微波网络及其应用.pdf
微波网络及其应用 免费分享85,6直接耦合谐振器笮带带通§7.8支线定向合器…………滤波器………………………§7.9混合电桥的基本概念3!9§区.71/4波长短截线和联接线宽§7.10魔?和折叠双T接头………3I带带通滤波器…957.11矩形波导裂缝电桥§5.8平行耦合线带通滤泼器…20087.12环形电桥h十酽■■■冒吾1·P■■··3了3§59交指型带通滤波器……………6§7.13三端功率分配器…§5.10微带阻滤波器习趣§5,11徼波分路滤波器……………26§5,12微波滤波酱的相移和时延第八章微速铁氧体元件……特性司卓p自申●■啁口中●口啁■四●d自■口■§8.1引言……………………3日§5.13元件损耗对滤波器性能的§82张量导磁率和本征导磁率…影响4■即22383铁氧体非互易网络-346习题230§8,4Y型结环行器分析…………370§8.5双模移相器分析第大拿.阻抗匹配网络「2§8.6边导模器件…39§6.1引言23题………397§6.2抗匹配网络的宽带极……233§631/4波长阶梯阻抗变换器…a九章微渡系統分析中·“章自甲·‘86,4渐变线阻抗变换器…7§9.1引6.5低通港波阻抗变换器25289.2复杂网络的一般婢论……………4§6.6电抗性负载阻抗匹配网络……25939.3微波混合系统分析……n09§67负阻负载随抗匹配网络……21§9.4微波复杂系统分析…………43对题27589.5徼波溅量系统分柝·§9.6长馈线网络反射系数的概第七蠶微波定向網合器、沮合电桥及率分布+66功率分配器27T习趙87,1引肓……27§72定向耦合器的基本概念第十章计算乱输助设计网络初步…4537了§7.3平行矩形披导圆孔阵定向§1.1引言476合器21§1.2计鲜机辅助设计的一般§7.4正交矩形波导十字槽定向问题45构合器■·十■■平■■+·4女■画■p■b■29010,3矩量法S75单节平行糊合线定向糊§1合,4微波网络的优化99合器…295§10.5模拟技术§7.6多节平行耦合线定向§10.6计算机辅助设计的发展糊合楼越势50r§77不均匀耦合线高通定向耦合器……附录四单纯形优计录附录五长愦缤网络反射系数的附录一矩阵代数模拟程序及其说明附录二互易定理参考书目…晶幽"55附录三行主元消去法求逆矩阵…506第一章微波网络基础§1.1引言任何一个微波系统,都是由各种微波元件和徽波传输线连接而成。微波传输线特性可以用广义传输线方程来描述,徼波元件特性可以《类似低频网络)等效电路来描述,于是复杂的徽波系统,就可以用电磁理论和低频网络理论相绪合来求解,成为一门傲波网络理诒。每个微菠元件都可飴和几个微波传输线相连接,按照所连接传输线数目多少,微波元件可以分成苧端口、双端『、三端口、四端口等微波元件。每个微波元件都可以看成个微波网络,堕着徵波元件端口数的不同,微波网络也分为单端口、双端『、三端口、四端口等微波网络。实际所用的微波元件可高达四端口,凹端厂以上的徽波元件就很少应用了微波网络理论的主要目的,在于分析做波元件的工作特性,或依据它的工作特性,综合出微波元件结构和设讨方法,以便工程应用。分析微波元件的工作特性的方法有二,是应用麦克斯韦方程和元件的特定边界条件,求出其场强的分布、波的振荡和传输等特性;另一是把微波元件等效成微波网络,把连接它的传输縐等效成双导线传输线,然后用网络方法进行分菥。第一种方法比迹严格,听得结果ⅸ较全面正确,但其数学送算繁琐,所得结果通常都是特妹函缴,不便于下程应用。第种方法是近似的,能够得到微波元件主要传输特性,并且网络参薮可用测量方法来确定,便于工程应用,但不能得出元件内部场的分布情況。昱然如此,但由于网络方法计算简便,易于测量,又为广大工程技术人员所熟知,揿应用较为广泛。徽波电磁理论与徹波网络理论域是两大独立分支,但两者是相互连系的,微波网络理论是微波电磁理论的工程化,只信在微波电憾理论的基础上来探讨和发展微波网络理论,才是正确的方向微波网络理论又分为线性网绉理论和非线性网络理论,本书只讨论线性网络理论微波网络方法分析法和综合法两种,分析法是按已经掌握的基本微波网络结构及其特性,进行各种组合,来满足工作要求;综合法则根预定工作特性要求,来实现徼波网络结构。前者设计比较简单,但往往得不到性能优良而元件较少的最佳结果;后者虽然设计理论比较复杂,但能得到性能优良而元件较少的最佳设计。现在由于电子计算机的发展网络猕合所雷要的繁琰计算,都可用计算机来完成,一些主要元件设计都有现成图表数据备查,因而网络综合法已成为设计微波元件的主要方法。本书就是以网络综合法作为主要方法本章日的在于给定微波阿络的一些基本概念和基本参数。首先讨论广义传输线理论3从而定义出微波网络的电压和电流,这对了解等效电路的意义是很必要的。然后导出网络的阻抗矩阵、导纳矩阵、A矩阵、散射矩阵以及传输矩阵,并讨论它们的性质与相互变换,这给我们分析徽波网络是供数学工具。最后,讨论徼波闼络的本征值问题、网络参数浏量理论以及讯号流图,这对我们求解微波网络问题提供些必要的手。§1.2做波传输线及其特性电磁波可以用导体战介质进行引导,使其按一定方向传输·这种引导电磁被的装置叫妝传输线。在微波波段内,导行波的现象特明显,特别容彭b,因而有各种各样的微波传输线。图1.2-1示出几种常见的微波传输线,它们都是直的〔轴向),可以很长,直至无穷远。它们的横截面(横〕的几旋早4)矩形导(Abet〔c)同抽线何形状和媒质分布处处灬样,不因轴向位置不同而改变n这类传轴线叫做均匀传输线。在这些传输线中,电磁波沿着轴向传输,横截面上电磁场按一定规律分t带线布,所以这类电磁场问题可分为d)带状线两部分来研究。一是研究轴向的团12-1各种做菠传输线传输问题,叫做纵向问题;一是研究横截面上电磁场分布问题,叫做横向问题。两者相互联系,相互制约,究竟先研究哪个阿题,在理论上是无关紧要的。本背先从麦克斯韦方程发,简略叙速这类传输线的分析方法,从而得出其传输特性和等效电路。、微波传输线的电磁场方架研究任意檢截面的均匀徼波传输线中的电碱场,应从麦克斯韦方程出发。在正弦交变场情况下支克斯韦方程的复数形式是vxH=OEYXE=-FoWH.2-1·E=0V·=Q式屮∈是媒质的介电常数,μ是导磁率,它们都是与场强无关的當数。为求解传输线中电场E和磁场酽的方便,通常引入两个赫兹矢量位。由VH=0出发,可引入一个矢量位∏,使得≡{×∏,它消足回·H=jω∈V·(Vⅹn)=0,因为任何欠量旋度的散度恒等于零。矢量位∏°叫做赫兹电矢量,它揣足三维亥姆霍茨方程V2T+2T-0H=j∈V×T(1.2-2E=V(∏)+kT由￠-E=0出发,还可引入另一个矢量位冂,使得E=-fμ×n,并满足方程,j0v·(×T")=0。矢量位∏叫做赫兹磁矢量,它也满足三维亥姆霍茯·EVm+2r”=E=-jcV×nH=V(·T")+2n式中k=v比∈是无限媒质的波数。为解出均匀传输线中电磁场的普遍关系式,我们釆用广义正交柱坐标系(,琶,2)其中z是纵向直坐标,而,v是横截面上的曲线坐标,如图1.2-2所示。对于直角坐标系,“=%,U=y。在此坐标系中,为求解方程常数(12-2)和(12-3)筒便起见,可令『和∏t情数只有z方间分量,即=ir=ili同时担算符Ⅴ写成Ⅴ=4十--,其中Ⅴ是横截面型标的算符、L是之方向的单位矢。将上述关图122广叉止交坐訴系系代入(1.22)和(12-3)式中即可得到H=冖jo∈XV∏EA=v022十2∏z以及V21]z+21i=0E=j四Hz=×Ⅴm(1.2-5FI = =vp点2丑由此可见,在惹电矢量只有z分量的情况F,电磁波在2方向只有电场分量Ex而磁场分量Hx=,掀叫橫磁波(TM模),又叫徹哐波(E貘)。在勅兹磁矢量只有z分量的情况下,电磁波在z方向只有磁场分量II,而电场分量x=0,故叫做横忠波(TE模),又叫徹磁波(摸)这些模式能否在传输线中存在,是出其边界条件来决定的。对于TM模,在W=常数或U=常数的电壁(殚想导体表面)上!9=0;在H=常数的磁壁⊥d=0,在=常数的磁壁上(理想导磁体表面),。0=0,对于模,在2常数的电壁上,0,在=常数的电壁上,a门=0;在=砦数或v=常数的磁瑾上,巧=0在徽彼传输线中,如果单纯TM模或TE核不能满足逊界条件时,两者必须同时存在此时电磁就既有Ex分量,也有丑分量,叫做混合模。在直型标系中,混合模有两种简单形式,可令(12-2)或(1.2-3)式中=,「=求得。它们的表示式是∏6+hnr+R s上x=0d+们(1.2-7)EPoYEHII∵x由此可见,在赫兹电矢量只有x分量的情况下,电憾波的电场和磁场都具有之分量,仨磁场没有分量,即H=0,磁力线分纵向截上,叫做纵向磁波,筒称LSM模或TM模。在赫兹磁欠量只有x分量的情况下,电磁波的电场和磁场都有z分量,但电场没有x分量,即E:=0,电力线分布在纵向截面上,叫做纵向电波,简称LSE模或TEx棋。广义传输线方程我竹已知:求解黴波传输线的电磁场时,不管其中存在何种传输模式:槨要解赫兹矢量的三维亥姆霍茨方程,特别重要的是求解其中某一坐标分量的三维亥姆霍茨方积Van+kl o即YAI T五↓高I=0式中波函数Ⅱ既可以代表赫兹电矢量的κ分量(M模〉或x分量(LSM模),也可以代表赫兹磁矢量的2分量(TE模)或分量(LSE樸)。(1.2-8)式是个二阶偏微分方程,可用分离交量法求解。求解时令∏(#,沙,2)=∫(#,v)ψ(212-9式中f(u,t)只是横截面平标和的函数,ψ(x)只是纵向坐标之的图数。将(1,2-9式代入(1.2-8)式中就得到Vif(m, v)d2p(2)上式芹边仅仅是和U的数,与2无关;右边仅仅是z的函数,与和矿无关。两边相等,表明它们都必须等于常数。设此分离常数为一,则有(1.2-10)y2(2)=0(1.2-11)式中γ=k一由此可见,波函数∏(,U,2)可分离成f(u,)烈ψ(2)两个函教之积,其中f(,v)满足横坐标和v的二维亥姆霍茨方程,它决定横截面上电磁场分布。ψ(2)满足纵巫标z的传输线方程,它决定轴向电磁波的传输特性,故此方程称为广义传输线方程。由于我们所研究的微波传输线是无穷长,没有反射波,,故(1.2-11)式的解是2〕=Ag式中A是一个常缴,决定波的振幅。于是波函数n是∏(u,,z)=f(,u)ψ(z)=Af(n,)e(1.2-12)已知波函数后,传输线中各种模式的电戤场可由(1.2-4)到(1.2-7)式求得例如对于TM模∈A2xV(H,U)EE1=一YAVf(,t)e1.2-13)42)e对」IEE=j甲A2×Vf(,)e1(1.2-14)ustkA(u, ue传输特性电磁波在微波传输线中的传输特性,通常用其相速、波阳抗以及传输功率来表征,因为用它们可以确定波的传输快慢、强弱以及电场与磁场间的关系。一般说来,波的这些特性都与传输线的横截面的儿何结构有关,也就是与其边界条件关。下面分别叙述之1.被的速度在(12-2)式中波函数具有因子cY,它表示电磁波沿2方向的传输情况。ˇ叫做传输常数,通常是个复数,可以写为y=a+。其中叫做衰减常数,表示波在传输过程中振幅哀减的快慢β叫做相移常数,表示波不传输过程中相位变化的快慢。如果我们假设媒质是无耗的,μ和∈郗是实常数,则波数長=如vμ也是实数,这样,由y2后一}2可知,y的性质随者的不同而异,而是白横截面的边界条件决定的但是,不管横截画的几何结构如何,只可能有三种情况:(1)是的=0,(2)是>0,(3)是A0的情况下,电磁波的E。或H不等于,可以是M糖、E模或混合模这时传掏常数是即1.2-1?)如果令h=-5=2x/2n,B=/=2x/入,h=2τ/A其中是无限媒质中的波长,2是波导波长,A是截止波长,则(12-17)式变为(λ3/A入)21.2-18}由此可见,当為a,kx>λ,即波的相速大子无限媒质的光速,叫做快波。快波的波长大于无限媒质的波长。当λ>λa时,相速和波长都是虚激,没有物理意义,但这时=kk式中α是实数,故此电磁波变成衰减电磁场,随着轴向距离的增大,场的振幅逐惭衰演,但其相位不变,故衰减场是不能在传输线上传输的。0=是传输线中传输快波还是衰减场的临界情况,这时=0,月=0,传输线中既没有快波传输,也不是衰减场,而是等福的电磁场。λ之所以叫儆截止铍长,是因为当λ≥λe时,传输线中没有电磁波传输。在始8:因此Y=vR一的=v1+(B/R)=f于是波的相速和波长是1.2-19)2兀=入/V1+(戶,/)2由此可见,这类波的相速小于无阳媒质中的光速,岍做慢波,慢波的波长小于无限媒中的波长
- 2020-12-10下载
- 积分：1
TFT/LCD驱动IC NT35510芯片手册datasheet
TFT/LCD驱动IC、手机显示屏驱动IC-NT35510，文档详细讲解了该芯片的接口定义，以及驱动显示屏的解决方案.NOVATEKPRELIMINARYNT355105.4.2 MDD/ Link Packet Descriptions by the NT355101625.4.3 Writing Video Data to Memory Sequence.......1725.44 Writing Register Sequence...….…,…1725.4.5 Reading video Data from Memory Sequence.7735.4.6 Reading Register Sequence………,…,…,…,…,…,…,…,…,…,…,…,…,…,…,…,…,………735.4.7 Hibernation Setting-..,.,…,…T745.4.8 MDD/ Deep Standby Mode Setting-……,……,…,…,…,…,…,…,………,…,…1755.5 INTERFACE PAUSE1775. 6 DATA TRANSFER BREAK AND RECOVERY.1785.7 DISPLAY MODULE DATA TRANSFER MODES,58RGB| NTERFACE,,nn,,…,…,,,……18158.1 Genera/ Description.…,.,.,…,…1815.8.2 RGB Interface Timing Chart1825.8.3 RGB Interface Mode Set.1835.8.4 RGB Interface Bus Width Set.18759 FRAME MEMORY,……,,,191591 Configuration…....…n1915.92 Address Counter….……………,7925.9.3 Interface to Memory Write Direction.........1935.9.4 Frame Memory to Display Address Mapping.......n…1945.10 TEARING EFFECT INFORMATION1955.10.1 Tearing Effect Output Line1955.10.2 Tearing Effect Bus Trigger..........面面面面面面面aa面面看日自DB自2005.11 CHECKSUM2125.12 POWER ON/OFF SEQUENCE2145. 12. 1 Case 1-REsX line is held High or Unstable by Host at Power On..................2155. 12.2 Case 2- ResX line is held Low by host at power on...e.2165.12.3 Uncontrolled power off2765.13 PoWER LEVEL MODES wmmmmmm2175.13.1 Definition2175.13.2 Power level Mode flow chartn2185.14 RESET FUNCTION…112205.14. 1 Register Default value2205.14.2 Output or Bi- directiona/{o)Pins………,,,…,……………,…,…,,…,…………,……,………2225.14.3 Input Pins………,…,,…,…2221028/20113Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT355105.15 SLEEP OUT-COMMAND AND SELF-DIAGNOSTIC FUNCTIONS OF THE DISPLAY MODULE2235. 15. 1 Register loading Detection.....2235.15.2 Functionality Detection2245.15.3 Chip Attachment Detection…….2255.16 DISPLAY PANEL COLOR CHARACTERISTICS mmmm 2265.17 GAMMA FUNCTI0N..…,………面国面面面国面2275.18 BASIC DISPLAY MODE■日量2285.19 NSTRUCTION SETTING SEQUENCE2295.19.1 Sleep In/Out Sequence…,…,…,…,…,…,…,…,…,…,,…,…,…,…,,…2295192 Deep Standby Mode Enter/ Exit Sequence……2305.20 INSTRUCTION SETUP FLOW2315. 20.1 Initializing with the Built-in Power Supply circuits2315. 20.2 Power OFF Sequence232521 MTP WRITE SEQUENCE…….2335.22 DYNAMIC BACKLIGHT CONTROL FUNCTION234522.1 PWM Control Architecture面面面面面面a面a面面2365. 22.2 Dimming Function for LABC and Manual Brightness Control6.22. 3 Dimming Function for CABC and Force PWM Function,2445.22.4 PWM Signal Setting for CABC and LABC2455.2.5 Content Adaptive Brightness Contro/CABC)………,2475.22.6 Ambient Light Sensor and Automatic Brightness Contro(LABC)…,…,…,…,…,…,…,…,…,………2485.23 COLUMN, 1-DOT, 2-DOT, 3-DOT AND 4-DOT INVERSION (VCOM DC DRIVE2556 COMMAND DESCRIPTIONS2566.1 USER COMMAND SET256NOP0000)....,.…260SWRESET: Software Reset (0100h ...267RDDID: Read Display ID(0400h-0402h)262RDNUMED: Read Number of Errors onRDDPM: Read Display Power Mode(0A00h)............264RDDMADCT: Read Display MAdo间0B0oh),…,265RDDCOLMOD: Read Display Pixel Format0cooh)………266RDDM: Read Display image Mode间 0D00h)……,…………………………………………………………267RDDSM: Read Display signa/Mode(0E00h)……................,…………………268RDDSDR: Read Display Self-Diagnostic Result(sLPN: Sleep In(1000h)-……2701028/20114Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510SLPOUT: Sleep Out(100h)……,…,…,…,…,…,…,…,…,……272PTLON: Partial Display Mode On(1200h).........274NORON: Norma| Display Mode On(1300h)...............………275INVOFF: Display Inversion Off (2000h)276yvoN: Display Inversion On(2100b)….......……量道量道面道量温量量量面量面面面面目面面277ALLPOFF: All Pixel Off(2200h)278ALLPON: All Pixel On(2300h280GAMSET: Gamma Set(2600h)…,,,,,,…,282DISPOFF: Display ofi(2800b)….……....,,…,…,…,…,……,283DISPON: Display On( 2900b)284CASET: Column address set(2A00h~2A03h).……,,…285RASET: Row Address Setn287RAMWR: Memory Write(2c00h)289RAMRD: Memory290PILAR: Partial Area(3000h-3003)....∴291TEOFF: Tearing Effect Line OFF (3400h)面面面面面a面面294TEON: Tearing Effect Line ON (3500h)295MADCTL: Memory data Access Control (3600h)..............................296DMOFF: dle mode o(3800……299IDMON: ldle Mode On (3900h).......300COLMOD: Interface Pixel Format 3A00h)302RAMWRC: Memory Write Continue(3c00h)…..........……303RAMRDC: Memory Read Continue(3E00h)……,…,,…,,,…,…304STESL: Set Tearing Effect Scan Line(4400h-4401)...........305GSL: Get Scan Line(4500h-4501h),.…,…,…,…,…,…,…,…,…,…,…,,…307DPCKRGB: Display Clock in RGB Interface(4A00h)308DSTBON: Deep Standby Mode On(4F00h)BIEaIESEBBSEBSEEEE309WRPFD: Write Profile value for Display (5000h-500Fh)........................310WRDISBV: Write Display Brightness(5100h)...………311RDDISBV: Read Display Brightness(5200h)…,…312WRCTRLD: Write CTRL Display(5300h)………313RDCTRLD: Read CTRL Display value(5400h)……,.....,…....……,…,…………315WRCABO: Write Content Adaptive Brightness Contro(5500h)…………………317RDCABO: Read Content Adaptive Brightness Control(5600h)…….…,…,…,…,…,……,…,…,……………………318NRHYSTE: Write3191028/20115Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510WRGAMMSET: Write Gamma Setting(5800h-5807h)..eec.321RDFSVM: Read Fs Value MSBs(5A00h)...........323RDFSVE: Read Fs value lsBs(5B0h)..............….……324RDMFFSVM Read Median Filter Fs value MSBs (cooh).325RDMFFSVL: Read Median Filter Fs value LSBs(5D00h)326WRCABCMB: Write CABC minimum brightness(5E00h).,…,…,…,………,,………327RDCABCMB: Read CABC minimum brightness(5Fooh).........328WRLSCO: Write Light Sensor Compensation Coefficient value(6500h~6501h)………,……………,…,…,…………329RDLSCCM: Read Light Sensor Compensation Coefficient Value MSBs(6600h )......,.........-. 330RDLSCCL: Read Light Sensor Compensation Coefficient Value LSBsRDBWLB: Read Black/White low Bits(7000h)332RDBkX: Read Bkx (7100h)333RDBky: Read Bky(7200h)334RDWX: Read Wx( 7300b)............. e..335RDWy: Read wy(7400h)…336RDRGLB: Read Red/Green Low Bits(7500h).......337RDRx: Read Rx(7600).……338RDRy: Read Ry(7700b)..........339RDGX: Read…,,,,,,,,340RDGy: Read Gy(7900h)....................n…341RDBALE: Read blue/ color low Bits(7A00h)……n,,342RDBx: Read Bx(7B00b)-..……,,,343RDBy: Read By(7c00b),,,,.,.,.,.,.,.,.,...,.,.,.,.,.,.,.,…,…344RDAx: Read ax(7D0oh)………,…345RDAy: Read Ay(7E00h)……,…,…,…346RDDDBS: Read DDB Start(A100h-A104h347RDDDBC: Read DDB Continue(A800h-A804h)349RDFCS: Read first checksum(AA0oh)……351RDCCS: Read Continue Checksum(AF00h)-.…………352RDID1: Read iD1 value(DAooh).ee..353RDD2: Read D2 Value(DB0oh)……354RDD3: Read D3vaue( COoh)……………,……………,…………………,…3557 SPECIFICATIONS…3567.1 ABSOLUTE MAXIMUM RATINGS.3567.2 ESD PROTECTION LEVEL3561028/20116Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT355107. 3 LATCH-UP PROTECTION LEVEL3567.4 LIGHT SENSITIVITY3567. 5 DC CHARACTERISTICS3577.5.1 Basic characteristics.357752MP/ Characteristics35975.3 MDD/ Characteristics wwwwwww 3617.5. 4 Current Consumption in Standby Mode and DSTB Mode..3627.6 AC CHARACTERISTICS3637.6.1 Parallel Interface Characteristics (80-Series McU)36376.2 SerialInterface Characteristicsaaaassaaaaussuaaaaaaaaaaaaaaaaaaaa3647.6.3 12C Bus Timing Characteristics36576.4 RGB Interface Characteristics3667.6.5 MIP/DS/ Timing Characteristics3677.6.6 MDD/ Timing Characteristics........3717.6.7 Reset Input Timing3728 REFERENCE APPLICATIONS. G.…3738.1 MICROPROCESSOR INTERFACE3738. 2 CONNECTIONS WITH PANEL. m..n..37810/28/2011Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510REVISION HISTORYPrepareChecked ApprovedVersionContentsDatebyy0.00OriginalKevinn swDennis2010/02/12Page 9, remove 32ORGB X 480Page 10, Features, remove 32ORGB X 480 and mux descriptionVGHO VGLO for gate control signals, remove VDDIM/SSIMPage11, update power voltage rangePage 12, Block diagramPage 13 to 22Add: VDD DET, DIOPWR, PSWAP, DSWAP, VGHO, VGLO, VRGHVREFCP, CSP, CSN, LVGL, C61P, C61N, VRGH, VREF, GOUT.Remove: VDDIMSSIM. VDDELUpdate: MVDDL,VGL,VGH, Test pinsPage23, update IF tablePage 51 to 66: update SPl, M3=1 setting in figurePage 102, 103, change DSIM, DSiG bit Reg to OXB 100Page 115, 124 Add WrPFD 50h on tablePage201, modified to 480X864 memoryPage202, Remove 320x480Page204, update whole Frame memory tablePage 205, TE map to 480 lines, DOPCTR change to B100hPage207, tvdI TBDPage225, 226, update VDD in figurePage227, Modes to 7Page232, Sout update to Gout0.01Page235, Add chip attachment Detection sectionKevinSWDens2010/03/17Page237, update Gamma StructurePage255, 270, update FOSC, ExamplePage266, update KB CLEDPage272, Add inversion sectionPage273, 274, Power ArchitecturePage275, update DIOPWRVREFCP, VGMP1,VGLOPage276, update C61P/N, LVGL, VGLO, VRGH,VREFCP, DIOPWR,VGMP 1/2VGMNVGSPVGSNPage291, change name to RAMKPPage306 to 312, remove 320x 480 resolution settingPage337, 5400h Cmd add a andg bitPage385, Absolute Max Rating for MV Hv, remove VDDIMPage 386, VDDIM removePage387, Vdev value modifiedPage402, 403, Remove MVDDI in notePage406, Remove 320 X 480, update 360X640 Sout sequencePage 173 to 181, MDDI windowless packetPage377, 379, A1, A8 cmd updatePage387 to 396, VDDI to 3.3VPage362 to 37670h to 7Eh cmd default valuePage28, 29, 30, 40, 41, 42 MPU figure updatePage 12, 274 Block and power architecture update10/28/20118Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510Page 10, remove 36ORGB X 640, Add 480RGBx720Page 11, update GPo[3: 01pdate VGHO, VGLOge 13, update Block DiagramPage 18, update IM, GPO, VSEL, and EXB1TPage 20, update VGLO, LVGLPage 21, update VGLX,VGL REG, Remove CP6 P/NPage 23, update VDD BCPage 24, update ContACT1-4, VSSIDUMPage 25, update iF description tablePage 207, update Address CounterKevinDennis2010/0406Page 235, update Resolution DataPage 252, remove CLED VOLPage 271, remove KB CLED_ VOLPage 277, add 4 dot inversionPage 306, 308, 313, 326 resolution update, remove nHD, add 480X720Page 384, update absolute voltagePage 385, update DC specPage 386, update Note3, Note5Page 405. update resolutionPage 406. update Alignment Mark-Page10,11205,206,234,305307,312,325404, update resolutionPage 13, update Block diagramPage 17-24, update pin description(MDDI not support DSWAPUpdate TEIR, TE_L, DSTB SEL, RESX, VSEL VREF PWR 12C_SDAremove VDD BD, ENDIOVPagB104121ric data type 0x24Page 134, update eotP optionPage 175, update MDDI support typPage 176, 177, update sub frame header, link shut down packetSWDennis2010/05/18Page 179, 180, update skew calibration packet, client capability packetPage 184, update packet type is 20Page 209, 214, update tE off, output is low, tering effect bus triggerPage 241, update gamma to 10 bits settingPage 276, update 3-dots inversionPage 384 update VIH, VIL, VoH,VOLPage 388, update hibernation wake upPage 390, 392 update Note2-Remove pad chapter to application note10/28/20119Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformationNOVATEKPRELIMINARYNT35510Page 14, update block diagram of RGBBPPage 16, update WRX/SCL/2C SCL, sDI/2C SDAPage 19-25, update IM3 pin description, RGBBP(remove 12C SA1)OSC Test description, KBBC to test pinPage 21, update VREF PWr descriptionPage 26, update IM tablePage 42-44, update MPU read scriptionPage 49-52, update SPl+RGB or SPl+MDDI description0.04Page 60, update 12C AddressKevinSWDen201007/27Page 181, 182, update 16 bit SPI pause descriptionPage 187-189, update RGB figurePage 200, update TE waveform in RGB mode 2Page 237, MTP sequencePage 238-258, update one dimming control for LABC CABcremove KBBc function descriptionPage 260, update 0X04 Cmd, remove KBBC CmdPage 262, update 0XA 1,0xA8 CmdRemove all the KBBc related function registerPage11,12,190,191,219,284-287,291,304,376,remove 480RGBX 360Page 15, update MTP PWR application voltagePage 16, update CSX, RDX, DC/X, SDI, SDOPage 18, update DSWAPPage 19, correct typo for IM[3: 0]in MDDI+SCL(falling edge)Page 38&44, update typo for data format in table0.05Page 53, update read data 8-8-8-bit only in SPIKevinDenn2010/10/18Page 183, 184, update note for min porch of RGB interfacePage 232, update MTP sequence and MTP PWR voltagePage 235, 236, remove PWM ENH OE bit(keep x2Page 312, 314, update typo for BCTRL and BLPage 371, 372: update figuresPage 373: update figure, add RGB+l2CPage 374: update figures, IM settingPage 375: update figures, IM settingPage 15, update DVDD typicage 129, update typo in figure of AwERPage 194, update typo for Hsync218 add condition of irregulaoffPage 219, 255, update command name typo of 05h commandPage 228-231, update typo in figuresPage 234, update typo for ALS in figure 5. 22.10.1Page 235, update CLED VOL bit in figure 5. 22.2KevinDennis2010/12/24Page 312, 314, update typo for BCTRL bl bitsPage 316, update typo in flow chartPage 346, update description of parameterPage 355, update maximum rating for VGH, GlxPage 358, 359, update 2 lane description in conditionPage 362, update pin name typo in figure-Page 376, update typo for CRGB condition10/28/201110Version o 8With respect to the information represented in this document, Novatek makes no warranty, expressed or implied, including the warranties of merchantabilityfitness for a particular purpose, non-infringement, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any suchinformation
- 2020-12-05下载
- 积分：1
|
联系客服（QQ：3324461878）
