多电路,即使要必须设计全新电路或无经验电路时,也会取得成功的。本书是以晶体管技术2000年11月~2001年12月的连载与2000年6月特刊内容作为蓝本,内容加以补充,而后编辑而成。第2章以必须理解的内容为最低限度,对设计高频电路时史密斯图的用法和匹配方法进行了说明。高频电路入门者阅读的图书定是以电磁场理论为中心进行讲解,因此,本书尽量删除了一些难以理解的说明。第3章~第9章,是实际设计、试作并评价2GHz频带的各种高频电路本书所试作的电路还不是十分成熟的电路,有许多改善之处。试作相同电路,无问题也正常动作,“成功啦!”由此感到很高兴,但这并不是结束,而是“经验”积累的开始,大家手脑并用,使这种电路具有更佳的特性。采用试探法过程中,或许大家有新的发现。这就是电路特性好过了头,反而会变坏,这也是“经验”。作为积累经验的题材若能利用本书,那是件高兴的事将自己的想法整理出来以文章的形式呈现给大家,这对于作者来说,也是一次很好的学习机会,并且也是积累经验的过程。本人能够承担本书编写工作,感到非常荣幸最后谨向在百忙之中很快完成了第8章和第9章的编写任务的DST公司的青木胜先生,以及为了使本书浅显易懂而做编辑工作的晶体管技术编辑部的寺前裕司先生致以深深的谢意。2002年冬市川裕目录第1章欢迎进入高频世界—一成为高频工程师为目标1.1频带和电路1.2高频电路设计环境的变化………11241.3现在高频电路设计中广泛存在的弊端……第2章高频的基础知识——为了更好地理解高频信号…2.1信号的波长…………2.2高频电路看作分布常数的电路………2.3高频中最重要的工作是传输线的设计…………112.3.1表示传输线电气特性的“特性阻抗”…………112.3.2高频使用的传输线……2.4用分布常数与集中常数制作的高频电路2.5高频中功率比电压与电流更容易处理…162.5.1S参数的概要…………………2.5.2实际高频元件数据表中记载的S参数…2.6用史密斯图求阻抗2.6.1史密斯图222.6.2在史密斯图上描绘阻抗………………………252.6.3元件与传输线路的增加以及史密斯图上的阻抗轨迹………………………262.7高效率地传输高频信号的技术—匹配………302.7.1禁止使用电阻取得匹配……,,,2.7.2阻抗匹配实例1………………322.7.3阻抗匹配实例2…2.7.4匹配电路构成的不同造成输入阻抗特性的差异……………………………3目录2.7.5使用实际元件的匹配电路………2.8实际无源元件的高频阻抗………2.9能发挥高频电路性能的印制基板的设计2.9.1高频电路用印制基板的基础知识2.9.2印制图案的精度与特性阻抗的偏差2.9.3印制图案“弯曲”对特性阻抗的影响……2.9.4邻近接地图案对信号图案的影响2.9.5邻近信号图案的耦合会彼此影响……………第3章开关的设计与制作—控制信号流的技术3.1高频开关的作用与性能……………3.1.1开关的作用……………………3.1.2开关要求的性能……………3.2开关的种类与选择……………3.3高频开关所使用的半导体元件3.3.1PIN二极管…………3.3.2 MESFET……………………………………633.4PIN二极管作为开关元件的特性实验……………63.5开关基本型—SPST开关的种类与特性…3.5.1两种SPST开关…………………………3.5.2SPST开关的接入损耗与隔离特性3.6SPDT开关的种类与动作3.6.1串联型与并联型的组合开关………………753.6.2两种串联型的组合开关……3.7试作的SPDT开关特性的仿真分析3.7.1SPDT开关的规格…………………………793.7.2试作SPDT开关的高频特性+,隔离特性的改善、,单3.8SPDT开关的试作873.9试作SPDT开关基板的初始特性与调整3.10试作前仿真预测与评价结果不同的原因…………95
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TFT/LCD驱动IC NT35510芯片手册datasheet
TFT/LCD驱动IC、手机显示屏驱动IC-NT35510,文档详细讲解了该芯片的接口定义,以及驱动显示屏的解决方案.NOVATEKPRELIMINARYNT355105.4.2 MDD/ Link Packet Descriptions by the NT355101625.4.3 Writing Video Data to Memory Sequence.......1725.44 Writing Register Sequence...….…,…1725.4.5 Reading video Data from Memory Sequence.7735.4.6 Reading Register Sequence………,…,…,…,…,…,…,…,…,…,…,…,…,…,…,…,…,………735.4.7 Hibernation Setting-..,.,…,…T745.4.8 MDD/ Deep Standby Mode Setting-……,……,…,…,…,…,…,…,………,…,…1755.5 INTERFACE PAUSE1775. 6 DATA TRANSFER BREAK AND RECOVERY.1785.7 DISPLAY MODULE DATA TRANSFER MODES,58RGB| NTERFACE,,nn,,…,…,,,……18158.1 Genera/ Description.…,.,.,…,…1815.8.2 RGB Interface Timing Chart1825.8.3 RGB Interface Mode Set.1835.8.4 RGB Interface Bus Width Set.18759 FRAME MEMORY,……,,,191591 Configuration…....…n1915.92 Address Counter….……………,7925.9.3 Interface to Memory Write Direction.........1935.9.4 Frame Memory to Display Address Mapping.......n…1945.10 TEARING EFFECT INFORMATION1955.10.1 Tearing Effect Output Line1955.10.2 Tearing Effect Bus Trigger..........面面面面面面面aa面面看日自DB自2005.11 CHECKSUM2125.12 POWER ON/OFF SEQUENCE2145. 12. 1 Case 1-REsX line is held High or Unstable by Host at Power On..................2155. 12.2 Case 2- ResX line is held Low by host at power on...e.2165.12.3 Uncontrolled power off2765.13 PoWER LEVEL MODES wmmmmmm2175.13.1 Definition2175.13.2 Power level Mode flow chartn2185.14 RESET FUNCTION…112205.14. 1 Register Default value2205.14.2 Output or Bi- directiona/{o)Pins………,,,…,……………,…,…,,…,…………,……,………2225.14.3 Input Pins………,…,,…,…2221028/20113Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT355105.15 SLEEP OUT-COMMAND AND SELF-DIAGNOSTIC FUNCTIONS OF THE DISPLAY MODULE2235. 15. 1 Register loading Detection.....2235.15.2 Functionality Detection2245.15.3 Chip Attachment Detection…….2255.16 DISPLAY PANEL COLOR CHARACTERISTICS mmmm 2265.17 GAMMA FUNCTI0N..…,………面国面面面国面2275.18 BASIC DISPLAY MODE■日量2285.19 NSTRUCTION SETTING SEQUENCE2295.19.1 Sleep In/Out Sequence…,…,…,…,…,…,…,…,…,…,,…,…,…,…,,…2295192 Deep Standby Mode Enter/ Exit Sequence……2305.20 INSTRUCTION SETUP FLOW2315. 20.1 Initializing with the Built-in Power Supply circuits2315. 20.2 Power OFF Sequence232521 MTP WRITE SEQUENCE…….2335.22 DYNAMIC BACKLIGHT CONTROL FUNCTION234522.1 PWM Control Architecture面面面面面面a面a面面2365. 22.2 Dimming Function for LABC and Manual Brightness Control6.22. 3 Dimming Function for CABC and Force PWM Function,2445.22.4 PWM Signal Setting for CABC and LABC2455.2.5 Content Adaptive Brightness Contro/CABC)………,2475.22.6 Ambient Light Sensor and Automatic Brightness Contro(LABC)…,…,…,…,…,…,…,…,…,………2485.23 COLUMN, 1-DOT, 2-DOT, 3-DOT AND 4-DOT INVERSION (VCOM DC DRIVE2556 COMMAND DESCRIPTIONS2566.1 USER COMMAND SET256NOP0000)....,.…260SWRESET: Software Reset (0100h ...267RDDID: Read Display ID(0400h-0402h)262RDNUMED: Read Number of Errors onRDDPM: Read Display Power Mode(0A00h)............264RDDMADCT: Read Display MAdo间0B0oh),…,265RDDCOLMOD: Read Display Pixel Format0cooh)………266RDDM: Read Display image Mode间 0D00h)……,…………………………………………………………267RDDSM: Read Display signa/Mode(0E00h)……................,…………………268RDDSDR: Read Display Self-Diagnostic Result(sLPN: Sleep In(1000h)-……2701028/20114Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510SLPOUT: Sleep Out(100h)……,…,…,…,…,…,…,…,…,……272PTLON: Partial Display Mode On(1200h).........274NORON: Norma| Display Mode On(1300h)...............………275INVOFF: Display Inversion Off (2000h)276yvoN: Display Inversion On(2100b)….......……量道量道面道量温量量量面量面面面面目面面277ALLPOFF: All Pixel Off(2200h)278ALLPON: All Pixel On(2300h280GAMSET: Gamma Set(2600h)…,,,,,,…,282DISPOFF: Display ofi(2800b)….……....,,…,…,…,…,……,283DISPON: Display On( 2900b)284CASET: Column address set(2A00h~2A03h).……,,…285RASET: Row Address Setn287RAMWR: Memory Write(2c00h)289RAMRD: Memory290PILAR: Partial Area(3000h-3003)....∴291TEOFF: Tearing Effect Line OFF (3400h)面面面面面a面面294TEON: Tearing Effect Line ON (3500h)295MADCTL: Memory data Access Control (3600h)..............................296DMOFF: dle mode o(3800……299IDMON: ldle Mode On (3900h).......300COLMOD: Interface Pixel Format 3A00h)302RAMWRC: Memory Write Continue(3c00h)…..........……303RAMRDC: Memory Read Continue(3E00h)……,…,,…,,,…,…304STESL: Set Tearing Effect Scan Line(4400h-4401)...........305GSL: Get Scan Line(4500h-4501h),.…,…,…,…,…,…,…,…,…,…,…,,…307DPCKRGB: Display Clock in RGB Interface(4A00h)308DSTBON: Deep Standby Mode On(4F00h)BIEaIESEBBSEBSEEEE309WRPFD: Write Profile value for Display (5000h-500Fh)........................310WRDISBV: Write Display Brightness(5100h)...………311RDDISBV: Read Display Brightness(5200h)…,…312WRCTRLD: Write CTRL Display(5300h)………313RDCTRLD: Read CTRL Display value(5400h)……,.....,…....……,…,…………315WRCABO: Write Content Adaptive Brightness Contro(5500h)…………………317RDCABO: Read Content Adaptive Brightness Control(5600h)…….…,…,…,…,…,……,…,…,……………………318NRHYSTE: Write3191028/20115Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510WRGAMMSET: Write Gamma Setting(5800h-5807h)..eec.321RDFSVM: Read Fs Value MSBs(5A00h)...........323RDFSVE: Read Fs value lsBs(5B0h)..............….……324RDMFFSVM Read Median Filter Fs value MSBs (cooh).325RDMFFSVL: Read Median Filter Fs value LSBs(5D00h)326WRCABCMB: Write CABC minimum brightness(5E00h).,…,…,…,………,,………327RDCABCMB: Read CABC minimum brightness(5Fooh).........328WRLSCO: Write Light Sensor Compensation Coefficient value(6500h~6501h)………,……………,…,…,…………329RDLSCCM: Read Light Sensor Compensation Coefficient Value MSBs(6600h )......,.........-. 330RDLSCCL: Read Light Sensor Compensation Coefficient Value LSBsRDBWLB: Read Black/White low Bits(7000h)332RDBkX: Read Bkx (7100h)333RDBky: Read Bky(7200h)334RDWX: Read Wx( 7300b)............. e..335RDWy: Read wy(7400h)…336RDRGLB: Read Red/Green Low Bits(7500h).......337RDRx: Read Rx(7600).……338RDRy: Read Ry(7700b)..........339RDGX: Read…,,,,,,,,340RDGy: Read Gy(7900h)....................n…341RDBALE: Read blue/ color low Bits(7A00h)……n,,342RDBx: Read Bx(7B00b)-..……,,,343RDBy: Read By(7c00b),,,,.,.,.,.,.,.,.,...,.,.,.,.,.,.,.,…,…344RDAx: Read ax(7D0oh)………,…345RDAy: Read Ay(7E00h)……,…,…,…346RDDDBS: Read DDB Start(A100h-A104h347RDDDBC: Read DDB Continue(A800h-A804h)349RDFCS: Read first checksum(AA0oh)……351RDCCS: Read Continue Checksum(AF00h)-.…………352RDID1: Read iD1 value(DAooh).ee..353RDD2: Read D2 Value(DB0oh)……354RDD3: Read D3vaue( COoh)……………,……………,…………………,…3557 SPECIFICATIONS…3567.1 ABSOLUTE MAXIMUM RATINGS.3567.2 ESD PROTECTION LEVEL3561028/20116Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT355107. 3 LATCH-UP PROTECTION LEVEL3567.4 LIGHT SENSITIVITY3567. 5 DC CHARACTERISTICS3577.5.1 Basic characteristics.357752MP/ Characteristics35975.3 MDD/ Characteristics wwwwwww 3617.5. 4 Current Consumption in Standby Mode and DSTB Mode..3627.6 AC CHARACTERISTICS3637.6.1 Parallel Interface Characteristics (80-Series McU)36376.2 SerialInterface Characteristicsaaaassaaaaussuaaaaaaaaaaaaaaaaaaaa3647.6.3 12C Bus Timing Characteristics36576.4 RGB Interface Characteristics3667.6.5 MIP/DS/ Timing Characteristics3677.6.6 MDD/ Timing Characteristics........3717.6.7 Reset Input Timing3728 REFERENCE APPLICATIONS. G.…3738.1 MICROPROCESSOR INTERFACE3738. 2 CONNECTIONS WITH PANEL. m..n..37810/28/2011Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510REVISION HISTORYPrepareChecked ApprovedVersionContentsDatebyy0.00OriginalKevinn swDennis2010/02/12Page 9, remove 32ORGB X 480Page 10, Features, remove 32ORGB X 480 and mux descriptionVGHO VGLO for gate control signals, remove VDDIM/SSIMPage11, update power voltage rangePage 12, Block diagramPage 13 to 22Add: VDD DET, DIOPWR, PSWAP, DSWAP, VGHO, VGLO, VRGHVREFCP, CSP, CSN, LVGL, C61P, C61N, VRGH, VREF, GOUT.Remove: VDDIMSSIM. VDDELUpdate: MVDDL,VGL,VGH, Test pinsPage23, update IF tablePage 51 to 66: update SPl, M3=1 setting in figurePage 102, 103, change DSIM, DSiG bit Reg to OXB 100Page 115, 124 Add WrPFD 50h on tablePage201, modified to 480X864 memoryPage202, Remove 320x480Page204, update whole Frame memory tablePage 205, TE map to 480 lines, DOPCTR change to B100hPage207, tvdI TBDPage225, 226, update VDD in figurePage227, Modes to 7Page232, Sout update to Gout0.01Page235, Add chip attachment Detection sectionKevinSWDens2010/03/17Page237, update Gamma StructurePage255, 270, update FOSC, ExamplePage266, update KB CLEDPage272, Add inversion sectionPage273, 274, Power ArchitecturePage275, update DIOPWRVREFCP, VGMP1,VGLOPage276, update C61P/N, LVGL, VGLO, VRGH,VREFCP, DIOPWR,VGMP 1/2VGMNVGSPVGSNPage291, change name to RAMKPPage306 to 312, remove 320x 480 resolution settingPage337, 5400h Cmd add a andg bitPage385, Absolute Max Rating for MV Hv, remove VDDIMPage 386, VDDIM removePage387, Vdev value modifiedPage402, 403, Remove MVDDI in notePage406, Remove 320 X 480, update 360X640 Sout sequencePage 173 to 181, MDDI windowless packetPage377, 379, A1, A8 cmd updatePage387 to 396, VDDI to 3.3VPage362 to 37670h to 7Eh cmd default valuePage28, 29, 30, 40, 41, 42 MPU figure updatePage 12, 274 Block and power architecture update10/28/20118Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510Page 10, remove 36ORGB X 640, Add 480RGBx720Page 11, update GPo[3: 01pdate VGHO, VGLOge 13, update Block DiagramPage 18, update IM, GPO, VSEL, and EXB1TPage 20, update VGLO, LVGLPage 21, update VGLX,VGL REG, Remove CP6 P/NPage 23, update VDD BCPage 24, update ContACT1-4, VSSIDUMPage 25, update iF description tablePage 207, update Address CounterKevinDennis2010/0406Page 235, update Resolution DataPage 252, remove CLED VOLPage 271, remove KB CLED_ VOLPage 277, add 4 dot inversionPage 306, 308, 313, 326 resolution update, remove nHD, add 480X720Page 384, update absolute voltagePage 385, update DC specPage 386, update Note3, Note5Page 405. update resolutionPage 406. update Alignment Mark-Page10,11205,206,234,305307,312,325404, update resolutionPage 13, update Block diagramPage 17-24, update pin description(MDDI not support DSWAPUpdate TEIR, TE_L, DSTB SEL, RESX, VSEL VREF PWR 12C_SDAremove VDD BD, ENDIOVPagB104121ric data type 0x24Page 134, update eotP optionPage 175, update MDDI support typPage 176, 177, update sub frame header, link shut down packetSWDennis2010/05/18Page 179, 180, update skew calibration packet, client capability packetPage 184, update packet type is 20Page 209, 214, update tE off, output is low, tering effect bus triggerPage 241, update gamma to 10 bits settingPage 276, update 3-dots inversionPage 384 update VIH, VIL, VoH,VOLPage 388, update hibernation wake upPage 390, 392 update Note2-Remove pad chapter to application note10/28/20119Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510Page 14, update block diagram of RGBBPPage 16, update WRX/SCL/2C SCL, sDI/2C SDAPage 19-25, update IM3 pin description, RGBBP(remove 12C SA1)OSC Test description, KBBC to test pinPage 21, update VREF PWr descriptionPage 26, update IM tablePage 42-44, update MPU read scriptionPage 49-52, update SPl+RGB or SPl+MDDI description0.04Page 60, update 12C AddressKevinSWDen201007/27Page 181, 182, update 16 bit SPI pause descriptionPage 187-189, update RGB figurePage 200, update TE waveform in RGB mode 2Page 237, MTP sequencePage 238-258, update one dimming control for LABC CABcremove KBBc function descriptionPage 260, update 0X04 Cmd, remove KBBC CmdPage 262, update 0XA 1,0xA8 CmdRemove all the KBBc related function registerPage11,12,190,191,219,284-287,291,304,376,remove 480RGBX 360Page 15, update MTP PWR application voltagePage 16, update CSX, RDX, DC/X, SDI, SDOPage 18, update DSWAPPage 19, correct typo for IM[3: 0]in MDDI+SCL(falling edge)Page 38&44, update typo for data format in table0.05Page 53, update read data 8-8-8-bit only in SPIKevinDenn2010/10/18Page 183, 184, update note for min porch of RGB interfacePage 232, update MTP sequence and MTP PWR voltagePage 235, 236, remove PWM ENH OE bit(keep x2Page 312, 314, update typo for BCTRL and BLPage 371, 372: update figuresPage 373: update figure, add RGB+l2CPage 374: update figures, IM settingPage 375: update figures, IM settingPage 15, update DVDD typicage 129, update typo in figure of AwERPage 194, update typo for Hsync218 add condition of irregulaoffPage 219, 255, update command name typo of 05h commandPage 228-231, update typo in figuresPage 234, update typo for ALS in figure 5. 22.10.1Page 235, update CLED VOL bit in figure 5. 22.2KevinDennis2010/12/24Page 312, 314, update typo for BCTRL bl bitsPage 316, update typo in flow chartPage 346, update description of parameterPage 355, update maximum rating for VGH, GlxPage 358, 359, update 2 lane description in conditionPage 362, update pin name typo in figure-Page 376, update typo for CRGB condition10/28/201110Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformation
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